Advanced Interconnects For Micro And Nanoelectronics
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Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009
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Author : Martin Gall
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 written by Martin Gall and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 Volume 1156
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Author : Martin Gall
language : en
Publisher:
Release Date : 2009-11-18
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 Volume 1156 written by Martin Gall and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-11-18 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990
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Author : Qinghuang Lin
language : en
Publisher:
Release Date : 2007-09-12
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990 written by Qinghuang Lin and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-12 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Interconnects And Chemical Mechanical Planarization For Micro And Nanoelectronics Volume 1249
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Author : J. W. Bartha
language : en
Publisher:
Release Date : 2010-10-05
Advanced Interconnects And Chemical Mechanical Planarization For Micro And Nanoelectronics Volume 1249 written by J. W. Bartha and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-05 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990
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Author : Qinghuang Lin
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990 written by Qinghuang Lin and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335
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Author : Mikhail R. Baklanov
language : en
Publisher: Materials Research Society
Release Date : 2011-11-21
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335 written by Mikhail R. Baklanov and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-21 with Technology & Engineering categories.
This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.
Handbook Of Thin Film Deposition
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Author : Krishna Seshan
language : en
Publisher: William Andrew
Release Date : 2018-02-23
Handbook Of Thin Film Deposition written by Krishna Seshan and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-23 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Advanced Interconnects For Micro And Nanoelectronics
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Author : E. Kondoh
language : en
Publisher:
Release Date : 2013
Advanced Interconnects For Micro And Nanoelectronics written by E. Kondoh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with Microelectronics categories.
Silicon Nitride Silicon Dioxide And Emerging Dielectrics 11
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Author : Electrochemical society. Meeting
language : en
Publisher: The Electrochemical Society
Release Date : 2011
Silicon Nitride Silicon Dioxide And Emerging Dielectrics 11 written by Electrochemical society. Meeting and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Science categories.
This issue of ECS Transactions contains the peer-reviewed full length papers of the International Symposium on Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics held May 1-6, 2011 in Montreal as a part of the 219th Meeting of The Electrochemical Society. The papers address a very diverse range of topics. In addition to the deposition and characterization of the dielectrics, more specific topics addressed by the papers include applications, device characterization and reliability, interface states, interface traps, defects, transistor and gate oxide studies, and modeling.
Handbook Of Thin Film Deposition
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Author : Dominic Schepis
language : en
Publisher: Elsevier
Release Date : 2024-10-08
Handbook Of Thin Film Deposition written by Dominic Schepis and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-08 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films