Advanced Routing Of Electronic Modules
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Advanced Routing Of Electronic Modules
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 1995-10-23
Advanced Routing Of Electronic Modules written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-10-23 with Technology & Engineering categories.
The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.
Advanced Routing Of Electronic Modules
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2024-11-01
Advanced Routing Of Electronic Modules written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-11-01 with Technology & Engineering categories.
The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.
Advanced Router Architectures
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Author : Axel K. Kloth
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Advanced Router Architectures written by Axel K. Kloth and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Computers categories.
Routers, switches, and transmission equipment form the backbone of the Internet, yet many users and service technicians do not understand how these nodes really work. Advanced Router Architectures addresses how components of advanced routers work together and how they are integrated with each other. This book provides the background behind why these building blocks perform certain functions, and how the function is implemented in general use. It offers an introduction to the subject matter that is intended to trigger deeper interest from the reader. The book explains, for example, why traffic management may be important in certain applications, what the traffic manager does, and how it connects to the rest of the router. The author also examines the implications of the introduction or omission of a traffic manager into an advanced router. The text offers a similar analysis for other router topics such as QOS and policy enforcement, security processing (including DoS/DDoS), and more. This book covers which mandatory and which optional building blocks can be found in an advanced router, and how these building blocks operate in conjunction to ensure that the Internet performs as expected.
Optimal Interconnection Trees In The Plane
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Author : Marcus Brazil
language : en
Publisher: Springer
Release Date : 2015-04-13
Optimal Interconnection Trees In The Plane written by Marcus Brazil and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-04-13 with Mathematics categories.
This book explores fundamental aspects of geometric network optimisation with applications to a variety of real world problems. It presents, for the first time in the literature, a cohesive mathematical framework within which the properties of such optimal interconnection networks can be understood across a wide range of metrics and cost functions. The book makes use of this mathematical theory to develop efficient algorithms for constructing such networks, with an emphasis on exact solutions. Marcus Brazil and Martin Zachariasen focus principally on the geometric structure of optimal interconnection networks, also known as Steiner trees, in the plane. They show readers how an understanding of this structure can lead to practical exact algorithms for constructing such trees. The book also details numerous breakthroughs in this area over the past 20 years, features clearly written proofs, and is supported by 135 colour and 15 black and white figures. It will help graduate students, working mathematicians, engineers and computer scientists to understand the principles required for designing interconnection networks in the plane that are as cost efficient as possible.
Guidebook For Managing Silicon Chip Reliability
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2017-11-22
Guidebook For Managing Silicon Chip Reliability written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-11-22 with Technology & Engineering categories.
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Introduction To Physical Integration And Tapeout In Vlsis
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Author : Patrick Lee
language : en
Publisher: Lulu.com
Release Date : 2010-04-27
Introduction To Physical Integration And Tapeout In Vlsis written by Patrick Lee and has been published by Lulu.com this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-04-27 with Technology & Engineering categories.
This book covers issues and solutions in the physical integration and tapeout management for VLSI design. Chapter 1 gives the overview. Chapter 2 shows detailed techniques for physical design. Chapter 3 provides CAD flows. Chapter 4 discusses on-chip interconnects. A glossary of keywords is provided at the end.
Influence Of Temperature On Microelectronics And System Reliability
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Author : Pradeep Lall
language : en
Publisher: CRC Press
Release Date : 2020-07-09
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-09 with Technology & Engineering categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
High Temperature Electronics
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Author : F. Patrick McCluskey
language : en
Publisher: CRC Press
Release Date : 2018-05-04
High Temperature Electronics written by F. Patrick McCluskey and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-04 with Technology & Engineering categories.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Handbook Of Thick And Thin Film Hybrid Microelectronics
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Author : Tapan Gupta
language : en
Publisher: Wiley-Interscience
Release Date : 2003-04-17
Handbook Of Thick And Thin Film Hybrid Microelectronics written by Tapan Gupta and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-04-17 with Technology & Engineering categories.
"This handbook is meant to be an introduction to the design, layout , and fabrication of hybrid microelectronic circuits for electrical engineering students as well as a reference book for practitioners in this discipline. ... The text has grown out of notes prepared for a one-semester graduate level course in the Electrical Engineering Department of Tufts university." -- preface.
Adaptive Iir Filtering In Signal Processing And Control
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Author : Phillip Regalia
language : en
Publisher: Routledge
Release Date : 2018-04-27
Adaptive Iir Filtering In Signal Processing And Control written by Phillip Regalia and has been published by Routledge this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-27 with Technology & Engineering categories.
Integrates rational approximation with adaptive filtering, providing viable, numerically reliable procedures for creating adaptive infinite impulse response (IIR) filters. The choice of filter structure to adapt, algorithm design and the approximation properties for each type of algorithm are also addressed. This work recasts the theory of adaptive IIR filters by concentrating on recursive lattice filters, freeing systems from the need for direct-form filters.;A solutions manual is available for instructors only. College or university bookstores may order five or more copies at a special student price which is available upon request.