Transient Liquid Phase Bonding
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Transient Liquid Phase Bonding
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Author : David J. Fisher
language : en
Publisher: Materials Research Forum LLC
Release Date : 2019-02-16
Transient Liquid Phase Bonding written by David J. Fisher and has been published by Materials Research Forum LLC this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-16 with Technology & Engineering categories.
The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. The TLPB process and its specific applications are presented in great detail: Self-Bonding of Pure Materials; Bonding Different Pure Materials; Self-Bonding of Composites; Self-Bonding of Simple Alloys; Self-Bonding of Complex Alloys; Bonding Same-Base Alloys; Bonding Different-Base Alloys; Bonding Ceramics to Ceramics; Bonding Ceramics to Metals. The book references 483 original resources and includes their direct web link for in-depth reading.
Evaluation Of The Transient Liquid Phase Tlp Bonding Process For Ti3al Based Honeycomb Core Sandwich Structure
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Author : National Aeronautics and Space Administration (NASA)
language : en
Publisher: Createspace Independent Publishing Platform
Release Date : 2018-07-03
Evaluation Of The Transient Liquid Phase Tlp Bonding Process For Ti3al Based Honeycomb Core Sandwich Structure written by National Aeronautics and Space Administration (NASA) and has been published by Createspace Independent Publishing Platform this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-03 with categories.
The suitability of using transient liquid phase (TLP) bonding to fabricate honeycomb core sandwich panels with Ti-14Al-21Nb (wt%) titanium aluminide (T3Al) face sheets for high-temperature hypersonic vehicle applications was evaluated. Three titanium alloy honeycomb cores and one Ti3Al alloy honeycomb core were investigated. Edgewise compression (EWC) and flatwise tension (FWT) tests on honeycomb core sandwich specimens and tensile tests of the face sheet material were conducted at temperatures ranging from room temperature to 1500 F. EWC tests indicated that the honeycomb cores and diffusion bonded joints were able to stabilize the face sheets up to and beyond the face sheet compressive yield strength for all temperatures investigated. The specimens with the T3Al honeycomb core produced the highest FWT strengths at temperatures above 1000 F. Tensile tests indicated that TLP processing conditions resulted in decreases in ductility of the Ti-14Al-21Nb face sheets. Microstructural examination showed that the side of the face sheets to which the filler metals had been applied was transformed from equiaxed alpha2 grains to coarse plates of alpha2 with intergranular Beta. Fractographic examination of the tensile specimens showed that this transformed region was dominated by brittle fracture. Bird, R. Keith and Hoffman, Eric K. Langley Research Center RTOP 522-12-11-01...
Harsh Environment Electronics
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Author : Ahmed Sharif
language : en
Publisher: John Wiley & Sons
Release Date : 2019-08-05
Harsh Environment Electronics written by Ahmed Sharif and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-05 with Technology & Engineering categories.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Joining Of Titanium
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Author : Robert Edward Monroe
language : en
Publisher:
Release Date : 1967
Joining Of Titanium written by Robert Edward Monroe and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1967 with Adhesives categories.
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
Diffusion Bonding 2
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Author : D.J. Stephenson
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Diffusion Bonding 2 written by D.J. Stephenson and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Die Attach Materials For High Temperature Applications In Microelectronics Packaging
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Author : Kim S. Siow
language : en
Publisher: Springer
Release Date : 2019-01-29
Die Attach Materials For High Temperature Applications In Microelectronics Packaging written by Kim S. Siow and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-29 with Technology & Engineering categories.
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Transient Liquid Phase Bonding
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Author : David J. Fisher
language : en
Publisher: Materials Research Forum LLC
Release Date : 2019-02-16
Transient Liquid Phase Bonding written by David J. Fisher and has been published by Materials Research Forum LLC this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-16 with Technology & Engineering categories.
The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. The TLPB process and its specific applications are presented in great detail: Self-Bonding of Pure Materials; Bonding Different Pure Materials; Self-Bonding of Composites; Self-Bonding of Simple Alloys; Self-Bonding of Complex Alloys; Bonding Same-Base Alloys; Bonding Different-Base Alloys; Bonding Ceramics to Ceramics; Bonding Ceramics to Metals. The book references 483 original resources and includes their direct web link for in-depth reading.
Electronic Packaging Interconnect Technology
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Author : Kazuhiro Nogita
language : en
Publisher: Trans Tech Publications Ltd
Release Date : 2018-04-13
Electronic Packaging Interconnect Technology written by Kazuhiro Nogita and has been published by Trans Tech Publications Ltd this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-13 with Technology & Engineering categories.
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
Lead Free Soldering Process Development And Reliability
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Author : Jasbir Bath
language : en
Publisher: John Wiley & Sons
Release Date : 2020-06-12
Lead Free Soldering Process Development And Reliability written by Jasbir Bath and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-12 with Technology & Engineering categories.
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Fundamentals Of Electrochemical Deposition
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Author : Milan Paunovic
language : en
Publisher: John Wiley & Sons
Release Date : 2006-08-11
Fundamentals Of Electrochemical Deposition written by Milan Paunovic and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-08-11 with Science categories.
Excellent teaching and resource material . . . it is concise, coherently structured, and easy to read . . . highly recommended for students, engineers, and researchers in all related fields." -Corrosion on the First Edition of Fundamentals of Electrochemical Deposition From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition plays a crucial role in an array of key industries. Fundamentals of Electrochemical Deposition, Second Edition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. The most authoritative introduction to the field so far, the book presents detailed coverage of the full range of electrochemical deposition processes and technologies, including: * Metal-solution interphase * Charge transfer across an interphase * Formation of an equilibrium electrode potential * Nucleation and growth of thin films * Kinetics and mechanisms of electrodeposition * Electroless deposition * In situ characterization of deposition processes * Structure and properties of deposits * Multilayered and composite thin films * Interdiffusion in thin film * Applications in the semiconductor industry and the field of medicine This new edition updates the prior edition to address the new developments in the science and its applications, with new chapters on innovative applications of electrochemical deposition in semiconductor technology, magnetism and microelectronics, and medical instrumentation. Added coverage includes such topics as binding energy, nanoclusters, atomic force, and scanning tunneling microscopy.Example problems at the end of chapters and other features clarify and improve understanding of the material. Written by an author team with extensive experience in both industry and academe, this reference and text provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology.