Multilevel Interconnect Technology Ii
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Multilevel Interconnect Technology Ii
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Author :
language : en
Publisher:
Release Date : 1998
Multilevel Interconnect Technology Ii written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.
Multilevel Interconnect Technology
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Author :
language : en
Publisher:
Release Date : 1998
Multilevel Interconnect Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Dielectric films categories.
Ulsi Process Integration Ii
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Author : Cor L. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Ulsi Process Integration Ii written by Cor L. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
Copper Interconnect Technology
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Author : Christoph Steinbruchel
language : en
Publisher: SPIE Press
Release Date : 2001
Copper Interconnect Technology written by Christoph Steinbruchel and has been published by SPIE Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Science categories.
A textbook designed to accompany The Society of Photo-Optical Instrumentation Engineers' short course on improving interconnect performance for increased speed in overall circuit performance authored by Steinbrnchel (materials science and engineering, Renselaer Polytechnic Institute) and Chin (senio
Multilevel Interconnect Technology
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Author : Gopal K. Rao
language : en
Publisher: McGraw-Hill Companies
Release Date : 1993
Multilevel Interconnect Technology written by Gopal K. Rao and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Computers categories.
The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
Multilevel Interconnection Technologies
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Author : Pei-Lin Pai
language : en
Publisher:
Release Date : 1987
Multilevel Interconnection Technologies written by Pei-Lin Pai and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with categories.
Handbook Of 3d Integration Volume 1
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Author : Philip Garrou
language : en
Publisher: John Wiley & Sons
Release Date : 2011-09-22
Handbook Of 3d Integration Volume 1 written by Philip Garrou and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-22 with Technology & Engineering categories.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Rapid Thermal And Other Short Time Processing Technologies Ii
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Author : Dim-Lee Kwong
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Rapid Thermal And Other Short Time Processing Technologies Ii written by Dim-Lee Kwong and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies
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Author : L. B. Rothman
language : en
Publisher:
Release Date : 1987
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies written by L. B. Rothman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Electronics categories.
Interconnect Technology And Design For Gigascale Integration
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Author : Jeffrey A. Davis
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Interconnect Technology And Design For Gigascale Integration written by Jeffrey A. Davis and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.