Interconnects In Vlsi Design
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Interconnects In Vlsi Design
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Author : Hartmut Grabinski
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Interconnects In Vlsi Design written by Hartmut Grabinski and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
Graphene And Vlsi Interconnects
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Author : Cher-Ming Tan
language : en
Publisher: CRC Press
Release Date : 2021-11-24
Graphene And Vlsi Interconnects written by Cher-Ming Tan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-11-24 with Science categories.
Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it is approaching its limits with respect to electrical performance and reliability. Graphene is a non-metal material, but it can help to improve electromigration (EM) performance of Cu because of its excellent properties. Combining graphene with Cu for very large-scale integration (VLSI) interconnects can be a viable solution. The incorporation of graphene into Cu allows the present Cu fabrication back-end process to remain unaltered, except for the small step of “inserting” graphene into Cu. Therefore, it has a great potential to revolutionize the VLSI integrated circuit (VLSI-IC) industry and appeal for further advancement of the semiconductor industry. This book is a compilation of comprehensive studies done on the properties of graphene and its synthesis methods suitable for applications of VLSI interconnects. It introduces the development of a new method to synthesize graphene, wherein it not only discusses the method to grow graphene over Cu but also allows the reader to know how to optimize graphene growth, using statistical design of experiments (DoE), on Cu interconnects in order to obtain good-quality and reliable interconnects. It provides a basic understanding of graphene–Cu interaction mechanism and evaluates the electrical and EM performance of graphenated Cu interconnects.
Interconnect Centric Design For Advanced Soc And Noc
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Author : Jari Nurmi
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-07-20
Interconnect Centric Design For Advanced Soc And Noc written by Jari Nurmi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-07-20 with Computers categories.
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Major Applications Of Carbon Nanotube Field Effect Transistors Cntfet
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Author : Balwinder Raj
language : en
Publisher: Engineering Science Reference
Release Date : 2019
Major Applications Of Carbon Nanotube Field Effect Transistors Cntfet written by Balwinder Raj and has been published by Engineering Science Reference this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with Carbon nanotubes categories.
"This book explores the methods and applications of converting semiconductor devices from micron technology to nanotechnology. It also examines existing CNTs, CNTFETs, and their applications and examines practical applications to minimize short channel effects and power dissipation in nanoscale devices and circuits" --
Layout Optimization In Vlsi Design
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Author : Bing Lu
language : en
Publisher: Springer Science & Business Media
Release Date : 2001-12-31
Layout Optimization In Vlsi Design written by Bing Lu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-12-31 with Computers categories.
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
Interconnect Technology And Design For Gigascale Integration
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Author : Jeffrey A. Davis
language : en
Publisher: Taylor & Francis US
Release Date : 2003-10-31
Interconnect Technology And Design For Gigascale Integration written by Jeffrey A. Davis and has been published by Taylor & Francis US this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-10-31 with Computers categories.
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Vlsi And Post Cmos Electronics
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Author : Rohit Dhiman
language : en
Publisher: Institution of Engineering and Technology
Release Date : 2019-09-30
Vlsi And Post Cmos Electronics written by Rohit Dhiman and has been published by Institution of Engineering and Technology this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-09-30 with Technology & Engineering categories.
VLSI, or Very-Large-Scale-Integration, is the practice of combining billions of transistors to create an integrated circuit. At present, VLSI circuits are realised using CMOS technology. However, the demand for ever smaller, more efficient circuits is now pushing the limits of CMOS. Post-CMOS refers to the possible future digital logic technologies beyond the CMOS scaling limits. This 2-volume set addresses the current state of the art in VLSI technologies and presents potential options for post-CMOS processes.
Low Power Interconnect Design
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Author : Sandeep Saini
language : en
Publisher: Springer
Release Date : 2015-06-12
Low Power Interconnect Design written by Sandeep Saini and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-06-12 with Technology & Engineering categories.
This book provides practical solutions for delay and power reduction for on-chip interconnects and buses. It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system. Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.
Interconnect Technology And Design For Gigascale Integration
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Author : Jeffrey A. Davis
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Interconnect Technology And Design For Gigascale Integration written by Jeffrey A. Davis and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.
High Speed Vlsi Interconnections
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Author : Ashok K. Goel
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19
High Speed Vlsi Interconnections written by Ashok K. Goel and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.