Metallization
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Metallization Systems For Integrated Circuits
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Author : Rosemary P. Beatty
language : en
Publisher:
Release Date : 1970
Metallization Systems For Integrated Circuits written by Rosemary P. Beatty and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1970 with Integrated circuits categories.
Handbook Of Multilevel Metallization For Integrated Circuits
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Author : Syd R. Wilson
language : en
Publisher: William Andrew
Release Date : 1993
Handbook Of Multilevel Metallization For Integrated Circuits written by Syd R. Wilson and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Metallization
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Author : S. P. Murarka
language : en
Publisher: Butterworth-Heinemann
Release Date : 1993
Metallization written by S. P. Murarka and has been published by Butterworth-Heinemann this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Computers categories.
This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Metallization Of Polymers 2
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Author : Edward Sacher
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Metallization Of Polymers 2 written by Edward Sacher and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity with, the latest findings in this rapidly advancing field. At the very least, such familiarity requires an exchange of infonnation, particularly among those intimately involved in this field. Communications among many of us in this area have made one fact quite obvious: the facilities provided by existing organizations, scientific and otherwise, do not offer the forum necessary to accomplish this exchange of infonnation. It was for this reason that Jean-Jacques Pireaux, Steven Kowalczyk and I organized the first Metallization of Polymers, a symposium sponsored by the American Chemical Society, which took place in Montreal, September 25-28, 1989; the Proceedings from that symposium were published as ACS Symposium Series 440, (1990). It is this same per ceived lack of a proper forum, and the encouragement of my colleagues, that prompted me to organize this meeting, so as to bring to the attention of the participants new instruments, materials, methods, advances, and, particularly, thoughts in the field of polymer metalliza tion. The meeting was designed as a workshop, with time being made available throughout for discussion and for the consideration of new findings.
Silver Metallization
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Author : Daniel Adams
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-10-27
Silver Metallization written by Daniel Adams and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-27 with Science categories.
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.
Vlsi Metallization
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Author : Norman G. Einspruch
language : en
Publisher: Academic Press
Release Date : 2014-12-01
Vlsi Metallization written by Norman G. Einspruch and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-12-01 with Technology & Engineering categories.
VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
Advanced Metallization For Future Ulsi Volume 427
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 1996-11-08
Advanced Metallization For Future Ulsi Volume 427 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-11-08 with Computers categories.
The feature sizes of microelectronic devices have entered the deep submicron regime. The process integration and structure-properties control of the multilevel metal circuitry demand an interdisciplinary interaction and understanding between manufacturing and research. To realize the vision presented in the national technology road map, material and technological challenges will need to be overcome. For example Cu conductor and its barrier metals and low-dielectric constant insulators are at issue. For materials processing, chemical-mechanical planarization and low-temperature filling of high-aspect ratio vias are challenges. For materials examination, the metrology of submicron structures is nontrivial and for materials reliability, the interplay among multiple driving forces and the response in small-dimension microstructures are intriguing. These issues are the focus of this book from MRS. Topics include: road map, technology and metrology of submicron device structures; reliability issues for Cu metallization; Al interconnects and vias; barrier metal; interlevel low-K dielectrics and contact to Si and compound semiconductors.
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies
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Author : L. B. Rothman
language : en
Publisher:
Release Date : 1987
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies written by L. B. Rothman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Electronics categories.
Effect Of Preheating Upon Metallization Of Iron Ore Pellets
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Author : Robert B. Schluter
language : en
Publisher:
Release Date : 1972
Effect Of Preheating Upon Metallization Of Iron Ore Pellets written by Robert B. Schluter and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1972 with Iron ores categories.
Metallization And Metal Semiconductor Interfaces
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Author : Inder P. Batra
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Metallization And Metal Semiconductor Interfaces written by Inder P. Batra and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
This book represents the work presented at a NATO Advanced Research Workshop on "Metallization and Metal-Semiconductor Interfaces", held at the Technical University of Munich, Garching, W. Germany from 22-26 August 1988. The major focus of the workshop was to evaluate critically the progress made in the area of metal-semiconductor interfaces. The underlying theme was the mechanism of Schottky barrier formation and a serious as sessment of the various models. A significant fraction of the workshop time was also spent in discussing the interaction of alkali metals with semiconductors. Alkali metals on semi conductors form ordered overlayers and the resulting system often exhibits one-dimensional metallic properties. The nature of their interaction has introduced new and exciting com plexities and this was pursued at length during the lively discussions at the workshop. A half a day was devoted to Scanning Tunneling Microscopy, the emphasis being on its utility in providing structural and electronic character of low-coverage regime. The book should pro vide readers with the most current status of the research activity in the general area of metal-semiconductor interfaces at an international level. It should also serve as an excellent introduction to the field, since sufficient review type of material has also been included The workshop organizers, Dr. I. P. Batra (Director), mM Almaden Research Center, San Jose, Prof. S. Ciraci, Bilkent University, Ankara, Prof. C. Y. Pong, University of California, Davis, Prof. Dr. F. Koch (Local Chairman), Technical University Munich, Garching, Dr. H.