Wireless Interface Technologies For 3d Ic And Module Integration
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Wireless Interface Technologies For 3d Ic And Module Integration
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Author : Tadahiro Kuroda
language : en
Publisher: Cambridge University Press
Release Date : 2021-09-30
Wireless Interface Technologies For 3d Ic And Module Integration written by Tadahiro Kuroda and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-30 with Technology & Engineering categories.
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Wireless Interface Technologies For 3d Ic And Module Integration
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Author : Tadahiro Kuroda
language : en
Publisher:
Release Date : 2021-09
Wireless Interface Technologies For 3d Ic And Module Integration written by Tadahiro Kuroda and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09 with categories.
"Synthesising 15 years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design"--
Handbook Of Wafer Bonding
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Author : Peter Ramm
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-13
Handbook Of Wafer Bonding written by Peter Ramm and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-13 with Technology & Engineering categories.
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Selected Topics In Biomedical Circuits And Systems
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Author : Minkyu Je
language : en
Publisher: CRC Press
Release Date : 2022-09-01
Selected Topics In Biomedical Circuits And Systems written by Minkyu Je and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-01 with Science categories.
Integrated circuits and microsystems play a vital role in a variety of biomedical applications including life-saving/changing miniature medical devices, surgical procedures with less invasiveness and morbidity, low-cost preventive healthcare solutions for daily life, solutions for effective chronic disease management, point-of-care diagnosis for early disease detection, high-throughput bio sequencing and drug screening and groundbreaking brain-machine interfaces based on a deep understanding of human intelligence. In response to such strong demands for biomedical circuits and systems, a considerable amount of effort has been devoted to the research and development in this area, both by industry and academia, over recent years. This book, which belongs to the “Tutorials in Circuits and Systems” series, provides readers with an overview of new developments in the field of biomedical circuits and systems. It covers basic information about system-level and circuit-level requirements, operation principles, key factors of considerations, and design/implementation techniques, as well as recent advances in integrated circuits and microsystems for emerging biomedical applications. Technical topics covered in this book include: Biomedical Microsystem Integration; Biomedical Sensor Interface Circuits; Neural Stimulation Circuits; Wireless Power Transfer Circuits for Biomedical Microsystems; Artificial Intelligence Processors for Biomedical Circuits and Systems; Neuro-Inspired Computing and Neuromorphic Processors for Biomedical Circuits and Systems. This book is ideal for personnel in medical devices and biomedical engineering industries as well as academic staff and postgraduate/research students in biomedical circuits and systems.
Microsystem Based On Sip Technology
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Author : Suny Li
language : en
Publisher: Springer Nature
Release Date : 2022-05-28
Microsystem Based On Sip Technology written by Suny Li and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-28 with Technology & Engineering categories.
This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Science Abstracts
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Author :
language : en
Publisher:
Release Date : 1995
Science Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Electrical engineering categories.
Nems Mems Technology And Devices Icmat2011
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Author : Lynn Khine
language : en
Publisher: Trans Tech Publications Ltd
Release Date : 2011-05-31
Nems Mems Technology And Devices Icmat2011 written by Lynn Khine and has been published by Trans Tech Publications Ltd this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-31 with Technology & Engineering categories.
Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies (ICMAT 2011), Symposium G: NEMS/MEMS and microTAS, 26 June to 1 July 2011, Suntec, Singapore
F S Index United States Annual
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Author :
language : en
Publisher:
Release Date : 2007
F S Index United States Annual written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Commercial products categories.
System On Package
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Author : Rao Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2007-07-22
System On Package written by Rao Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-07-22 with Technology & Engineering categories.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Microwave Journal
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Author :
language : en
Publisher:
Release Date : 2004
Microwave Journal written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Microwaves categories.