Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990
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Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990
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Author : Qinghuang Lin
language : en
Publisher:
Release Date : 2007-09-12
Materials Processes Integration And Reliability In Advanced Interconnects For Micro And Nanoelectronics Volume 990 written by Qinghuang Lin and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-12 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Semiconductor Defect Engineering Volume 994
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Author : S. Ashok
language : en
Publisher:
Release Date : 2007-09-10
Semiconductor Defect Engineering Volume 994 written by S. Ashok and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-10 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, focuses on the application of defects and impurities in current and emerging semiconductor technologies.
Ion Beam Based Nanofabrication Volume 1020
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Author : Daryush Ila
language : en
Publisher:
Release Date : 2007-09-05
Ion Beam Based Nanofabrication Volume 1020 written by Daryush Ila and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-05 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Organic Inorganic Hybrid Materials 2007 Volume 1007
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Author : Christophe Barbé
language : en
Publisher:
Release Date : 2008-05-28
Organic Inorganic Hybrid Materials 2007 Volume 1007 written by Christophe Barbé and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-05-28 with Technology & Engineering categories.
The field of organic/inorganic hybrids has evolved significantly, providing materials with increasing architectural complexities and functionalities. Scientists involved in this field are gradually moving from building materials using a classical molecular approach (e.g. polymerization) to assembling materials on the nanoscale, using a variety of innovative strategies which can vary from the assembly of DNA motifs, to the formation of mesoporous materials by spinodal decomposition, or the use of nanoparticles or oxoclusters as nanobuilding blocks for building complex structures such as nacre-like transition metal oxides. This precise control over the materials architecture also adds functionality to the hybrid materials, whether it is for designing special membranes for phase separation and chromatography or thin films for photonic or magnetic applications. This book presents contributions from researchers worldwide and discusses organosiloxane-based materials; mesoporous materials and films; layered materials; surface and interface modification and characterization; controlled release and biological applications; nanoparticles synthesis and assembly; nanocomposites and new concepts.
Thin Film Compound Semiconductor Photovoltaics 2007 Volume 1012
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Author : Timothy Gessert
language : en
Publisher:
Release Date : 2007-11-14
Thin Film Compound Semiconductor Photovoltaics 2007 Volume 1012 written by Timothy Gessert and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-11-14 with Technology & Engineering categories.
Thin-film compound semiconductor photovoltaic solar cells have demonstrated efficiencies of nearly 20% and are leading candidates to provide lower-cost energy due to potential advantages in manufacturing and materials costs. To fulfill the promise, a number of technical issues are being addressed, including a lack of fundamental understanding of these unique materials, devices and processes for large-area deposition. This book focuses on advances in the materials science, chemistry, processing and device issues of thin-film compound semiconductor materials that are used, or have potential use, in photovoltaic solar cells and related applications. Topics include: growth and performance of compound thin-film solar cells; novel materials and processes; defects and impurities; industrial perspectives; contacts and interfaces; grain boundaries and inhomogeneities; and structural, optical and electronic characterization.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009
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Author : Martin Gall
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 written by Martin Gall and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335
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Author : Mikhail R. Baklanov
language : en
Publisher: Materials Research Society
Release Date : 2011-11-21
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 Volume 1335 written by Mikhail R. Baklanov and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-21 with Technology & Engineering categories.
This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.
Popular Mechanics
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Author :
language : en
Publisher:
Release Date : 2000-01
Popular Mechanics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-01 with categories.
Popular Mechanics inspires, instructs and influences readers to help them master the modern world. Whether it’s practical DIY home-improvement tips, gadgets and digital technology, information on the newest cars or the latest breakthroughs in science -- PM is the ultimate guide to our high-tech lifestyle.
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011
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Author :
language : en
Publisher:
Release Date : 2012
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2011 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Integrated circuits categories.
Semiconductor Defect Engineering Volume 994
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Author : S. Ashok
language : en
Publisher: Cambridge University Press
Release Date : 2007-09-10
Semiconductor Defect Engineering Volume 994 written by S. Ashok and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-10 with Technology & Engineering categories.
This book, first published in 2007, focuses on the application of defects and impurities in current and emerging semiconductor technologies. The role of defects in the evolution of semiconductor technology is now recognized as one of refined control - in density, properties, spatial location, and perhaps even temporal variation during device operating lifetime. The concept of defect engineering has found numerous applications in the fabrication of semiconductors and devices with improved and/or new properties, and new trends extend defect engineering in structures with nm dimensions. This book shows interaction among researchers pursing effective use of defect incorporation and control at various facets of technology and widely different semiconductor materials systems. Topics include: dopant and defect issues in oxide and nitride semiconductors; defect properties, activation and passivation; defects in nanostructures and organic semiconductors; ion implantation and beam processing; defect characterization; heterojunctions and interfaces; process-induced defects; dopants and defects in group-IV semiconductors and defects in devices.