Electromigration Modeling At Circuit Layout Level
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Electromigration Modeling At Circuit Layout Level
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Author : Cher Ming Tan
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-16
Electromigration Modeling At Circuit Layout Level written by Cher Ming Tan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-16 with Technology & Engineering categories.
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Electromigration Modeling At Circuit Layout Level
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Author : Cher Ming Tan
language : en
Publisher: Springer
Release Date : 2013-03-27
Electromigration Modeling At Circuit Layout Level written by Cher Ming Tan and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-27 with Technology & Engineering categories.
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Electromigration Modeling At Circuit Layout Level
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Author : Cher Ming Tan
language : en
Publisher: Springer
Release Date : 2013-05-04
Electromigration Modeling At Circuit Layout Level written by Cher Ming Tan and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-05-04 with Technology & Engineering categories.
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Fundamentals Of Electromigration Aware Integrated Circuit Design
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Author : JENS. ROTHE LIENIG (SUSANN. THIELE, MATTHIAS.)
language : en
Publisher:
Release Date : 2025-04-19
Fundamentals Of Electromigration Aware Integrated Circuit Design written by JENS. ROTHE LIENIG (SUSANN. THIELE, MATTHIAS.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-04-19 with Computers categories.
Fundamentals Of Electromigration Aware Integrated Circuit Design
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Author : Jens Lienig
language : en
Publisher: Springer Nature
Release Date : 2025-02-25
Fundamentals Of Electromigration Aware Integrated Circuit Design written by Jens Lienig and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-02-25 with Technology & Engineering categories.
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. This second edition has been updated to introduce recent advancements in the understanding of the physical process of electromigration, which gives the reader the knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Design Of 3d Integrated Circuits And Systems
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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03
Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Interconnect Reliability In Advanced Memory Device Packaging
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Author : Chong Leong, Gan
language : en
Publisher: Springer Nature
Release Date : 2023-05-30
Interconnect Reliability In Advanced Memory Device Packaging written by Chong Leong, Gan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-05-30 with Computers categories.
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Electromigration Inside Logic Cells
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Author : Gracieli Posser
language : en
Publisher: Springer
Release Date : 2016-11-26
Electromigration Inside Logic Cells written by Gracieli Posser and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-26 with Technology & Engineering categories.
This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.
Power Aware Design Methodologies
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Author : Massoud Pedram
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-08
Power Aware Design Methodologies written by Massoud Pedram and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-08 with Technology & Engineering categories.
Power Aware Design Methodologies was conceived as an effort to bring all aspects of power-aware design methodologies together in a single document. It covers several layers of the design hierarchy from technology, circuit logic, and architectural levels up to the system layer. It includes discussion of techniques and methodologies for improving the power efficiency of CMOS circuits (digital and analog), systems on chip, microelectronic systems, wirelessly networked systems of computational nodes and so on. In addition to providing an in-depth analysis of the sources of power dissipation in VLSI circuits and systems and the technology and design trends, this book provides a myriad of state-of-the-art approaches to power optimization and control. The different chapters of Power Aware Design Methodologies have been written by leading researchers and experts in their respective areas. Contributions are from both academia and industry. The contributors have reported the various technologies, methodologies, and techniques in such a way that they are understandable and useful.
Circuit Design For Reliability
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Author : Ricardo Reis
language : en
Publisher: Springer
Release Date : 2014-11-08
Circuit Design For Reliability written by Ricardo Reis and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-08 with Technology & Engineering categories.
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.