Electromigration In Thin Films And Electronic Devices
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Electromigration In Thin Films And Electronic Devices
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Author : Choong-Un Kim
language : en
Publisher: Elsevier
Release Date : 2011-08-28
Electromigration In Thin Films And Electronic Devices written by Choong-Un Kim and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-08-28 with Technology & Engineering categories.
Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints. With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure
Metal Based Thin Films For Electronics
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Author : Klaus Wetzig
language : en
Publisher: John Wiley & Sons
Release Date : 2006-03-06
Metal Based Thin Films For Electronics written by Klaus Wetzig and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-03-06 with Science categories.
This up-to-date handbook covers the main topics of preparation, characterization and properties of complex metal-based layer systems. The authors -- an outstanding group of researchers -- discuss advanced methods for structure, chemical and electronic state characterization with reference to the properties of thin functional layers, such as metallization and barrier layers for microelectronics, magnetoresistive layers for GMR and TMR, sensor and resistance layers. As such, the book addresses materials specialists in industry, especially in microelectronics, as well as scientists, and can also be recommended for advanced studies in materials science, analytics, surface and solid state science.
Electronic Thin Film Reliability
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Author : King-Ning Tu
language : en
Publisher: Cambridge University Press
Release Date : 2010-11-25
Electronic Thin Film Reliability written by King-Ning Tu and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-25 with Technology & Engineering categories.
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Waste Electrical And Electronic Equipment Weee Handbook
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Author : Vannessa Goodship
language : en
Publisher: Elsevier
Release Date : 2012-08-30
Waste Electrical And Electronic Equipment Weee Handbook written by Vannessa Goodship and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-08-30 with Technology & Engineering categories.
Electrical and electronic waste is a growing problem as volumes are increasing fast. Rapid product innovation and replacement, especially in information and communication technologies (ICT), combined with the migration from analog to digital technologies and to flat-screen televisions and monitors has resulted in some electronic products quickly reaching the end of their life. The EU directive on waste electrical and electronic equipment (WEEE) aims to minimise WEEE by putting organizational and financial responsibility on producers and distributors for collection, treatment, recycling and recovery of WEEE. Therefore all stakeholders need to be well-informed about their WEEE responsibilities and options. While focussing on the EU, this book draws lessons for policy and practice from all over the world. Part one introduces the reader to legislation and initiatives to manage WEEE. Part two discusses technologies for the refurbishment, treatment and recycling of waste electronics. Part three focuses on electronic products that present particular challenges for recyclers. Part four explores sustainable design of electronics and supply chains. Part five discusses national and regional WEEE management schemes and part six looks at corporate WEEE management strategies. With an authoritative collection of chapters from an international team of authors, Waste electrical and electronic equipment (WEEE) handbook is designed to be used as a reference by policy-makers, producers and treatment operators in both the developed and developing world. Draws lessons for waste electrical and electronic equipment (WEEE) policy and practice from around the world Discusses legislation and initiatives to manage WEEE, including global e-waste initiatives, EU legislation relating to electronic waste, and eco-efficiency evaluation of WEEE take-back systems Sections cover technologies for refurbishment, treatment and recycling of waste, sustainable design of electronics and supply chains, national and regional waste management schemes, and corporate WEEE management strategies
Electromigration In Ulsi Interconnections
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Author : Cher Ming Tan
language : en
Publisher: World Scientific
Release Date : 2010
Electromigration In Ulsi Interconnections written by Cher Ming Tan and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Computers categories.
Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed.
Diffusion Phenomena In Thin Films And Microelectronic Materials
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Author : Devendra Gupta
language : en
Publisher: William Andrew
Release Date : 1988
Diffusion Phenomena In Thin Films And Microelectronic Materials written by Devendra Gupta and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Science categories.
A comprehensive review of diffusion phenomena in thin films and microelectronic materials -- theory and technology.
Electromigration And Electronic Device Degradation
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Author : A. Christou
language : en
Publisher: Wiley-Interscience
Release Date : 1994
Electromigration And Electronic Device Degradation written by A. Christou and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Technology & Engineering categories.
Addresses electromigration failure modes in electronics covering both theory and experiments. Reviews silicon and GaAs technologies. Various rate controlling details are summarized including an investigation of temperature dependence. Concludes with a discussion regarding current status and future plans for electromigration resistant advanced metallization systems for VLSI.
Physics Of Thin Films
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Author : Georg Hass
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Physics Of Thin Films written by Georg Hass and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Science categories.
Physics of Thin Films: Advances in Research and Development, Volume 7 is a collection of papers about film growth and structure, optical properties, and semiconducting films. The book covers topics such as diffraction theory; film support and filter fabrication; aging, usage, and cleaning of filters; and properties and applications of III-V compound films. It also discusses topics such as the preparation of use and unbacked metal filters; electromigration in thin films; and the built-up molecular films and their applications. The text is recommended for physicists and engineers involved in thin film physics, especially those who would like to know more about the progresses in the field.
Thin Film Growth
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Author : Zexian Cao
language : en
Publisher: Elsevier
Release Date : 2011-07-18
Thin Film Growth written by Zexian Cao and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-07-18 with Technology & Engineering categories.
Thin film technology is used in many applications such as microelectronics, optics, hard and corrosion resistant coatings and micromechanics, and thin films form a uniquely versatile material base for the development of novel technologies within these industries. Thin film growth provides an important and up-to-date review of the theory and deposition techniques used in the formation of thin films. Part one focuses on the theory of thin film growth, with chapters covering nucleation and growth processes in thin films, phase-field modelling of thin film growth and surface roughness evolution. Part two covers some of the techniques used for thin film growth, including oblique angle deposition, reactive magnetron sputtering and epitaxial growth of graphene films on single crystal metal surfaces. This section also includes chapters on the properties of thin films, covering topics such as substrate plasticity and buckling of thin films, polarity control, nanostructure growth dynamics and network behaviour in thin films. With its distinguished editor and international team of contributors, Thin film growth is an essential reference for engineers in electronics, energy materials and mechanical engineering, as well as those with an academic research interest in the topic. Provides an important and up-to-date review of the theory and deposition techniques used in the formation of thin films Focusses on the theory and modelling of thin film growth, techniques and mechanisms used for thin film growth and properties of thin films An essential reference for engineers in electronics, energy materials and mechanical engineering
Microstructural Science For Thin Film Metallizations In Electronic Applications
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Author : John Sanchez
language : en
Publisher: Minerals, Metals, & Materials Society
Release Date : 1988
Microstructural Science For Thin Film Metallizations In Electronic Applications written by John Sanchez and has been published by Minerals, Metals, & Materials Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.