Interconnect Technology For Three Dimensional Chip Integration
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Interconnect Technology For Three Dimensional Chip Integration
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Author : Andreas Munding
language : en
Publisher: Cuvillier Verlag
Release Date : 2007
Interconnect Technology For Three Dimensional Chip Integration written by Andreas Munding and has been published by Cuvillier Verlag this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with categories.
Three Dimensional Integrated Circuit Design
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Author : Vasilis F. Pavlidis
language : en
Publisher: Newnes
Release Date : 2017-07-04
Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with Technology & Engineering categories.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Three Dimensional System Integration
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Author : Antonis Papanikolaou
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-12-07
Three Dimensional System Integration written by Antonis Papanikolaou and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-07 with Technology & Engineering categories.
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Integrated Interconnect Technologies For 3d Nanoelectronic Systems
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Author : Muhannad S. Bakir
language : en
Publisher: Artech House
Release Date : 2008-11-30
Integrated Interconnect Technologies For 3d Nanoelectronic Systems written by Muhannad S. Bakir and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-11-30 with Technology & Engineering categories.
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Wafer Level 3 D Ics Process Technology
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Author : Chuan Seng Tan
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-06-29
Wafer Level 3 D Ics Process Technology written by Chuan Seng Tan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-06-29 with Technology & Engineering categories.
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Interconnect Technology And Design For Gigascale Integration
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Author : Jeffrey A. Davis
language : en
Publisher: Taylor & Francis US
Release Date : 2003-10-31
Interconnect Technology And Design For Gigascale Integration written by Jeffrey A. Davis and has been published by Taylor & Francis US this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-10-31 with Computers categories.
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
3d Integration In Vlsi Circuits
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Author : Katsuyuki Sakuma
language : en
Publisher: CRC Press
Release Date : 2018-04-17
3d Integration In Vlsi Circuits written by Katsuyuki Sakuma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-17 with Technology & Engineering categories.
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Soc Based Solutions In Emerging Application Domains
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Author : Veena S. Chakravarthi
language : en
Publisher: Springer Nature
Release Date : 2025-04-09
Soc Based Solutions In Emerging Application Domains written by Veena S. Chakravarthi and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-04-09 with Technology & Engineering categories.
Working in the ever-evolving field of smart chip design within an AI-powered design environment, the authors of this book draw on their experiences in successfully developing system-on-chip (SoC) solutions, having grappled with the emerging design environment, innovative tools, domain-specific challenges, and major design decisions for SOC-based solutions. They present the first comprehensive guide to navigating the technical challenges of SOC-based solutions in emerging application domains, covering various design and development methodologies for system-on-chip solutions for emerging target applications. When diligently applied, the strategies and tactics presented can significantly shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially in AI-powered smart EDA environments. The book provides a detailed insight into SoC-based solutions for various applications, including artificial intelligence (AI), post-quantum security feature enhancements, 3D SOCs, quantum SOCs, photonic SOCs, and SOC solutions for IoT, high-performance computing SOCs, and processor-based systems. The coverage includes architecture exploration methods for targeted applications, compute-intensive SoCs, lightweight SoCs for IOT applications, advanced technology node solutions, and solutions including hardware software co-designs and software-defined SoCs. The strategies best applied in these highly advanced technology developments are discussed in a guest chapter by a practicing high technology strategist so innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.
Arbitrary Modeling Of Tsvs For 3d Integrated Circuits
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Author : Khaled Salah
language : en
Publisher: Springer
Release Date : 2014-08-21
Arbitrary Modeling Of Tsvs For 3d Integrated Circuits written by Khaled Salah and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-21 with Technology & Engineering categories.
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Three Dimensional Integration Of Semiconductors
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Author : Kazuo Kondo
language : en
Publisher: Springer
Release Date : 2015-12-09
Three Dimensional Integration Of Semiconductors written by Kazuo Kondo and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-12-09 with Science categories.
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.