Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites


Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites
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Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites


Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites
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Author : Christian Gontrand
language : en
Publisher: Bentham Science Publishers
Release Date : 2014-04-21

Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections Noises And Parasites written by Christian Gontrand and has been published by Bentham Science Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-21 with Technology & Engineering categories.


The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels



Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections


Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections
DOWNLOAD
FREE 30 Days

Author : Christian Gontrand
language : en
Publisher:
Release Date : 2014-04-21

Towards A Modeling Synthesis Of Two Or Three Dimensional Circuits Through Substrate Coupling And Interconnections written by Christian Gontrand and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-21 with Technology & Engineering categories.


"The number of transistors in integrated circuits doubles every two years, as stipulated by Moore's law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years - currently advanced to the nanomet"



Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement


Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement
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Author : Yue Ma
language : en
Publisher: CRC Press
Release Date : 2019-03-08

Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement written by Yue Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-08 with Computers categories.


As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.



Analog Devices And Circuits 2


Analog Devices And Circuits 2
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Author : Christian Gontrand
language : en
Publisher: John Wiley & Sons
Release Date : 2024-02-23

Analog Devices And Circuits 2 written by Christian Gontrand and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-02-23 with Technology & Engineering categories.


At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.



Computer Aided Design Of Analog Integrated Circuits And Systems


Computer Aided Design Of Analog Integrated Circuits And Systems
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Author : Rob A. Rutenbar
language : en
Publisher: John Wiley & Sons
Release Date : 2002-05-06

Computer Aided Design Of Analog Integrated Circuits And Systems written by Rob A. Rutenbar and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-05-06 with Technology & Engineering categories.


The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.



Analysis And Solutions For Switching Noise Coupling In Mixed Signal Ics


Analysis And Solutions For Switching Noise Coupling In Mixed Signal Ics
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Author : X. Aragones
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09

Analysis And Solutions For Switching Noise Coupling In Mixed Signal Ics written by X. Aragones and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Technology & Engineering categories.


Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.



Signal Integrity Effects In Custom Ic And Asic Designs


Signal Integrity Effects In Custom Ic And Asic Designs
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Author : Raminderpal Singh
language : en
Publisher: John Wiley & Sons
Release Date : 2001-12-12

Signal Integrity Effects In Custom Ic And Asic Designs written by Raminderpal Singh and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-12-12 with Technology & Engineering categories.


"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication



Substrate Noise Coupling In Rfics


Substrate Noise Coupling In Rfics
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Author : Ahmed Helmy
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-03-23

Substrate Noise Coupling In Rfics written by Ahmed Helmy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-03-23 with Technology & Engineering categories.


The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.



Parasitic Substrate Coupling In High Voltage Integrated Circuits


Parasitic Substrate Coupling In High Voltage Integrated Circuits
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Author : Pietro Buccella
language : en
Publisher: Springer
Release Date : 2018-03-14

Parasitic Substrate Coupling In High Voltage Integrated Circuits written by Pietro Buccella and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-14 with Technology & Engineering categories.


This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.



Advanced Field Solver Techniques For Rc Extraction Of Integrated Circuits


Advanced Field Solver Techniques For Rc Extraction Of Integrated Circuits
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Author : Wenjian Yu
language : en
Publisher: Springer Science & Business
Release Date : 2014-04-21

Advanced Field Solver Techniques For Rc Extraction Of Integrated Circuits written by Wenjian Yu and has been published by Springer Science & Business this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-21 with Technology & Engineering categories.


Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of Computer Science and Technology at Tsinghua University in China; Dr. Xiren Wang is a R&D Engineer at Cadence Design Systems in the USA.