Characterization And Modeling Of Soi Rf Integrated Components
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Characterization And Modeling Of Soi Rf Integrated Components
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Author : Morin Dehan
language : en
Publisher: Presses univ. de Louvain
Release Date : 2003
Characterization And Modeling Of Soi Rf Integrated Components written by Morin Dehan and has been published by Presses univ. de Louvain this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Science categories.
The boom of mobile communications leads to an increasing request of low cost and low power mixed mode integrated circuits. Maturity of SOI technology, and recent progresses of MOSFET's microwave performances, explain the success of silicon as compared to III-V technologies for low-cost multigigahertz analog applications. The design of efficient circuits requires accurate, wide-band models for both active and passive elements. Within this frame, passive and active components fabricated in SOI technologies have been studied. Various topologies of integrated transmission lines, like Coplanar Waveguides or thin film microstrip lines, have been analyzed. Also, a new physical model of integrated inductors has been developed. This model, based on a coupled line analysis of square spiral inductors, is scalable and independent of the technology used. Inductors with various spacing between strips, conductor widths, or number of turns can be simulated on different multi-layered substrates. Each layer that composes the substrate is defined using its electrical properties (permittivity, permeability, conductivity). The performances of integrated sub-micron MOSFETs are analyzed. New alternative structures of transistor (the Graded Channel MOSFET and the Dynamic Threshold MOSFET) are proposed to increase the performances of a CMOS technology for for analog, low power, low voltage, and microwave applications. They are studied from Low to High frequency. The graded channel MOSFET is an asymmetric doped channel MOSFET's which bring solutions for the problems of premature drain break-down, hot carrier effects, and threshold voltage (Vth) roll-off issues in deep submicrometer devices. The GCMOS processing is fully compatible with the conventional SOI MOSFET process flow, with no additional steps needed. The dynamic threshold voltage MOS is a MOS transistor for which the gate and the body channel are tied together. All DTMOS electrical properties can be deduced from standard MOS theory by introducing Vbs = Vgs. The main advantage of DTMOS over conventional MOS is its higher drive current at low bias conditions. To keep the body to source current as low as possible, the body bias voltage must be kept lower than 0.7 V. It seems obvious that the DTMOS transistor is an attractive component for low voltage applications.
Cmos Rf Modeling Characterization And Applications
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Author : M Jamal Deen
language : en
Publisher: World Scientific
Release Date : 2002-04-10
Cmos Rf Modeling Characterization And Applications written by M Jamal Deen and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-04-10 with Technology & Engineering categories.
CMOS technology has now reached a state of evolution, in terms of both frequency and noise, where it is becoming a serious contender for radio frequency (RF) applications in the GHz range. Cutoff frequencies of about 50 GHz have been reported for 0.18 µm CMOS technology, and are expected to reach about 100 GHz when the feature size shrinks to 100 nm within a few years. This translates into CMOS circuit operating frequencies well into the GHz range, which covers the frequency range of many of today's popular wireless products, such as cell phones, GPS (Global Positioning System) and Bluetooth. Of course, the great interest in RF CMOS comes from the obvious advantages of CMOS technology in terms of production cost, high-level integration, and the ability to combine digital, analog and RF circuits on the same chip. This book discusses many of the challenges facing the CMOS RF circuit designer in terms of device modeling and characterization, which are crucial issues in circuit simulation and design.
On Wafer Microwave Measurements And De Embedding
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Author : Errikos Lourandakis
language : en
Publisher: Artech House
Release Date : 2016-07-31
On Wafer Microwave Measurements And De Embedding written by Errikos Lourandakis and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-07-31 with Technology & Engineering categories.
This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain analysis are covered. This book also explores the basics of vector network analyzers (VNA), two port S-parameter measurement routines, signal flow graphs, network theory, error models and VNA calibrations with the use of calibration standards.
Design Of Cmos Rf Integrated Circuits And Systems
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Author : Kiat Seng Yeo
language : en
Publisher: World Scientific
Release Date : 2010
Design Of Cmos Rf Integrated Circuits And Systems written by Kiat Seng Yeo and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Technology & Engineering categories.
This book provides the most comprehensive and in-depth coverage of the latest circuit design developments in RF CMOS technology. It is a practical and cutting-edge guide, packed with proven circuit techniques and innovative design methodologies for solving challenging problems associated with RF integrated circuits and systems. This invaluable resource features a collection of the finest design practices that may soon drive the system-on-chip revolution. Using this book's state-of-the-art design techniques, one can apply existing technologies in novel ways and to create new circuit designs for the future.
