Electronic Packaging Of High Speed Circuitry
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Electronic Packaging Of High Speed Circuitry
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Author : Stephen G. Konsowski
language : en
Publisher: McGraw Hill Professional
Release Date : 1997
Electronic Packaging Of High Speed Circuitry written by Stephen G. Konsowski and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
High Frequency Characterization Of Electronic Packaging
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Author : Luc Martens
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
High Frequency Characterization Of Electronic Packaging written by Luc Martens and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Materials For High Density Electronic Packaging And Interconnection
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Author : National Research Council
language : en
Publisher: National Academies Press
Release Date : 1990-02-01
Materials For High Density Electronic Packaging And Interconnection written by National Research Council and has been published by National Academies Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-02-01 with Technology & Engineering categories.
Emc And The Printed Circuit Board
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Author : Mark I. Montrose
language : en
Publisher: John Wiley & Sons
Release Date : 2004-04-05
Emc And The Printed Circuit Board written by Mark I. Montrose and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-04-05 with Science categories.
This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose also shows the relationship between time andfrequency domains to help you meet mandatory compliancerequirements placed on printed circuit boards. Using real-world examples the book features: Clear discussions, without complex mathematical analysis, offlux minimization concepts Extensive analysis of capacitor usage for variousapplications Detailed examination of components characteristics with variousgrounding methodologies, including implementation techniques An in-depth study of transmission line theory A careful look at signal integrity, crosstalk, andtermination
Advanced Electronic Packaging
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Author : Richard K. Ulrich
language : en
Publisher: John Wiley & Sons
Release Date : 2006-02-24
Advanced Electronic Packaging written by Richard K. Ulrich and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-24 with Technology & Engineering categories.
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Electrical Performance Of Electronic Packaging
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Author :
language : en
Publisher:
Release Date : 2004
Electrical Performance Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Electronic packaging categories.
The Vlsi Handbook
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Author : Wai-Kai Chen
language : en
Publisher: CRC Press
Release Date : 2018-10-03
The Vlsi Handbook written by Wai-Kai Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
For the new millenium, Wai-Kai Chen introduced a monumental reference for the design, analysis, and prediction of VLSI circuits: The VLSI Handbook. Still a valuable tool for dealing with the most dynamic field in engineering, this second edition includes 13 sections comprising nearly 100 chapters focused on the key concepts, models, and equations. Written by a stellar international panel of expert contributors, this handbook is a reliable, comprehensive resource for real answers to practical problems. It emphasizes fundamental theory underlying professional applications and also reflects key areas of industrial and research focus. WHAT'S IN THE SECOND EDITION? Sections on... Low-power electronics and design VLSI signal processing Chapters on... CMOS fabrication Content-addressable memory Compound semiconductor RF circuits High-speed circuit design principles SiGe HBT technology Bipolar junction transistor amplifiers Performance modeling and analysis using SystemC Design languages, expanded from two chapters to twelve Testing of digital systems Structured for convenient navigation and loaded with practical solutions, The VLSI Handbook, Second Edition remains the first choice for answers to the problems and challenges faced daily in engineering practice.
Failure Modes And Mechanisms In Electronic Packages
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Author : P. Singh
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Failure Modes And Mechanisms In Electronic Packages written by P. Singh and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of "the chip. " Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product.
Power Distribution Networks With On Chip Decoupling Capacitors
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Author : Renatas Jakushokas
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-11-23
Power Distribution Networks With On Chip Decoupling Capacitors written by Renatas Jakushokas and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-23 with Technology & Engineering categories.
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications
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Author : John R. Susko
language : en
Publisher:
Release Date : 1988
Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications written by John R. Susko and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Electrochemistry categories.