Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics
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Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics
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Author :
language : en
Publisher:
Release Date : 2003
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Dielectric films categories.
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics
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Author :
language : en
Publisher:
Release Date : 2001
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Dielectric films categories.
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics
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Author : G. S. Oehrlein
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics written by G. S. Oehrlein and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics 2003
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2003
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics 2003 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863
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Author : Paul R. Besser
language : en
Publisher:
Release Date : 2005-08-26
Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863 written by Paul R. Besser and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-08-26 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics 2004
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Author : R. J. Carter
language : en
Publisher:
Release Date : 2004-09
Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics 2004 written by R. J. Carter and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09 with Technology & Engineering categories.
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Copper Interconnect Technology
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Author : Tapan Gupta
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-01-22
Copper Interconnect Technology written by Tapan Gupta and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-01-22 with Technology & Engineering categories.
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Materials Technology And Reliability Of Low K Dielectrics And Copper Interconnects
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Author : Ting Y. Tsui
language : en
Publisher:
Release Date : 2006
Materials Technology And Reliability Of Low K Dielectrics And Copper Interconnects written by Ting Y. Tsui and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Technology & Engineering categories.
Dielectric Films For Advanced Microelectronics
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2007-04-04
Dielectric Films For Advanced Microelectronics written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-04 with Technology & Engineering categories.
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Low Dielectric Constant Materials For Ic Applications
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Author : Paul S. Ho
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Low Dielectric Constant Materials For Ic Applications written by Paul S. Ho and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for