2013 Ieee International Symposium On Advanced Packaging Materials Apm 2013


2013 Ieee International Symposium On Advanced Packaging Materials Apm 2013
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2013 Ieee International Symposium On Advanced Packaging Materials Apm 2013


2013 Ieee International Symposium On Advanced Packaging Materials Apm 2013
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Author :
language : en
Publisher:
Release Date : 2013

2013 Ieee International Symposium On Advanced Packaging Materials Apm 2013 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with categories.




Optical Interconnects For Data Centers


Optical Interconnects For Data Centers
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Author : Tolga Tekin
language : en
Publisher: Woodhead Publishing
Release Date : 2016-11-01

Optical Interconnects For Data Centers written by Tolga Tekin and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-01 with Computers categories.


Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic



Modelling Simulation And Control Of Thermal Energy Systems


Modelling Simulation And Control Of Thermal Energy Systems
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Author : Kwang Y. Lee
language : en
Publisher: MDPI
Release Date : 2020-11-03

Modelling Simulation And Control Of Thermal Energy Systems written by Kwang Y. Lee and has been published by MDPI this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-11-03 with Technology & Engineering categories.


Faced with an ever-growing resource scarcity and environmental regulations, the last 30 years have witnessed the rapid development of various renewable power sources, such as wind, tidal, and solar power generation. The variable and uncertain nature of these resources is well-known, while the utilization of power electronic converters presents new challenges for the stability of the power grid. Consequently, various control and operational strategies have been proposed and implemented by the industry and research community, with a growing requirement for flexibility and load regulation placed on conventional thermal power generation. Against this background, the modelling and control of conventional thermal engines, such as those based on diesel and gasoline, are experiencing serious obstacles when facing increasing environmental concerns. Efficient control that can fulfill the requirements of high efficiency, low pollution, and long durability is an emerging requirement. The modelling, simulation, and control of thermal energy systems are key to providing innovative and effective solutions. Through applying detailed dynamic modelling, a thorough understanding of the thermal conversion mechanism(s) can be achieved, based on which advanced control strategies can be designed to improve the performance of the thermal energy system, both in economic and environmental terms. Simulation studies and test beds are also of great significance for these research activities prior to proceeding to field tests. This Special Issue will contribute a practical and comprehensive forum for exchanging novel research ideas or empirical practices that bridge the modelling, simulation, and control of thermal energy systems. Papers that analyze particular aspects of thermal energy systems, involving, for example, conventional power plants, innovative thermal power generation, various thermal engines, thermal energy storage, and fundamental heat transfer management, on the basis of one or more of the following topics, are invited in this Special Issue: • Power plant modelling, simulation, and control; • Thermal engines; • Thermal energy control in building energy systems; • Combined heat and power (CHP) generation; • Thermal energy storage systems; • Improving thermal comfort technologies; • Optimization of complex thermal systems; • Modelling and control of thermal networks; • Thermal management of fuel cell systems; • Thermal control of solar utilization; • Heat pump control; • Heat exchanger control.



Semiconductor Nanocrystals And Metal Nanoparticles


Semiconductor Nanocrystals And Metal Nanoparticles
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Author : Tupei Chen
language : en
Publisher: CRC Press
Release Date : 2016-10-14

Semiconductor Nanocrystals And Metal Nanoparticles written by Tupei Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-10-14 with Technology & Engineering categories.


Semiconductor nanocrystals and metal nanoparticles are the building blocks of the next generation of electronic, optoelectronic, and photonic devices. Covering this rapidly developing and interdisciplinary field, the book examines in detail the physical properties and device applications of semiconductor nanocrystals and metal nanoparticles. It begins with a review of the synthesis and characterization of various semiconductor nanocrystals and metal nanoparticles and goes on to discuss in detail their optical, light emission, and electrical properties. It then illustrates some exciting applications of nanoelectronic devices (memristors and single-electron devices) and optoelectronic devices (UV detectors, quantum dot lasers, and solar cells), as well as other applications (gas sensors and metallic nanopastes for power electronics packaging). Focuses on a new class of materials that exhibit fascinating physical properties and have many exciting device applications. Presents an overview of synthesis strategies and characterization techniques for various semiconductor nanocrystal and metal nanoparticles. Examines in detail the optical/optoelectronic properties, light emission properties, and electrical properties of semiconductor nanocrystals and metal nanoparticles. Reviews applications in nanoelectronic devices, optoelectronic devices, and photonic devices.



2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps


2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2013-12-12

2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-12 with categories.


The EDAPS 2013 is the premier symposium in Asian area to discuss IC design, SiP SoP packaging, EMI EMC, and EDA tools for advanced 3 D IC and packaging design



2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps 2013


2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps 2013
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Author :
language : en
Publisher:
Release Date : 2013

2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps 2013 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with categories.




2011 International Symposium On Advanced Packaging Materials Apm


2011 International Symposium On Advanced Packaging Materials Apm
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Author :
language : en
Publisher:
Release Date : 2011

2011 International Symposium On Advanced Packaging Materials Apm written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Electronic packaging categories.




2011 International Symposium On Advanced Packaging Materials Apm 2011


2011 International Symposium On Advanced Packaging Materials Apm 2011
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Author : Yixiong Huang
language : en
Publisher:
Release Date : 2011

2011 International Symposium On Advanced Packaging Materials Apm 2011 written by Yixiong Huang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.




2007 12th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces


2007 12th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces
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Author : Components, Packaging, and Manufacturing Technology Society
language : en
Publisher:
Release Date : 2007

2007 12th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces written by Components, Packaging, and Manufacturing Technology Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Electronic packaging categories.




Nanopackaging


Nanopackaging
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Author : James E. Morris
language : en
Publisher: Springer
Release Date : 2018-09-22

Nanopackaging written by James E. Morris and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-22 with Technology & Engineering categories.


This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.