Cmos Rf And Mm Wave Transceivers And Synthesizers
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Author : Bharatha Kumar Thangarasu
language : en
Publisher: CRC Press
Release Date : 2025-10-14
Cmos Rf And Mm Wave Transceivers And Synthesizers written by Bharatha Kumar Thangarasu and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-10-14 with Technology & Engineering categories.
Power consumption has become a critical concern in RF/mm-wave integrated circuit (IC) design thanks to new applications from 5G, mobile computing, artificial intelligence, and the Internet of Things. However, big challenges lie ahead for chip designers when they choose to develop ICs using silicon technology for low-power and high-data-rate applications. This is because silicon technology suffers from undesirable energy dissipation due to its lossy substrate and high resistive wiring loss at GHz frequencies. Nonetheless, silicon remains the most suitable material satisfying the demands of a rapidly growing semiconductor market through low fabrication cost and ease of achieving system-on-chip or system-in-package integration. While long being neglected, low-power RF/mm-wave design has vaulted to the forefront of attention in recent years due to the demand for ultra-low-power transceivers to achieve sustainability. Designing genuinely ubiquitous transceivers for these new applications requires innovations in both system architecture and circuit implementation. This book closes the gap between a typical textbook with theories that are difficult to understand and a design-oriented book that offers little insight into actual theories. It evaluates and discusses different circuit topologies, receiver and transmitter architectures, phase-locked loop performance metrics, phase noise analysis, and sub-system-level designs that have yet to be reported in other books.
Transistor Level Modeling For Analog Rf Ic Design
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Author : Wladyslaw Grabinski
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-07-01
Transistor Level Modeling For Analog Rf Ic Design written by Wladyslaw Grabinski and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-07-01 with Technology & Engineering categories.
Among many great inventions made in the 20th century, electronic circuits, which later evolved into integrated circuits, are probably the biggest, when considering their contribution to human society. Entering the 21st century, the importance of integrated circuits has increased even more. In fact, without the help of integrated circuits, recent high-technology society with the internet, cellular phone, car navigation, digital camera, and robot would never have been realized. Nowadays, integrated circuits are indispensable for almost every activity of our society. One of the critical issues for the fabrication of integrated circuits has been the precise design of the high-speed or high-frequency operation of circuits with huge number of components. It is quite natural to predict the circuit operation by computer calculation, and there have been three waves for this, at 15-year intervals. The ?rst wave came at the beginning of the 1970s when LSIs (Large Scale Integrated circuits) with more than 1000 components had just been int- duced into the market. A mainframe computer was used for the simulation, and each semiconductor company used its own proprietary simulators and device models. However, the capability of the computer and accuracy of the model were far from satisfactory, and there are many cases of the necessity of circuit re-design after evaluation of the ?rst chip. The second wave hit us in the middle of 1980s, when the EWS (Engine- ing Work Station) was introduced for use by designers.
Silicon Analog Components
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Author : Badih El-Kareh
language : en
Publisher: Springer
Release Date : 2019-08-07
Silicon Analog Components written by Badih El-Kareh and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-07 with Technology & Engineering categories.
This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.
Electrical Design Of Through Silicon Via
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Author : Manho Lee
language : en
Publisher: Springer
Release Date : 2014-05-11
Electrical Design Of Through Silicon Via written by Manho Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-05-11 with Technology & Engineering categories.
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Physical Design For 3d Integrated Circuits
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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Industry Standard Fdsoi Compact Model Bsim Img For Ic Design
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Author : Chenming Hu
language : en
Publisher: Woodhead Publishing
Release Date : 2019-05-21
Industry Standard Fdsoi Compact Model Bsim Img For Ic Design written by Chenming Hu and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-21 with Technology & Engineering categories.
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design helps readers develop an understanding of a FDSOI device and its simulation model. It covers the physics and operation of the FDSOI device, explaining not only how FDSOI enables further scaling, but also how it offers unique possibilities in circuits. Following chapters cover the industry standard compact model BSIM-IMG for FDSOI devices. The book addresses core surface-potential calculations and the plethora of real devices and potential effects. Written by the original developers of the industrial standard model, this book is an excellent reference for the new BSIM-IMG compact model for emerging FDSOI technology. The authors include chapters on step-by-step parameters extraction procedure for BSIM-IMG model and rigorous industry grade tests that the BSIM-IMG model has undergone. There is also a chapter on analog and RF circuit design in FDSOI technology using the BSIM-IMG model. - Provides a detailed discussion of the BSIM-IMG model and the industry standard simulation model for FDSOI, all presented by the developers of the model - Explains the complex operation of the FDSOI device and its use of two independent control inputs - Addresses the parameter extraction challenges for those using this model