Advanced Packaging And Manufacturing Technology Based On Adhesion Engineering
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Advanced Packaging And Manufacturing Technology Based On Adhesion Engineering
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Author : Seonho Seok
language : en
Publisher: Springer
Release Date : 2018-04-27
Advanced Packaging And Manufacturing Technology Based On Adhesion Engineering written by Seonho Seok and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-27 with Technology & Engineering categories.
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Adhesive Bonding
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Author : Robert D. Adams
language : en
Publisher: Woodhead Publishing
Release Date : 2021-07-02
Adhesive Bonding written by Robert D. Adams and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-07-02 with Technology & Engineering categories.
Adhesive Bonding: Science, Technology and Applications, Second Edition guides the reader through the fundamentals, mechanical properties and applications of adhesive bonding. This thoroughly revised and expanded new edition reflects the many advances that have occurred in recent years. Sections cover the fundamentals of adhesive bonding, explaining how adhesives and sealants work, and how to assess and treat surfaces, how adhesives perform under stress and the factors affecting fatigue and failure, stress analysis, environmental durability, non-destructive testing, impact behavior, fracture mechanics, fatigue, vibration damping, and applications in construction, automotive, marine, footwear, electrical engineering, aerospace, repair, electronics, biomedicine, and bonding of composites. With its distinguished editor and international team of contributors, this book is an essential resource for industrial engineers, R&D, and scientists working with adhesives and their industrial applications, as well as researchers and advanced students in adhesion, joining, polymer science, materials science and mechanical engineering. - Offers detailed, methodical coverage of the fundamentals, mechanical properties and industrial applications of adhesive bonding - Enables the successful preparation of adhesives for a broad range of important load-bearing applications in areas such as automotive and aerospace, construction, electronics and biomedicine - Covers the latest advances in adhesive bonding, including improved repair techniques for metallic and composite structures, cohesive zone modeling, and disassembly and recycling
Introduction To Microelectronics Advanced Packaging Assurance
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Author : Navid Asadizanjani
language : en
Publisher: Springer Nature
Release Date : 2025-04-22
Introduction To Microelectronics Advanced Packaging Assurance written by Navid Asadizanjani and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-04-22 with Technology & Engineering categories.
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
Polymers In Organic Electronics
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Author : Sulaiman Khalifeh
language : en
Publisher: Elsevier
Release Date : 2020-04-01
Polymers In Organic Electronics written by Sulaiman Khalifeh and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-04-01 with Technology & Engineering categories.
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Transducers 01 Eurosensors Xv
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Author : Ernst Obermeier
language : en
Publisher: Springer
Release Date : 2016-05-12
Transducers 01 Eurosensors Xv written by Ernst Obermeier and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-05-12 with Technology & Engineering categories.
The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.
Advanced Adhesives In Electronics
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Author : M O Alam
language : en
Publisher: Elsevier
Release Date : 2011-05-25
Advanced Adhesives In Electronics written by M O Alam and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-25 with Technology & Engineering categories.
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die Attach And Wafer Bonding Technology A 4 Volume Set
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Author :
language : en
Publisher: World Scientific
Release Date : 2019-08-27
Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die Attach And Wafer Bonding Technology A 4 Volume Set written by and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-27 with Technology & Engineering categories.
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Adhesion In Microelectronics
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Author : K. L. Mittal
language : en
Publisher: John Wiley & Sons
Release Date : 2014-08-25
Adhesion In Microelectronics written by K. L. Mittal and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Handbook Of Performability Engineering
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Author : Krishna B. Misra
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-08-24
Handbook Of Performability Engineering written by Krishna B. Misra and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-08-24 with Technology & Engineering categories.
Dependability and cost effectiveness are primarily seen as instruments for conducting international trade in the free market environment. These factors cannot be considered in isolation of each other. This handbook considers all aspects of performability engineering. The book provides a holistic view of the entire life cycle of activities of the product, along with the associated cost of environmental preservation at each stage, while maximizing the performance.
Advanced Packaging
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Author :
language : en
Publisher:
Release Date : 2008-01
Advanced Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-01 with categories.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.