How Do Mechanics And Thermo Mechanics Affect Microelectronic Products
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How Do Mechanics And Thermo Mechanics Affect Microelectronic Products
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Author : Vincent Fiori
language : en
Publisher:
Release Date : 2010
How Do Mechanics And Thermo Mechanics Affect Microelectronic Products written by Vincent Fiori and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
The work reported here aims to provide to the reader some features on several items related to the microelectronic industry. The content is built in order to, even for non expert of the semiconductor fields, allow a comprehensive understanding of the technology development problematic. Its range from general considerations, to applications and researches on mechanical challenges. These later have been investigated in the last few years within STMicroelectronics. Hence, starting from a general description of the microelectronic device market, the main processes of chip manufacturing are depicted. Then, focus is put on mechanical and thermo mechanical phenomena occurring during manufacturing and qualification tests. Challenges of such mechanisms are presented, and the need for a deep understanding of the physics is highlighted. Requirements for numerical tools, and the industrial context, are justified underlining the need for smart compromises. Specific numerical methods have been developed, implemented and tested. Results have been faced to experimental results for correlation purposes, allowing additional insights and virtual prototyping. This work proposes, trough a selection of applications, to briefly show results on FEoL, BEoL and packaging features of the device. Extracted from team publications, typical examples of strain engineering and fracture mechanics investigations are presented. Their added values are highlighted. This thesis would help people to get familiar with some methods to deal on mechanical and thermo mechanical topics in a technology development framework of the microelectronic industry.
Thermal Stress And Strain In Microelectronics Packaging
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Author : John Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Thermal Stress And Strain In Microelectronics Packaging written by John Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Mechanics Of Microelectronics
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Author : G.Q. Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-08-25
Mechanics Of Microelectronics written by G.Q. Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-08-25 with Technology & Engineering categories.
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Thermal Management Of Microelectronic Equipment
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Author : Lian-Tuu Yeh
language : en
Publisher: American Society of Mechanical Engineers
Release Date : 2002
Thermal Management Of Microelectronic Equipment written by Lian-Tuu Yeh and has been published by American Society of Mechanical Engineers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Computer Aided Design Of Micro And Nanoelectronic Devices
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Author : Chinmay Kumar Maiti
language : en
Publisher: World Scientific
Release Date : 2016-10-27
Computer Aided Design Of Micro And Nanoelectronic Devices written by Chinmay Kumar Maiti and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-10-27 with Technology & Engineering categories.
Micro and nanoelectronic devices are the prime movers for electronics, which is essential for the current information age. This unique monograph identifies the key stages of advanced device design and integration in semiconductor manufacturing. It brings into one resource a comprehensive device design using simulation. The book presents state-of-the-art semiconductor device design using the latest TCAD tools.Professionals, researchers, academics, and graduate students in electrical & electronic engineering and microelectronics will benefit from this reference text.
Mechanics Of Microsystems
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Author : Alberto Corigliano
language : en
Publisher: John Wiley & Sons
Release Date : 2018-04-02
Mechanics Of Microsystems written by Alberto Corigliano and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-02 with Technology & Engineering categories.
Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry. Mechanics of Microsystems is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device. Key features: Provides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues. Includes examples of applications in industry. Accompanied by a website hosting supplementary material. The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.
Influence Of Temperature On Microelectronics And System Reliability
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Author : Pradeep Lall
language : en
Publisher: CRC Press
Release Date : 2020-07-09
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-09 with Technology & Engineering categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Modeling Thermal Stress Behavior In Microelectronic Components
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Author : American Society of Mechanical Engineers. Winter Annual Meeting
language : en
Publisher:
Release Date : 1989
Modeling Thermal Stress Behavior In Microelectronic Components written by American Society of Mechanical Engineers. Winter Annual Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Ceramic capacitors categories.
Thermal stress cracking is a significant mechanical failure mode in microelectronic components. This failure results from elevated stresses in components exposed to elevated temperatures due to the mismatch of thermal and mechanical properties of the constituent materials. The underlying mechanism responsible for these elevated stresses is not well understood. Therefore, we developed general mathematical and computational techniques for modeling the evolution of these stresses. As a test vehicle, we applied these techniques to thermal stress evolution in multilayer ceramic capacitors (MLCC). Thermal stress cracking has been implicated in significant, industry-wide problems associated with the cracking of these components. The model is used to solve for the transient development of thermal and mechanical gradients across the two spatial dimensions of the MLCC mid-plane. Material types with different thermal and mechanical properties and the interfaces between the material types are specifically included in the model. The stress field solutions are used to indicate when and where mechanical failure is expected to occur. The solutions of the model equations have been obtained using special partial differential equation solvers implemented on a CONVEX C120/220 supercomputer. The model is used to investigate the effects of MLCC termination geometry and material properties on the evolution of thermal stresses.
Benefiting From Thermal And Mechanical Simulation In Micro Electronics
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Author : L.J. Ernst
language : en
Publisher: Springer Science & Business Media
Release Date : 2000-12-31
Benefiting From Thermal And Mechanical Simulation In Micro Electronics written by L.J. Ernst and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-12-31 with Language Arts & Disciplines categories.
"Benefiting from Thermal and Mechanical Simulation inMicro-Electronics" presents papers from the first internationalconference on this topic, EuroSimE2000. For the first time, peoplefrom the electronics industry, research institutes, software companiesand universities joined together to discuss present and possiblefuture thermal and mechanical related problems and challenges inmicro-electronics; the state-of-the-art methodologies for thermal &mechanical simulation and optimization of micro-electronics; and theperspectives of future simulation and optimization methodologydevelopment.Main areas covered are: - "Benefiting from Thermal and""Mechanical Simulation in Micro-Electronics" is suitable forstudents at graduate level and beyond, and for researchers, designersand specialists in the fields of microelectronics and mechanics.
Mechanics Of Microelectromechanical Systems
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Author : Nicolae Lobontiu
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-01-16
Mechanics Of Microelectromechanical Systems written by Nicolae Lobontiu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-01-16 with Technology & Engineering categories.
This book offers a comprehensive coverage to the mechanics of microelectromechanical systems (MEMS), which are analyzed from a mechanical engineer’s viewpoint as devices that transform an input form of energy, such as thermal, electrostatic, electromagnetic or optical, into output mechanical motion (in the case of actuation) or that can operate with the reversed functionality (as in sensors) and convert an external stimulus, such as mechanical motion, into (generally) electric energy. The impetus of this proposal stems from the perception that such an approach might contribute to a more solid understanding of the principles governing the mechanics of MEMS, and would hopefully enhance the efficiency of modeling and designing reliable and desirably-optimized microsystems. The work represents an attempt at both extending and deepening the mechanical-based approach to MEMS in the static domain by providing simple, yet reliable tools that are applicable to micromechanism design through current fabrication technologies. Lumped-parameter stiffness and compliance properties of flexible components are derived both analytically (as closed-form solutions) and as simplified (engineering) formulas. Also studied are the principal means of actuation/sensing and their integration into the overall microsystem. Various examples of MEMS are studied in order to better illustrate the presentation of the different modeling principles and algorithms. Through its objective, approach and scope, this book offers a novel and systematic insight into the MEMS domain and complements existing work in the literature addressing part of the material developed herein.