Materials Reliability In Microelectronics Ii
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Materials Reliability In Microelectronics Ii Volume 265
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Author : C. V. Thompson
language : en
Publisher:
Release Date : 1992-09-30
Materials Reliability In Microelectronics Ii Volume 265 written by C. V. Thompson and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992-09-30 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Reliability And Failure Of Electronic Materials And Devices
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Author : Milton Ohring
language : en
Publisher: Academic Press
Release Date : 2014-10-14
Reliability And Failure Of Electronic Materials And Devices written by Milton Ohring and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-14 with Technology & Engineering categories.
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Electromigration In Metals
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Author : Paul S. Ho
language : en
Publisher: Cambridge University Press
Release Date : 2022-05-12
Electromigration In Metals written by Paul S. Ho and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-12 with Science categories.
Learn to assess electromigration reliability and design resilient chips, building from fundamental physics to advanced methodologies.
Materials And Reliability Handbook For Semiconductor Optical And Electron Devices
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Author : Osamu Ueda
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-09-24
Materials And Reliability Handbook For Semiconductor Optical And Electron Devices written by Osamu Ueda and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-09-24 with Technology & Engineering categories.
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Handbook Of Semiconductor Manufacturing Technology
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Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2000-08-09
Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-08-09 with Technology & Engineering categories.
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Proceedings Of The Third Symposium On Silicon Nitride And Silicon Dioxide Thin Insulating Films
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Author : Vikram J. Kapoor
language : en
Publisher: The Electrochemical Society
Release Date : 1994
Proceedings Of The Third Symposium On Silicon Nitride And Silicon Dioxide Thin Insulating Films written by Vikram J. Kapoor and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Science categories.
Reliability Of Organic Compounds In Microelectronics And Optoelectronics
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Author : Willem Dirk van Driel
language : en
Publisher: Springer Nature
Release Date : 2022-01-31
Reliability Of Organic Compounds In Microelectronics And Optoelectronics written by Willem Dirk van Driel and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-01-31 with Technology & Engineering categories.
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Catalog Of National Bureau Of Standards Publications 1966 1976 Key Word Index
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Author : United States. National Bureau of Standards. Technical Information and Publications Division
language : en
Publisher:
Release Date : 1978
Catalog Of National Bureau Of Standards Publications 1966 1976 Key Word Index written by United States. National Bureau of Standards. Technical Information and Publications Division and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1978 with Government publications categories.
Reliability And Quality In Microelectronic Manufacturing
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Author : A. Christou
language : en
Publisher: RIAC
Release Date : 2006
Reliability And Quality In Microelectronic Manufacturing written by A. Christou and has been published by RIAC this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Business & Economics categories.
Rf And Microwave Microelectronics Packaging Ii
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Author : Ken Kuang
language : en
Publisher: Springer
Release Date : 2017-03-09
Rf And Microwave Microelectronics Packaging Ii written by Ken Kuang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-09 with Technology & Engineering categories.
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.