A Multilevel Planar Interconnect Technology Utilizing The Selective Deposition Of Tungsten
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A Multilevel Planar Interconnect Technology Utilizing The Selective Deposition Of Tungsten
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Author : David Charles Thomas
language : en
Publisher:
Release Date : 1990
A Multilevel Planar Interconnect Technology Utilizing The Selective Deposition Of Tungsten written by David Charles Thomas and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Integrated circuits categories.
Integrated Circuit Fabrication
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Author : Shubham Kumar
language : en
Publisher: CRC Press
Release Date : 2021-04-28
Integrated Circuit Fabrication written by Shubham Kumar and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-04-28 with Technology & Engineering categories.
This book covers theoretical and practical aspects of all major steps in the fabrication sequence. This book can be used conveniently in a semester length course on integrated circuit fabrication. This text can also serve as a reference for practicing engineer and scientist in the semiconductor industry. IC Fabrication are ever demanding of technology in rapidly growing industry growth opportunities are numerous. A recent survey shows that integrated circuit currently outnumber humans in UK, USA, India and China. The spectacular advances in the development and application of integrated circuit technology have led to the emergence of microelectronic process engineering as an independent discipline. Integrated circuit fabrication text books typically divide the fabrication sequence into a number of unit processes that are repeated to form the integrated circuit. The effect is to give the book an analysis flavor: a number of loosely related topics each with its own background material. Note: T& F does not sell or distribute the Hardback in India, Pakistan, Nepal, Bhutan, Bangladesh and Sri Lanka.
Multilevel Interconnect Technology
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Author : Gopal K. Rao
language : en
Publisher: McGraw-Hill Companies
Release Date : 1993
Multilevel Interconnect Technology written by Gopal K. Rao and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Computers categories.
The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
The Science And Engineering Of Microelectronic Fabrication
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Author : Stephen A. Campbell
language : en
Publisher: Oxford University Press, USA
Release Date : 1996
The Science And Engineering Of Microelectronic Fabrication written by Stephen A. Campbell and has been published by Oxford University Press, USA this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
The Science and Engineering of Microelectronic Fabrication provides an introduction to microelectronic processing. Geared towards a wide audience, it may be used as a textbook for both first year graduate and upper level undergraduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, nonoptical lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The book also makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest.
Dissertation Abstracts International
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Author :
language : en
Publisher:
Release Date : 1993
Dissertation Abstracts International written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Dissertations, Academic categories.
Proceedings Of The Symposia On Interconnects Contact Metallization And Multilevel Metallization And Reliability For Semiconductor Devices Interconnects And Thin Insulator Materials
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Author : T. O. Herndon
language : en
Publisher:
Release Date : 1993
Proceedings Of The Symposia On Interconnects Contact Metallization And Multilevel Metallization And Reliability For Semiconductor Devices Interconnects And Thin Insulator Materials written by T. O. Herndon and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies
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Author : L. B. Rothman
language : en
Publisher:
Release Date : 1987
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies written by L. B. Rothman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Electronics categories.
Advanced Cmos Process Technology
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Author : J Pimbley
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Advanced Cmos Process Technology written by J Pimbley and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
Advanced CMOS Process Technology is part of the VLSI Electronics Microstructure Science series. The main topic of this book is complementary metal-oxide semiconductor or CMOS technology, which plays a significant part in the electronics systems. The topics covered in this book range from metallization, isolation techniques, reliability, and yield. The volume begins with an introductory chapter that discusses the microelectronics revolution of the 20th century. Then Chapter 2 puts focus on the CMOS devices and circuit background, discussing CMOS capacitors and field effect transistors. Metallization topics and concepts are covered in Chapter 3, while isolation techniques are tackled in Chapter 4. Long-term reliability of CMOS is the topic covered in Chapter 5. Finally, the ability of semiconductor technology to yield circuits is discussed in Chapter 6. The book is particularly addressed to engineers, scientists, and technical managers.
Proceedings International Ieee Vlsi Multilevel Interconnection Conference
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Author :
language : en
Publisher:
Release Date : 1988
Proceedings International Ieee Vlsi Multilevel Interconnection Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Hybrid integrated circuits categories.
Tungsten And Other Advanced Metals For Vlsi Ulsi Applications
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Author :
language : en
Publisher:
Release Date : 1990
Tungsten And Other Advanced Metals For Vlsi Ulsi Applications written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Heat resistant alloys categories.