Advanced Interconnects And Chemical Mechanical Planarization For Micro And Nanoelectronics Volume 1249
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Advanced Interconnects And Chemical Mechanical Planarization For Micro And Nanoelectronics Volume 1249
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Author : J. W. Bartha
language : en
Publisher:
Release Date : 2010-10-05
Advanced Interconnects And Chemical Mechanical Planarization For Micro And Nanoelectronics Volume 1249 written by J. W. Bartha and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-05 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Handbook Of Thin Film Deposition
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Author : Krishna Seshan
language : en
Publisher: William Andrew
Release Date : 2018-02-23
Handbook Of Thin Film Deposition written by Krishna Seshan and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-23 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Silicon Nitride Silicon Dioxide And Emerging Dielectrics 11
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Author : Electrochemical society. Meeting
language : en
Publisher: The Electrochemical Society
Release Date : 2011
Silicon Nitride Silicon Dioxide And Emerging Dielectrics 11 written by Electrochemical society. Meeting and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Science categories.
This issue of ECS Transactions contains the peer-reviewed full length papers of the International Symposium on Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics held May 1-6, 2011 in Montreal as a part of the 219th Meeting of The Electrochemical Society. The papers address a very diverse range of topics. In addition to the deposition and characterization of the dielectrics, more specific topics addressed by the papers include applications, device characterization and reliability, interface states, interface traps, defects, transistor and gate oxide studies, and modeling.
Advanced Interconnects And Chemical Mechanical Planarization For Micro And Nanoelectronics Volume 1249
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Author : J. W. Bartha
language : en
Publisher: Materials Research Society
Release Date : 2010-10-05
Advanced Interconnects And Chemical Mechanical Planarization For Micro And Nanoelectronics Volume 1249 written by J. W. Bartha and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-05 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990
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Author : Qinghuang Lin
language : en
Publisher:
Release Date : 2007-09-12
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990 written by Qinghuang Lin and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-12 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Microelectronic Applications Of Chemical Mechanical Planarization
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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19
Microelectronic Applications Of Chemical Mechanical Planarization written by Yuzhuo Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Chemical Mechanical Planarization Of Microelectronic Materials
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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 1997
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.
The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Advances In Chemical Mechanical Planarization Cmp
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Author : Suryadevara Babu
language : en
Publisher: Woodhead Publishing
Release Date : 2016-01-08
Advances In Chemical Mechanical Planarization Cmp written by Suryadevara Babu and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-01-08 with Technology & Engineering categories.
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.
Advanced Interconnects For Micro And Nanoelectronics
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Author : E. Kondoh
language : en
Publisher:
Release Date : 2013
Advanced Interconnects For Micro And Nanoelectronics written by E. Kondoh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with Microelectronics categories.