2011 International Symposium On Advanced Packaging Materials Apm 2011
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2011 International Symposium On Advanced Packaging Materials Apm
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Author :
language : en
Publisher:
Release Date : 2011
2011 International Symposium On Advanced Packaging Materials Apm written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Electronic packaging categories.
2011 International Symposium On Advanced Packaging Materials Apm 2011
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Author : Yixiong Huang
language : en
Publisher:
Release Date : 2011
2011 International Symposium On Advanced Packaging Materials Apm 2011 written by Yixiong Huang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
2011 International Symposium On Advanced Packaging Materials
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Author : Components, Packaging & Manufacturing Technology Society
language : en
Publisher:
Release Date : 2011-11
2011 International Symposium On Advanced Packaging Materials written by Components, Packaging & Manufacturing Technology Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11 with categories.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Optical Interconnects For Data Centers
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Author : Tolga Tekin
language : en
Publisher: Woodhead Publishing
Release Date : 2016-11-01
Optical Interconnects For Data Centers written by Tolga Tekin and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-01 with Computers categories.
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic
Reliability And Failure Analysis Of High Power Led Packaging
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Author : Cher Ming Tan
language : en
Publisher: Woodhead Publishing
Release Date : 2022-09-24
Reliability And Failure Analysis Of High Power Led Packaging written by Cher Ming Tan and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-24 with Technology & Engineering categories.
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
2013 Ieee 15th International Symposium And Exhibition On Advanced Packaging Materials Apm
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Author : IEEE Electrical Insulation Society Staff
language : en
Publisher:
Release Date : 2013-02-27
2013 Ieee 15th International Symposium And Exhibition On Advanced Packaging Materials Apm written by IEEE Electrical Insulation Society Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-02-27 with Technology & Engineering categories.
Applied Mechanics Of Polymers
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Author : George Youssef
language : en
Publisher: Elsevier
Release Date : 2021-12-02
Applied Mechanics Of Polymers written by George Youssef and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-02 with Technology & Engineering categories.
Applied Mechanics of Polymers: Properties, Processing, and Behavior provides readers with an overview of the properties, mechanical behaviors and modeling techniques for accurately predicting the behaviors of polymeric materials. The book starts with an introduction to polymers, covering their history, chemistry, physics, and various types and applications. In addition, it covers the general properties of polymers and the common processing and manufacturing processes involved with them. Subsequent chapters delve into specific mechanical behaviors of polymers such as linear elasticity, hyperelasticity, creep, viscoelasticity, failure, and fracture. The book concludes with chapters discussing electroactive polymers, hydrogels, and the mechanical characterization of polymers. This is a useful reference text that will benefit graduate students, postdocs, researchers, and engineers in the mechanics of materials, polymer science, mechanical engineering and material science. Additional resources related to the book can be found at polymersmechanics.com. Provides examples of real-world applications that demonstrate the use of models in designing polymer-based components Includes access to a companion site from where readers can download FEA and MATLAB code, FEA simulation files, videos and other supplemental material Features end-of-chapter summaries with design and analysis guidelines, practice problem sets based on real-life situations, and both analytical and computational examples to bridge academic and industrial applications
Recent Progress In Lead Free Solder Technology
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Author : Mohd Arif Anuar Mohd Salleh
language : en
Publisher: Springer Nature
Release Date : 2022-03-01
Recent Progress In Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-03-01 with Technology & Engineering categories.
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Adhesion In Microelectronics
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Author : K. L. Mittal
language : en
Publisher: John Wiley & Sons
Release Date : 2014-08-25
Adhesion In Microelectronics written by K. L. Mittal and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings