Fundamental Studies On Silicon Dioxide Chemical Mechanical Polishing
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Fundamental Studies On Silicon Dioxide Chemical Mechanical Polishing
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Author : Uday Mahajan
language : en
Publisher:
Release Date : 2000
Fundamental Studies On Silicon Dioxide Chemical Mechanical Polishing written by Uday Mahajan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with categories.
Chemical Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses
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Author : Christopher Lyle Borst
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Chemical Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses written by Christopher Lyle Borst and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
Chemical Mechanical Polishing Fundamentals And Challenges Volume 566
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Author : S. V. Babu
language : en
Publisher:
Release Date : 2000-02-10
Chemical Mechanical Polishing Fundamentals And Challenges Volume 566 written by S. V. Babu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-02-10 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Study Of Interfacial Interaction During Chemical Mechanical Polishing Cmp Of Dielectric Silicon Dioxide
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Author : Wonseop Choi
language : en
Publisher:
Release Date : 2003
Study Of Interfacial Interaction During Chemical Mechanical Polishing Cmp Of Dielectric Silicon Dioxide written by Wonseop Choi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with categories.
Advances In Chemical Mechanical Polishing Volume 816
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2004-09
Advances In Chemical Mechanical Polishing Volume 816 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Microelectronic Applications Of Chemical Mechanical Planarization
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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-12-04
Microelectronic Applications Of Chemical Mechanical Planarization written by Yuzhuo Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-12-04 with Technology & Engineering categories.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Chemical Mechanical Polishing Of Silicon And Silicon Dioxide In Front End Processing
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Author : Markus Forsberg
language : en
Publisher:
Release Date : 2004
Chemical Mechanical Polishing Of Silicon And Silicon Dioxide In Front End Processing written by Markus Forsberg and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Advances In Chemical Mechanical Planarization Cmp
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Author : Babu Suryadevara
language : en
Publisher: Woodhead Publishing
Release Date : 2016-01-09
Advances In Chemical Mechanical Planarization Cmp written by Babu Suryadevara and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-01-09 with Technology & Engineering categories.
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP
Advances In Cmp Polishing Technologies
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Author : Toshiro Doi
language : en
Publisher: William Andrew
Release Date : 2011-11-30
Advances In Cmp Polishing Technologies written by Toshiro Doi and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-30 with Technology & Engineering categories.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Chemical Mechanical Planarization Iv
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Author : R. L. Opila
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Chemical Mechanical Planarization Iv written by R. L. Opila and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.