Modeling Of Integrated Circuits As Components Of Large Systems
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Modeling Of Integrated Circuits As Components Of Large Systems
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Author : D. N. Pocock
language : en
Publisher:
Release Date : 1972
Modeling Of Integrated Circuits As Components Of Large Systems written by D. N. Pocock and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1972 with Digital integrated circuits categories.
Results are presented on generalized approaches to derive radiation-inclusive simplified models of linear and digital microcircuits. Application of the principle of superposition allows generation of a compact small-signal model of the linear microcircuit, with extension of the model to include large-signal saturation effects. The digital microcircuit model is the combination of current-voltage terminal networks with a logical decision function to represent the truth table of the device. The techniques are used to generate terminal models of an integrated-circuit operational amplifier, voltage comparator, and J-K flip-flop. A factor of 20 to 50 improvement in required computer time and storage was realized with the terminal models over detailed models, with no significant loss in the representation of key performance parameters or radiation environment vulnerability. Preliminary modeling results on the phase-locked loop nonlinear analog microcircuit are also presented. (Author).
System Integration
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Author : Kurt Hoffmann
language : en
Publisher: John Wiley & Sons
Release Date : 2006-02-08
System Integration written by Kurt Hoffmann and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-08 with Technology & Engineering categories.
The development of large-scale integrated systems on a chip has had a dramatic effect on circuit design methodology. Recent years have seen an escalation of interest in systems level integration (system-on-a-chip) and the development of low power, high chip density circuits and systems. Kurt Hoffmann sets out to address a wide range of issues relating to the design and integration of integrated circuit components and provides readers with the methodology by which simple equations for the estimation of transistor geometries and circuit behaviour can be deduced. The broad coverage of this unique book ranges from field effect transistor design, MOS transistor modelling and the fundamentals of digital CMOS circuit design through to MOS memory architecture and design. Highlights the increasing requirement for information on system-on-a-chip design and integration. Combines coverage of semiconductor physics, digital VLSI design and analog integrated circuits in one volume for the first time. Written with the aim of bridging the gap between semiconductor device physics and practical circuit design. Introduces the basic behaviour of semiconductor components for ICs and covers the design of both digital and analog circuits in CMOS and BiCMOS technologies. Broad coverage will appeal to both students and practising engineers alike. Written by a respected expert in the field with a proven track record of publications in this field. Drawing upon considerable experience within both industry and academia, Hoffmann’s outstanding text, will prove an invaluable resource for designers, practising engineers in the semiconductor device field and electronics systems industry as well as Postgraduate students of microelectronics, electrical and computer engineering.
Digital Integrated Circuits
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Author : Evgeni Perelroyzen
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Digital Integrated Circuits written by Evgeni Perelroyzen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Computers categories.
A current trend in digital design-the integration of the MATLAB® components Simulink® and Stateflow® for model building, simulations, system testing, and fault detection-allows for better control over the design flow process and, ultimately, for better system results. Digital Integrated Circuits: Design-for-Test Using Simulink® and Stateflow® illustrates the construction of Simulink models for digital project test benches in certain design-for-test fields. The first two chapters of the book describe the major tools used for design-for-test. The author explains the process of Simulink model building, presents the main library blocks of Simulink, and examines the development of finite-state machine modeling using Stateflow diagrams. Subsequent chapters provide examples of Simulink modeling and simulation for the latest design-for-test fields, including combinational and sequential circuits, controllability, and observability; deterministic algorithms; digital circuit dynamics; timing verification; built-in self-test (BIST) architecture; scan cell operations; and functional and diagnostic testing. The book also discusses the automatic test pattern generation (ATPG) process, the logical determinant theory, and joint test action group (JTAG) interface models. Digital Integrated Circuits explores the possibilities of MATLAB's tools in the development of application-specific integrated circuit (ASIC) design systems. The book shows how to incorporate Simulink and Stateflow into the process of modern digital design.
Charge Based Mos Transistor Modeling
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Author : Christian C. Enz
language : en
Publisher: John Wiley & Sons
Release Date : 2006-08-14
Charge Based Mos Transistor Modeling written by Christian C. Enz and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-08-14 with Technology & Engineering categories.
