Ipfa 2012

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Istfa 2012

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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2012

Istfa 2012 written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Technology & Engineering categories.

Istfa 2014

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Author : A. S. M. International
language : en
Publisher: ASM International
Release Date : 2014-11-01

Istfa 2014 written by A. S. M. International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-01 with Technology & Engineering categories.

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.

Hot Carrier Degradation In Semiconductor Devices

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Author : Tibor Grasser
language : en
Publisher: Springer
Release Date : 2014-10-29

Hot Carrier Degradation In Semiconductor Devices written by Tibor Grasser and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-29 with Technology & Engineering categories.

This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.

Vlsi Design And Test

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Author : Brajesh Kumar Kaushik
language : en
Publisher: Springer
Release Date : 2017-12-21

Vlsi Design And Test written by Brajesh Kumar Kaushik and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-21 with Computers categories.

This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.

Microelectronics Fialure Analysis Desk Reference Seventh Edition

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Author : Tejinder Gandhi
language : en
Publisher: ASM International
Release Date : 2019-11-01

Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-01 with Technology & Engineering categories.

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

Fib Nanostructures

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Author : Zhiming M. Wang
language : en
Publisher: Springer Science & Business Media
Release Date : 2014-01-04

Fib Nanostructures written by Zhiming M. Wang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-01-04 with Technology & Engineering categories.

FIB Nanostructures reviews a range of methods, including milling, etching, deposition, and implantation, applied to manipulate structures at the nanoscale. Focused Ion Beam (FIB) is an important tool for manipulating the structure of materials at the nanoscale, and substantially extends the range of possible applications of nanofabrication. FIB techniques are widely used in the semiconductor industry and in materials research for deposition and ablation, including the fabrication of nanostructures such as nanowires, nanotubes, nanoneedles, graphene sheets, quantum dots, etc. The main objective of this book is to create a platform for knowledge sharing and dissemination of the latest advances in novel areas of FIB for nanostructures and related materials and devices, and to provide a comprehensive introduction to the field and directions for further research. Chapters written by leading scientists throughout the world create a fundamental bridge between focused ion beam and nanotechnology that is intended to stimulate readers' interest in developing new types of nanostructures for application to semiconductor technology. These applications are increasingly important for the future development of materials science, energy technology, and electronic devices. The book can be recommended for physics, electrical engineering, and materials science departments as a reference on materials science and device design.

Copper Zinc Tin Sulfide Based Thin Film Solar Cells

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Author : Kentaro Ito
language : en
Publisher: John Wiley & Sons
Release Date : 2015-02-23

Copper Zinc Tin Sulfide Based Thin Film Solar Cells written by Kentaro Ito and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-02-23 with Technology & Engineering categories.

Beginning with an overview and historical background of Copper Zinc Tin Sulphide (CZTS) technology, subsequent chapters cover properties of CZTS thin films, different preparation methods of CZTS thin films, a comparative study of CZTS and CIGS solar cell, computational approach, and future applications of CZTS thin film solar modules to both ground-mount and rooftop installation. The semiconducting compound (CZTS) is made up earth-abundant, low-cost and non-toxic elements, which make it an ideal candidate to replace Cu(In,Ga)Se2 (CIGS) and CdTe solar cells which face material scarcity and toxicity issues. The device performance of CZTS-based thin film solar cells has been steadily improving over the past 20 years, and they have now reached near commercial efficiency levels (10%). These achievements prove that CZTS-based solar cells have the potential to be used for large-scale deployment of photovoltaics. With contributions from leading researchers from academia and industry, many of these authors have contributed to the improvement of its efficiency, and have rich experience in preparing a variety of semiconducting thin films for solar cells.

Istfa 2018 Proceedings From The 44th International Symposium For Testing And Failure Analysis

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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2018-12-01

Istfa 2018 Proceedings From The 44th International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-12-01 with Technology & Engineering categories.

The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Biomass And Biofuels

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Author : Shibu Jose
language : en
Publisher: CRC Press
Release Date : 2015-04-22

Biomass And Biofuels written by Shibu Jose and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-04-22 with Science categories.

The long-held tenets of the energy sector are being rewritten in the twenty-first century. The rise of unconventional oil and gas and of renewables is transforming our economies and improving our understanding of the distribution of the world's energy resources and their impacts. A complete knowledge of the dynamics underpinning energy markets is n

Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis

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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2017-12-01

Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-01 with Technology & Engineering categories.

The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.