Multilevel Interconnection Technologies
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Multilevel Interconnection Technologies
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Author : Pei-Lin Pai
language : en
Publisher:
Release Date : 1987
Multilevel Interconnection Technologies written by Pei-Lin Pai and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with categories.
Multilevel Interconnect Technology
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Author :
language : en
Publisher:
Release Date : 1999
Multilevel Interconnect Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Dielectric films categories.
Multilevel Interconnect Technology
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Author : Gopal K. Rao
language : en
Publisher: McGraw-Hill Companies
Release Date : 1993
Multilevel Interconnect Technology written by Gopal K. Rao and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Computers categories.
The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies
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Author : L. B. Rothman
language : en
Publisher:
Release Date : 1987
Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies written by L. B. Rothman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Electronics categories.
Microelectronic Device And Multilevel Interconnection Technology
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Author :
language : en
Publisher:
Release Date : 1995
Microelectronic Device And Multilevel Interconnection Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Microelectronics categories.
Copper Interconnect Technology
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Author : Christoph Steinbruchel
language : en
Publisher: SPIE Press
Release Date : 2001
Copper Interconnect Technology written by Christoph Steinbruchel and has been published by SPIE Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Science categories.
A textbook designed to accompany The Society of Photo-Optical Instrumentation Engineers' short course on improving interconnect performance for increased speed in overall circuit performance authored by Steinbrnchel (materials science and engineering, Renselaer Polytechnic Institute) and Chin (senio
Multilevel Interconnection
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Author : Hoang H. Hoang
language : en
Publisher:
Release Date : 1993
Multilevel Interconnection written by Hoang H. Hoang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.
A Multilevel Planar Interconnect Technology Utilizing The Selective Deposition Of Tungsten
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Author : David Charles Thomas
language : en
Publisher:
Release Date : 1990
A Multilevel Planar Interconnect Technology Utilizing The Selective Deposition Of Tungsten written by David Charles Thomas and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Integrated circuits categories.
Handbook Of Semiconductor Manufacturing Technology
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Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Advanced Interconnects For Ulsi Technology
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-17
Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-17 with Technology & Engineering categories.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.