2011 International Symposium On Advanced Packaging Materials Apm
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2011 International Symposium On Advanced Packaging Materials Apm
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Author :
language : en
Publisher:
Release Date : 2011
2011 International Symposium On Advanced Packaging Materials Apm written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Electronic packaging categories.
2011 International Symposium On Advanced Packaging Materials Apm 2011
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Author : Yixiong Huang
language : en
Publisher:
Release Date : 2011
2011 International Symposium On Advanced Packaging Materials Apm 2011 written by Yixiong Huang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
2011 International Symposium On Advanced Packaging Materials
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Author : Components, Packaging & Manufacturing Technology Society
language : en
Publisher:
Release Date : 2011-11
2011 International Symposium On Advanced Packaging Materials written by Components, Packaging & Manufacturing Technology Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11 with categories.
2013 Ieee 15th International Symposium And Exhibition On Advanced Packaging Materials Apm
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Author : IEEE Electrical Insulation Society Staff
language : en
Publisher:
Release Date : 2013-02-27
2013 Ieee 15th International Symposium And Exhibition On Advanced Packaging Materials Apm written by IEEE Electrical Insulation Society Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-02-27 with Technology & Engineering categories.
2007 12th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces
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Author : Components, Packaging, and Manufacturing Technology Society
language : en
Publisher:
Release Date : 2007
2007 12th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces written by Components, Packaging, and Manufacturing Technology Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Electronic packaging categories.
Apm Microtech
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Author :
language : en
Publisher:
Release Date : 2010
Apm Microtech written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Electronic packaging categories.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
International Symposium On Advanced Packaging Materials
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Author :
language : en
Publisher:
Release Date : 2005
International Symposium On Advanced Packaging Materials written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Electronic packaging categories.
Reliability And Failure Analysis Of High Power Led Packaging
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Author : Cher Ming Tan
language : en
Publisher: Woodhead Publishing
Release Date : 2022-09-24
Reliability And Failure Analysis Of High Power Led Packaging written by Cher Ming Tan and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-24 with Technology & Engineering categories.
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Optical Interconnects For Data Centers
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Author : Tolga Tekin
language : en
Publisher: Woodhead Publishing
Release Date : 2016-11-01
Optical Interconnects For Data Centers written by Tolga Tekin and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-01 with Computers categories.
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic