Physics Of Failure In Electronics Proceedings Of The Symposium On The Physics Of Failure In Electronics 3
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Physics Of Failure In Electronics Proceedings Of The Symposium On The Physics Of Failure In Electronics 3
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Author :
language : en
Publisher:
Release Date : 1964
Physics Of Failure In Electronics Proceedings Of The Symposium On The Physics Of Failure In Electronics 3 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1964 with categories.
Ibm 1401 Computer Produced And Maintained Printed Book Catalogs At The Lawrence Radiation Laboratory
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Author : University of California, Berkeley
language : en
Publisher:
Release Date : 1964
Ibm 1401 Computer Produced And Maintained Printed Book Catalogs At The Lawrence Radiation Laboratory written by University of California, Berkeley and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1964 with Catalogs categories.
The Rf And Microwave Handbook 3 Volume Set
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Author : Mike Golio
language : en
Publisher: CRC Press
Release Date : 2018-10-08
The Rf And Microwave Handbook 3 Volume Set written by Mike Golio and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-08 with Technology & Engineering categories.
By 1990 the wireless revolution had begun. In late 2000, Mike Golio gave the world a significant tool to use in this revolution: The RF and Microwave Handbook. Since then, wireless technology spread across the globe with unprecedented speed, fueled by 3G and 4G mobile technology and the proliferation of wireless LANs. Updated to reflect this tremendous growth, the second edition of this widely embraced, bestselling handbook divides its coverage conveniently into a set of three books, each focused on a particular aspect of the technology. Six new chapters cover WiMAX, broadband cable, bit error ratio (BER) testing, high-power PAs (power amplifiers), heterojunction bipolar transistors (HBTs), as well as an overview of microwave engineering. Over 100 contributors, with diverse backgrounds in academic, industrial, government, manufacturing, design, and research reflect the breadth and depth of the field. This eclectic mix of contributors ensures that the coverage balances fundamental technical issues with the important business and marketing constraints that define commercial RF and microwave engineering. Focused chapters filled with formulas, charts, graphs, diagrams, and tables make the information easy to locate and apply to practical cases. The new format, three tightly focused volumes, provides not only increased information but also ease of use. You can find the information you need quickly, without wading through material you don’t immediately need, giving you access to the caliber of data you have come to expect in a much more user-friendly format.
Mems And Microstructures In Aerospace Applications
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Author : Robert Osiander
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Mems And Microstructures In Aerospace Applications written by Robert Osiander and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.
Nuclear Science Abstracts
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Author :
language : en
Publisher:
Release Date : 1973
Nuclear Science Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1973 with Nuclear energy categories.
Reliability Abstracts And Technical Reviews
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Author :
language : en
Publisher:
Release Date : 1970
Reliability Abstracts And Technical Reviews written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1970 with Reliability (Engineering) categories.
Reliability Assessments
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Author : Franklin Richard Nash, Ph.D.
language : en
Publisher: CRC Press
Release Date : 2017-07-12
Reliability Assessments written by Franklin Richard Nash, Ph.D. and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-12 with Business & Economics categories.
This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.
Electromigration In Thin Films And Electronic Devices
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Author : Choong-Un Kim
language : en
Publisher: Elsevier
Release Date : 2011-08-28
Electromigration In Thin Films And Electronic Devices written by Choong-Un Kim and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-08-28 with Technology & Engineering categories.
Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. - Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits - Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration - Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure
Encapsulation Technologies For Electronic Applications
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Author : Haleh Ardebili
language : en
Publisher: William Andrew
Release Date : 2009-07-22
Encapsulation Technologies For Electronic Applications written by Haleh Ardebili and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-07-22 with Technology & Engineering categories.
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. - Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Coverage of environmentally friendly 'green encapsulants' - Practical coverage of faults and defects: how to analyze them and how to avoid them
Integrated System Health Management
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Author : Jiuping Xu
language : en
Publisher: Academic Press
Release Date : 2017-05-18
Integrated System Health Management written by Jiuping Xu and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-05-18 with Technology & Engineering categories.
ISHM is an innovative combination of technologies and methods that offers solutions to the reliability problems caused by increased complexities in design, manufacture, use conditions, and maintenance. Its key strength is in the successful integration of reliability (quantitative estimation of successful operation or failure), "diagnosibility" (ability to determine the fault source), and maintainability (how to maintain the performance of a system in operation). It draws on engineering issues such as advanced sensor monitoring, redundancy management, probabilistic reliability theory, artificial intelligence for diagnostics and prognostics, and formal validation methods, but also "quasi-technical" techniques and disciplines such as quality assurance, systems architecture and engineering, knowledge capture, information fusion, testability and maintainability, and human factors. This groundbreaking book defines and explains this new discipline, providing frameworks and methodologies for implementation and further research. Each chapter includes experiments, numerical examples, simulations and case studies. It is the ideal guide to this crucial topic for professionals or researchers in aerospace systems, systems engineering, production engineering, and reliability engineering. - Solves prognostic information selection and decision-level information fusion issues - Presents integrated evaluation methodologies for complex aerospace system health conditions and software system reliability assessment - Proposes a framework to perform fault diagnostics with a distributed intelligent agent system and a data mining approach for multistate systems - Explains prognostic methods that combine both the qualitative system running state prognostics and the quantitative remaining useful life prediction