Interconnect Centric Circuit Modeling And Simulation For Giga Hertz Vlsi Signal Power Integrity Applications
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Interconnect Centric Circuit Modeling And Simulation For Giga Hertz Vlsi Signal Power Integrity Applications
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Author : Zonghao Chen
language : en
Publisher:
Release Date : 2004
Interconnect Centric Circuit Modeling And Simulation For Giga Hertz Vlsi Signal Power Integrity Applications written by Zonghao Chen and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Modeling And Simulation For Signal And Power Integrity Of Electronic Packages
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Author : Jae Young Choi
language : en
Publisher:
Release Date : 2012
Modeling And Simulation For Signal And Power Integrity Of Electronic Packages written by Jae Young Choi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Electronic packaging categories.
The objective of this dissertation is to develop electrical modeling and co-simulation methodologies for signal and power integrity of package and board applications. The dissertation includes 1) the application of the finite element method to the optimization for decoupling capacitor selection and placement on a power delivery network (PDN), 2) the development of a PDN modeling method effective for multidimensional and multilayer geometries, 3) the analysis and modeling of return path discontinuities (RPDs), and 4) the implementation of the absorbing boundary condition for PDN modeling.\r : \r : The optimization technique for selection and placement of decoupling capacitors uses a genetic algorithm (GA) and the multilayer finite element method (MFEM), a PDN modeling method using FEM. The GA is customized for the decoupling problem to enhance the convergence speed of the optimization. The mathematical modifications necessary for the incorporation of the capacitor model into MFEM is also presented. \r : \r : The main contribution of this dissertation is the development of a new modeling method, the multilayer triangular element method (MTEM), for power/ground planes of a PDN. MTEM creates a surface mesh on each plane-pair using dual graphs; a non-uniform triangular mesh (Delaunay triangulation) and its orthogonal counterpart (Voronoi diagram), to which electromagnetic and equivalent circuit concepts are applied. The non-uniform triangulation is especially efficient for discretizing multidimensional and irregular geometries which are common in package and board PDNs. Moreover, MTEM generates a sparse, banded, and symmetric system matrix, which enables efficient computations. For a given plane-pair, MTEM extracts an equivalent circuit that is consistent with the physics-based planar-circuit model of a plane-pair. Thus, the values of the lumped elements can be simply calculated from the physical parameters, such as material properties and mesh geometries of each unit-cell. Consequently, the modeling of MTEM is flexible and easy to modify for further extensions, such as the incorporation of external circuits, e.g. decoupling capacitors and vertical interconnects.\r : \r : Power and ground planes provide paths for the return current of signal traces. Typically, planes have discontinuities such as via holes, plane cutouts, and split planes that disturb flow of signal return currents. At the discontinuity, return currents have to detour or switch to different layers, causing signal and power integrity problems. Therefore, a separate analysis of signal interconnects will neglect the significant coupling with a PDN, and the result will not be reliable. In this dissertation, the co-simulation of the signal and power integrity is presented focusing on the modeling of RPDs created by split planes, apertures, and vias. \r : \r : Plane resonance is one of the main sources of power integrity problems in package and board PDNs. A number of techniques have been developed and published in literature to reduce or prevent the resonance of a plane-pair. One of the techniques is to surround plane-pair edges with absorbing material that effectively damps the outgoing parallel-plate wave and minimizes the reflection. To model this behavior, the boundary condition of MTEM needs to be changed from its original form, the open-circuit boundary condition. In this dissertation, the application of the 1st order absorbing boundary condition to MTEM is presented.
High Speed Signaling
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Author : Kyung Suk (Dan) Oh
language : en
Publisher: Prentice Hall
Release Date : 2011-10-07
High Speed Signaling written by Kyung Suk (Dan) Oh and has been published by Prentice Hall this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-07 with Technology & Engineering categories.
New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.
High Speed Circuit Board Signal Integrity
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Author : Stephen C. Thierauf
language : en
Publisher: Artech House
Release Date : 2004
High Speed Circuit Board Signal Integrity written by Stephen C. Thierauf and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.
This leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise circuit design. Discusses both design and debug issues at gigabit per second data rates.
Nano Cmos Circuit And Physical Design
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Author : Ban Wong
language : en
Publisher: John Wiley & Sons
Release Date : 2005-04-08
Nano Cmos Circuit And Physical Design written by Ban Wong and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-04-08 with Technology & Engineering categories.
Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
Digital Integrated Circuit Design
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Author : Hubert Kaeslin
language : en
Publisher: Cambridge University Press
Release Date : 2008-04-28
Digital Integrated Circuit Design written by Hubert Kaeslin and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-04-28 with Technology & Engineering categories.
This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.
Foundations For Microstrip Circuit Design
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Author : Terry C. Edwards
language : en
Publisher: John Wiley & Sons
Release Date : 2016-02-01
Foundations For Microstrip Circuit Design written by Terry C. Edwards and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-02-01 with Technology & Engineering categories.
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Integrated Circuit And System Design
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Author : Enrico Macii
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-09-07
Integrated Circuit And System Design written by Enrico Macii and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09-07 with Computers categories.
This book constitutes the refereed proceedings of the 14th International Workshop on Power and Timing Optimization and Simulation, PATMOS 2004, held in Santorini, Greece in September 2004. The 85 revised papers presented together with abstracts of 6 invited presentations were carefully reviewed and selected from 152 papers submitted. The papers are organized in topical sections on buses and communication, circuits and devices, low power issues, architectures, asynchronous circuits, systems design, interconnect and physical design, security and safety, low-power processing, digital design, and modeling and simulation.
High Speed Digital System Design
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Author : Stephen H. Hall
language : en
Publisher: Wiley-IEEE Press
Release Date : 2000-09-08
High Speed Digital System Design written by Stephen H. Hall and has been published by Wiley-IEEE Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-09-08 with Computers categories.
A cutting-edge guide to the theory and practice of high-speed digital system design An understanding of high-speed interconnect phenomena is essential for digital designers who must deal with the challenges posed by the ever-increasing operating speeds of today's microprocessors. This book provides a much-needed, practical guide to the state of the art of modern digital system design, combining easily accessible explanations with immensely useful problem-solving strategies. Written by three leading Intel engineers, High-Speed Digital System Design clarifies difficult and often neglected topics involving the effects of high frequencies on digital buses and presents a variety of proven techniques and application examples. Extensive appendices, formulas, modeling techniques as well as hundreds of figures are also provided. Coverage includes: * A thorough introduction to the digital aspects of basic transmission line theory * Crosstalk and nonideal transmission line effects on signal quality and timings * The impact of packages, vias, and connectors on signal integrity * The effects of nonideal return current paths, high frequency power delivery, and simultaneous switching noise * Explanations of how driving circuit characteristics affect the quality of the digital signal * Digital timing analysis at the system level that incorporates high-speed signaling effects into timing budgets * Methodologies for designing high-speed buses and handling the very large number of variables that affect interconnect performance * Radiated emission problems and how to minimize system noise * The practical aspects of making measurements in high-speed digital systems
Signal And Power Integrity Simplified
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Author : Eric Bogatin
language : en
Publisher: Pearson Education
Release Date : 2009-07-13
Signal And Power Integrity Simplified written by Eric Bogatin and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-07-13 with Technology & Engineering categories.
The #1 Practical Guide to Signal Integrity Design—Now Updated with Extensive New Coverage! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design. Coverage includes A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.