Modern, large-scale analog integrated circuits (ICs) are essentially composed of metal-oxide semiconductor (MOS) transistors and their interconnections. As technology scales down to deep sub-micron dimensions and supply voltage decreases to reduce power consumption, these complex analog circuits are even more dependent on the exact behavior of each transistor. High-performance analog circuit design requires a very detailed model of the transistor, describing accurately its static and dynamic behaviors, its noise and matching limitations and its temperature variations. The charge-based EKV (Enz-Krummenacher-Vittoz) MOS transistor model for IC design has been developed to provide a clear understanding of the device properties, without the use of complicated equations. All the static, dynamic, noise, non-quasi-static models are completely described in terms of the inversion charge at the source and at the drain taking advantage of the symmetry of the device. Thanks to its hierarchical structure, the model offers several coherent description levels, from basic hand calculation equations to complete computer simulation model. It is also compact, with a minimum number of process-dependant device parameters. Written by its developers, this book provides a comprehensive treatment of the EKV charge-based model of the MOS transistor for the design and simulation of low-power analog and RF ICs. Clearly split into three parts, the authors systematically examine: the basic long-channel intrinsic charge-based model, including all the fundamental aspects of the EKV MOST model such as the basic large-signal static model, the noise model, and a discussion of temperature effects and matching properties; the extended charge-based model, presenting important information for understanding the operation of deep-submicron devices; the high-frequency model, setting out a complete MOS transistor model required for designing RF CMOS integrated circuits. Practising engineers and circuit designers in the semiconductor device and electronics systems industry will find this book a valuable guide to the modelling of MOS transistors for integrated circuits. It is also a useful reference for advanced students in electrical and computer engineering.
Electromagnetic Compatibility Modeling For Integrated Circuits
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Author : Kuan Hsiang Nick Huang
language : en
Publisher: Open Dissertation Press
Release Date : 2017-01-27
Electromagnetic Compatibility Modeling For Integrated Circuits written by Kuan Hsiang Nick Huang and has been published by Open Dissertation Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-27 with categories.
This dissertation, "Electromagnetic Compatibility Modeling for Integrated Circuits" by Kuan Hsiang, Nick, Huang, 黃冠翔, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/power integrity (PI) problems have been broadly attested. But IC packaging electromagnetic interference (EMI) was seldom addressed. Because the electromagnetic emission from IC packagings becomes more critical as the data rate of digital system continues increasing. Its working mechanism and modeling technology are very important. In this thesis, EM emission behaviors of IC packaging are systematically studied for the first time. It was never seen from other literatures. The fundamental principles and properties of electromagnetic radiations caused by heat sinks, vias, traces, and pin maps in IC packaging structures are carefully investigated and modeled. Both theoretical analysis based on first principles and simulated results based on numerical full wave solvers are provided to find out critical impact factors to IC packaging EMI. This work establishes basic modeling components for comprehensive radiation studies. It directly benefits fundamental understandings and guideline development for the optimization of the packaging EMI reduction. Some measurement results are also included to support concluded characterizations and analysis. A summary for IC packaging EMI design rules is discussed in details to conclude the derived design guidelines. Second, a novel data pattern based electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superimpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various signal pattern combinations, which benefits identifying the worst case scenario. The proposed method can be implemented between different tools for specific purposes. In addition, data reconstruction can be evaluated through the phase shift, and it benefits identifying the EMI of any pulse bit pattern. This work offers great convenience for the post-processing, and allows the flexibility of real digital pulse signals. It provides a basic modeling framework for comprehensive radiation studies for IC packaging and PCB EMI reductions. Third, the performance of IC interconnects has been stretched tremendously in recently years by high speed IC systems. Their EM emission and SI modelings have to consider the existence of I/O active devices, such as buffers and drivers. The I/O model is difficult to obtain due to the IP protection and limited information. We proposed to use the X-parameter to model the IC interconnect system. Based on the PHD formalism, X-parameter models provide an accurate frequency-domain method under large-signal operating points to characterize their nonlinear behaviors. Starting from modeling the CMOS inverter, the whole link modeling primarily based on X-parameter for the pulse digital signals was presented. I/O modeling can also be investigated by the proposed new method to understand the impedance effects at high speed serial links. It is the first complete examination of the X-parameter to IC interconnect SI analysis. The nonlinear I/O property represented by IBIS models is also investigated to model
