Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011
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Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335
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Author : Mikhail R. Baklanov
language : en
Publisher: Materials Research Society
Release Date : 2011-11-21
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335 written by Mikhail R. Baklanov and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-21 with Technology & Engineering categories.
This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011
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Author :
language : en
Publisher:
Release Date : 2012
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Integrated circuits categories.
Handbook Of Thin Film Deposition
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Author : Dominic Schepis
language : en
Publisher: Elsevier
Release Date : 2024-10-08
Handbook Of Thin Film Deposition written by Dominic Schepis and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-08 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films
Handbook Of Thin Film Deposition
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Author : Krishna Seshan
language : en
Publisher: William Andrew
Release Date : 2018-02-23
Handbook Of Thin Film Deposition written by Krishna Seshan and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-23 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Nuclear Radiation Detection Materials 2011 Volume 1341
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Author : Michael Fiederle
language : en
Publisher: Cambridge University Press
Release Date : 2012-01-16
Nuclear Radiation Detection Materials 2011 Volume 1341 written by Michael Fiederle and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-16 with Science categories.
Symposium U, 'Nuclear Radiation Detection Materials' (April 2011 MRS Spring Meeting) provided the latest research in nuclear radiation detection materials.
Amorphous And Polycrystalline Thin Film Silicon Science And Technology 2011 Volume 1321
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Author : Baojie Yan
language : en
Publisher: Cambridge University Press
Release Date : 2012
Amorphous And Polycrystalline Thin Film Silicon Science And Technology 2011 Volume 1321 written by Baojie Yan and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Science categories.
This volume includes sixty-eight papers presented at 'Amorphous and Polycrystalline Thin-Film Silicon Science and Technology - 2011' symposium, MRS Spring Meeting.
Metrology And Diagnostic Techniques For Nanoelectronics
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Author : Zhiyong Ma
language : en
Publisher: CRC Press
Release Date : 2017-03-27
Metrology And Diagnostic Techniques For Nanoelectronics written by Zhiyong Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-27 with Science categories.
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Mems And Nanotechnology Volume 4
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Author : Tom Proulx
language : en
Publisher: CRC Press
Release Date : 2025-08-07
Mems And Nanotechnology Volume 4 written by Tom Proulx and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-08-07 with Technology & Engineering categories.
MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.
Advanced Nanoelectronics
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Author : Muhammad Mustafa Hussain
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-04
Advanced Nanoelectronics written by Muhammad Mustafa Hussain and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-04 with Technology & Engineering categories.
Brings novel insights to a vibrant research area with high application potential?covering materials, physics, architecture, and integration aspects of future generation CMOS electronics technology Over the last four decades we have seen tremendous growth in semiconductor electronics. This growth has been fueled by the matured complementary metal oxide semiconductor (CMOS) technology. This comprehensive book captures the novel device options in CMOS technology that can be realized using non-silicon semiconductors. It discusses germanium, III-V materials, carbon nanotubes and graphene as semiconducting materials for three-dimensional field-effect transistors. It also covers non-conventional materials such as nanowires and nanotubes. Additionally, nanoelectromechanical switches-based mechanical relays and wide bandgap semiconductor-based terahertz electronics are reviewed as essential add-on electronics for enhanced communication and computational capabilities. Advanced Nanoelectronics: Post-Silicon Materials and Devices begins with a discussion of the future of CMOS. It continues with comprehensive chapter coverage of: nanowire field effect transistors; two-dimensional materials for electronic applications; the challenges and breakthroughs of the integration of germanium into modern CMOS; carbon nanotube logic technology; tunnel field effect transistors; energy efficient computing with negative capacitance; spin-based devices for logic, memory and non-Boolean architectures; and terahertz properties and applications of GaN. -Puts forward novel approaches for future, state-of-the-art, nanoelectronic devices -Discusses emerging materials and architectures such as alternate channel material like germanium, gallium nitride, 1D nanowires/tubes, 2D graphene, and other dichalcogenide materials and ferroelectrics -Examines new physics such as spintronics, negative capacitance, quantum computing, and 3D-IC technology -Brings together the latest developments in the field for easy reference -Enables academic and R&D researchers in semiconductors to "think outside the box" and explore beyond silica An important resource for future generation CMOS electronics technology, Advanced Nanoelectronics: Post-Silicon Materials and Devices will appeal to materials scientists, semiconductor physicists, semiconductor industry, and electrical engineers.
Advanced Interconnects For Ulsi Technology
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-02
Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-02 with Technology & Engineering categories.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.