Component Reliability Under Creep Fatigue Conditions
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Component Reliability Under Creep Fatigue Conditions
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Author : Janos Ginsztler
language : en
Publisher: Springer
Release Date : 2014-05-04
Component Reliability Under Creep Fatigue Conditions written by Janos Ginsztler and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-05-04 with Technology & Engineering categories.
Failure prevention, residual life assessment and life extension of materials in components operating at high temperatures are becoming increasingly important problems in the modern power plant industry. These problems are covered, and industrial examples will be introduced to illustrate the applications of those subjects covered using the results from service records.
Analysis Of Asme Boiler Pressure Vessel And Nuclear Components In The Creep Range
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Author : Maan H. Jawad
language : en
Publisher: John Wiley & Sons
Release Date : 2022-09-14
Analysis Of Asme Boiler Pressure Vessel And Nuclear Components In The Creep Range written by Maan H. Jawad and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-14 with Technology & Engineering categories.
Analysis of ASME Boiler, Pressure Vessel, and Nuclear Components in the Creep Range Second Edition The latest edition of the leading resource on elevated temperature design In the newly revised Second Edition of Analysis of ASME Boiler, Pressure Vessel, and Nuclear Components in the Creep Range, a team of distinguished engineers delivers an authoritative introduction to the principles of design at elevated temperatures. The authors draw on over 50 years of experience, explaining the methodology for accomplishing a safe and economical design for boiler and pressure vessel components operating at high temperatures. The text includes extensive references, offering the reader the opportunity to further their understanding of the subject. In this latest edition, each chapter has been updated and two brand-new chapters added—the first is Creep Analysis Using the Remaining Life Method, and the second is Requirements for Nuclear Components. Numerous examples are included to illustrate the practical application of the presented design and analysis methods. It also offers: A thorough introduction to creep-fatigue analysis of pressure vessel components using the concept of load-controlled and strain-deformation controlled limits An introduction to the creep requirements in API 579/ASME FFS-1 “Remaining Life Method” A summary of creep-fatigue analysis requirements in nuclear components Detailed procedure for designing cylindrical and spherical components of boilers and pressure vessels due to axial and external pressure in the creep regime A section on using finite element analysis to approximate fatigue in structural members in tension and bending Perfect for mechanical engineers and researchers working in mechanical engineering, Analysis of ASME Boiler, Pressure Vessel, and Nuclear Components in the Creep Range will also earn a place in the libraries of graduate students studying mechanical engineering, technical staff in industry, and industry analysts and researchers.
Plasticity And Creep Of Metals
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Author : Andrew Rusinko
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-07-24
Plasticity And Creep Of Metals written by Andrew Rusinko and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-07-24 with Science categories.
This book serves both as a textbook and a scientific work. As a textbook, the work gives a clear, thorough and systematic presentation of the fundamental postulates, theorems and principles and their applications of the classical mathematical theories of plasticity and creep. In addition to the mathematical theories, the physical theory of plasticity, the book presents the Budiansky concept of slip and its modification by M. Leonov. Special attention is given to the analysis of the advantages and shortcomings of the classical theories. In its main part, the book presents the synthetic theory of irreversible deformations, which is based on the mathematical Sanders flow plasticity theory and the physical theory, the Budiansky concept of slip. The main peculiarity of the synthetic theory is that the formulae for both plastic and creep deformation, as well their interrelations, can be derived from the single constitutive equation. Furthermore, the synthetic theory, as physical one, can take into account the real processes that take place in solids at irreversible deformation. This widens considerably the potential of the synthetic theory. In the framework of the synthetic theory such problems as creep delay, the Hazen-Kelly effect, the deformation at the break of the load trajectory, the influence of the rate of loading on the stress-strain diagram, creep at the changes of load, creep at unloading and reversed creep, have been analytically described. In the last chapter, the book shows the solution of some contemporary problems of plasticity and creep: Creep deformation at cyclic abrupt changes of temperature, The influence of irradiation on the plastic and creep deformation, Peculiarities of deformation at the phase transformation of some metals.
Structural Integrity And Reliability In Electronics
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Author : W.J. Plumbridge
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-08
Structural Integrity And Reliability In Electronics written by W.J. Plumbridge and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-08 with Technology & Engineering categories.
Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
Damage Mechanisms And Life Assessment Of High Temperature Components
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Author : Ramaswamy Viswanathan
language : en
Publisher: ASM International
Release Date : 1989
Damage Mechanisms And Life Assessment Of High Temperature Components written by Ramaswamy Viswanathan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Science categories.
Lead Free Solder Interconnect Reliability
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Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005
Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
Comprehensive Structural Integrity
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Author : Ian Milne
language : en
Publisher: Elsevier
Release Date : 2003-07-25
Comprehensive Structural Integrity written by Ian Milne and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-07-25 with Business & Economics categories.
The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encompasses, but is not restricted to: fracture mechanics, fatigue, creep, materials, dynamics, environmental degradation, numerical methods, failure mechanisms and damage mechanics, interfacial fracture and nano-technology, structural analysis, surface behaviour and heart valves. The structures under consideration include: pressure vessels and piping, off-shore structures, gas installations and pipelines, chemical plants, aircraft, railways, bridges, plates and shells, electronic circuits, interfaces, nanotechnology, artificial organs, biomaterial prostheses, cast structures, mining... and more. Case studies will form an integral part of the work.
Reliability Of Materials For Solar Energy Summary And Recommendations
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Author :
language : en
Publisher:
Release Date : 1979
Reliability Of Materials For Solar Energy Summary And Recommendations written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1979 with Materials categories.
Low Cycle Fatigue
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Author : Harvey D. Solomon
language : en
Publisher: ASTM International
Release Date : 1988
Low Cycle Fatigue written by Harvey D. Solomon and has been published by ASTM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.
Solder Joint Reliability
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.