Models For Large Integrated Circuits
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Author : Patrick DeWilde
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Models For Large Integrated Circuits written by Patrick DeWilde and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
A modern microelectronic circuit can be compared to a large construction, a large city, on a very small area. A memory chip, a DRAM, may have up to 64 million bit locations on a surface of a few square centimeters. Each new generation of integrated circuit- generations are measured by factors of four in overall complexity -requires a substantial increase in density from the current technology, added precision, a decrease of the size of geometric features, and an increase in the total usable surface. The microelectronic industry has set the trend. Ultra large funds have been invested in the construction of new plants to produce the ultra large-scale circuits with utmost precision under the most severe conditions. The decrease in feature size to submicrons -0.7 micron is quickly becoming availabl- does not only bring technological problems. New design problems arise as well. The elements from which microelectronic circuits are build, transistors and interconnects, have different shape and behave differently than before. Phenomena that could be neglected in a four micron technology, such as the non-uniformity of the doping profile in a transistor, or the mutual capacitance between two wires, now play an important role in circuit design. This situation does not make the life of the electronic designer easier: he has to take many more parasitic effects into account, up to the point that his ideal design will not function as originally planned.
Three Dimensional Integrated Circuit Design
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Author : Vasilis F. Pavlidis
language : en
Publisher: Newnes
Release Date : 2017-07-04
Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with Technology & Engineering categories.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
A Top Down Constraint Driven Design Methodology For Analog Integrated Circuits
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Author : Henry Chang
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
A Top Down Constraint Driven Design Methodology For Analog Integrated Circuits written by Henry Chang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Analog circuit design is often the bottleneck when designing mixed analog-digital systems. A Top-Down, Constraint-Driven Design Methodology for Analog Integrated Circuits presents a new methodology based on a top-down, constraint-driven design paradigm that provides a solution to this problem. This methodology has two principal advantages: (1) it provides a high probability for the first silicon which meets all specifications, and (2) it shortens the design cycle. A Top-Down, Constraint-Driven Design Methodology for Analog Integrated Circuits is part of an ongoing research effort at the University of California at Berkeley in the Electrical Engineering and Computer Sciences Department. Many faculty and students, past and present, are working on this design methodology and its supporting tools. The principal goals are: (1) developing the design methodology, (2) developing and applying new tools, and (3) `proving' the methodology by undertaking `industrial strength' design examples. The work presented here is neither a beginning nor an end in the development of a complete top-down, constraint-driven design methodology, but rather a step in its development. This work is divided into three parts. Chapter 2 presents the design methodology along with foundation material. Chapters 3-8 describe supporting concepts for the methodology, from behavioral simulation and modeling to circuit module generators. Finally, Chapters 9-11 illustrate the methodology in detail by presenting the entire design cycle through three large-scale examples. These include the design of a current source D/A converter, a Sigma-Delta A/D converter, and a video driver system. Chapter 12 presents conclusions and current research topics. A Top-Down, Constraint-Driven Design Methodology for Analog Integrated Circuits will be of interest to analog and mixed-signal designers as well as CAD tool developers.
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation
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Author : Rene van Leuken
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-02-04
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation written by Rene van Leuken and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-02-04 with Computers categories.
This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation
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Author : José L. Ayala
language : en
Publisher: Springer
Release Date : 2013-01-03
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation written by José L. Ayala and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-01-03 with Computers categories.
This book constitutes the refereed proceedings of the 22nd International Conference on Integrated Circuit and System Design, PATMOS 2012, held in Newcastle, UK Spain, in September 2012. The 25 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems, including reconfigurable hardware such as FPGAs. The technical program focus on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.