Ti Si N As A Cu Diffusion Barrier In Microelectronic Metallization
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Ti Si N As A Cu Diffusion Barrier In Microelectronic Metallization
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Author : Warren Franklin McArthur
language : en
Publisher:
Release Date : 1999
Ti Si N As A Cu Diffusion Barrier In Microelectronic Metallization written by Warren Franklin McArthur and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with categories.
Advances In Microelectronics Reviews Vol 1
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Author : Sergey Yurish
language : en
Publisher: Lulu.com
Release Date : 2017-12-24
Advances In Microelectronics Reviews Vol 1 written by Sergey Yurish and has been published by Lulu.com this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-24 with Technology & Engineering categories.
The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.
Materials Reliability In Microelectronics Vii Volume 473
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Author : J. Joseph Clement
language : en
Publisher:
Release Date : 1997-10-20
Materials Reliability In Microelectronics Vii Volume 473 written by J. Joseph Clement and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-10-20 with Technology & Engineering categories.
The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.
Frontiers Of Solid State Chemistry Proceedings Of The International Symposium On Solid State Chemistry In China
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Author : Jiesheng Chen
language : en
Publisher: World Scientific
Release Date : 2002-07-25
Frontiers Of Solid State Chemistry Proceedings Of The International Symposium On Solid State Chemistry In China written by Jiesheng Chen and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-07-25 with Science categories.
Solid state chemistry is a multidisciplinary field that deals with the synthesis, structural characterization and properties of various solids, and it has been playing a more and more important role in the design and preparation of advanced materials. This book includes the excellent research results recently obtained by a wide spectrum of solid state chemists both from China and from abroad. Among the distinguished contributors are C N R Rao, M Greenblatt and Y T Qian, to name a few. A variety of subjects representing the frontiers of solid state chemistry — which are categorized into solids with electrical, optical and magnetic properties; porous solids and catalysts; hybrid inorganic-organic solids; solid nanomaterials; and new synthetic methods and theory — are presented. This book will benefit readers who are interested in the chemistry and physics of solids, as well as materials scientists and engineers.The proceedings have been selected for coverage in:• Chemistry Citation IndexTM• Index to Scientific & Technical Proceedings (ISTP CDROM version / ISI Proceedings)
Materials Reliability In Microelectronics V Volume 391
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Author : Anthony S. Oates
language : en
Publisher:
Release Date : 1995-10-24
Materials Reliability In Microelectronics V Volume 391 written by Anthony S. Oates and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-10-24 with Technology & Engineering categories.
This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.
Interfacial Compatibility In Microelectronics
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Author : Tomi Laurila
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-01-13
Interfacial Compatibility In Microelectronics written by Tomi Laurila and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-13 with Technology & Engineering categories.
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Silicon Nitride Silicon Dioxide And Emerging Dielectrics 10
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Author : R. Ekwal Sah
language : en
Publisher: The Electrochemical Society
Release Date : 2009-05
Silicon Nitride Silicon Dioxide And Emerging Dielectrics 10 written by R. Ekwal Sah and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-05 with Science categories.
The issue of ECS Transactions contains papers presented at the Tenth International Symposium on Silicon Nitride, Silicon Dioxide, and Alternate Emerging Dielectrics held in San Francisco on May 24-29, 2009. The papers address a very wide range of fabrication and characterization techniques, and applications of thin dielectric films in microelectronic and optoelectronic devices. More specific topics addressed by the papers include reliability, interface states, gate oxides, passivation, and dielctric breakdown.
Advanced Metallizations In Microelectronics Volume 181
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Author : Avishay Katz
language : en
Publisher:
Release Date : 1990-09-12
Advanced Metallizations In Microelectronics Volume 181 written by Avishay Katz and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-09-12 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Reliability In Microelectronics
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Author :
language : en
Publisher:
Release Date : 1999
Materials Reliability In Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Microelectronics categories.
Chemical Vapor Deposition
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Author : Electrochemical Society. High Temperature Materials Division
language : en
Publisher: The Electrochemical Society
Release Date : 1997
Chemical Vapor Deposition written by Electrochemical Society. High Temperature Materials Division and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.