Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335
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Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335
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Author : Mikhail R. Baklanov
language : en
Publisher: Materials Research Society
Release Date : 2011-11-21
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335 written by Mikhail R. Baklanov and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-21 with Technology & Engineering categories.
This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.
Nuclear Radiation Detection Materials 2011 Volume 1341
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Author : Michael Fiederle
language : en
Publisher: Cambridge University Press
Release Date : 2012-01-16
Nuclear Radiation Detection Materials 2011 Volume 1341 written by Michael Fiederle and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-16 with Science categories.
Symposium U, 'Nuclear Radiation Detection Materials' (April 2011 MRS Spring Meeting) provided the latest research in nuclear radiation detection materials.
Amorphous And Polycrystalline Thin Film Silicon Science And Technology 2011 Volume 1321
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Author : Baojie Yan
language : en
Publisher: Cambridge University Press
Release Date : 2012
Amorphous And Polycrystalline Thin Film Silicon Science And Technology 2011 Volume 1321 written by Baojie Yan and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Science categories.
This volume includes sixty-eight papers presented at 'Amorphous and Polycrystalline Thin-Film Silicon Science and Technology - 2011' symposium, MRS Spring Meeting.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009
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Author : Martin Gall
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 written by Martin Gall and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011
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Author :
language : en
Publisher:
Release Date : 2012
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Integrated circuits categories.
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990
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Author : Qinghuang Lin
language : en
Publisher:
Release Date : 2007-09-12
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990 written by Qinghuang Lin and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-12 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Interconnects For Micro And Nanoelectronics
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Author : E. Kondoh
language : en
Publisher:
Release Date : 2013
Advanced Interconnects For Micro And Nanoelectronics written by E. Kondoh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with Microelectronics categories.
Semiconductor Defect Engineering Volume 994
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Author : S. Ashok
language : en
Publisher: Cambridge University Press
Release Date : 2007-09-10
Semiconductor Defect Engineering Volume 994 written by S. Ashok and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-10 with Technology & Engineering categories.
This book, first published in 2007, focuses on the application of defects and impurities in current and emerging semiconductor technologies. The role of defects in the evolution of semiconductor technology is now recognized as one of refined control - in density, properties, spatial location, and perhaps even temporal variation during device operating lifetime. The concept of defect engineering has found numerous applications in the fabrication of semiconductors and devices with improved and/or new properties, and new trends extend defect engineering in structures with nm dimensions. This book shows interaction among researchers pursing effective use of defect incorporation and control at various facets of technology and widely different semiconductor materials systems. Topics include: dopant and defect issues in oxide and nitride semiconductors; defect properties, activation and passivation; defects in nanostructures and organic semiconductors; ion implantation and beam processing; defect characterization; heterojunctions and interfaces; process-induced defects; dopants and defects in group-IV semiconductors and defects in devices.
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics
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Author : G. S. Oehrlein
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics written by G. S. Oehrlein and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863
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Author : Paul R. Besser
language : en
Publisher:
Release Date : 2005-08-26
Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863 written by Paul R. Besser and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-08-26 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.