Proceedings From The Tenth Meeting Of The Symposium On Polymers For Microelectronics
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Proceedings From The Tenth Meeting Of The Symposium On Polymers For Microelectronics
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Author : Craig C. Schuckert
language : en
Publisher:
Release Date : 2002
Proceedings From The Tenth Meeting Of The Symposium On Polymers For Microelectronics written by Craig C. Schuckert and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Microelectronics categories.
Nano Bio Electronic Photonic And Mems Packaging
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Author : C.P. Wong
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-23
Nano Bio Electronic Photonic And Mems Packaging written by C.P. Wong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-23 with Technology & Engineering categories.
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Ceramic Integration And Joining Technologies
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Author : Mrityunjay Singh
language : en
Publisher: John Wiley & Sons
Release Date : 2011-09-26
Ceramic Integration And Joining Technologies written by Mrityunjay Singh and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-26 with Technology & Engineering categories.
This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
Nanopackaging
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Author : James E. Morris
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-30
Nanopackaging written by James E. Morris and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-30 with Technology & Engineering categories.
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Reliability Of Organic Compounds In Microelectronics And Optoelectronics
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Author : Willem Dirk van Driel
language : en
Publisher: Springer Nature
Release Date : 2022-01-31
Reliability Of Organic Compounds In Microelectronics And Optoelectronics written by Willem Dirk van Driel and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-01-31 with Technology & Engineering categories.
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Proceedings Of Fourth International Conference On Inventive Material Science Applications
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Author : V. Bindhu
language : en
Publisher: Springer Nature
Release Date : 2021-10-19
Proceedings Of Fourth International Conference On Inventive Material Science Applications written by V. Bindhu and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-10-19 with Technology & Engineering categories.
The volume is a collection of best selected research papers presented at the 4th International Conference on Inventive Material Science Applications (ICIMA 2021) organized by PPG Institute of Technology, Coimbatore, India during 14 – 15 May 2021. The book includes original research by material science researchers towards developing a compact and efficient functional elements and structures for micro, nano and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic materials, medical electronics, computational material science, wearable electronic devices and models, and optical/nano-sensors.
Electrically Conductive Adhesives
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Author : Rajesh Gomatam
language : en
Publisher: BRILL
Release Date : 2008-12-23
Electrically Conductive Adhesives written by Rajesh Gomatam and has been published by BRILL this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-23 with Technology & Engineering categories.
This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Handbook Of Polymer Coatings For Electronics
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Author : James J. Licari
language : en
Publisher: William Andrew
Release Date : 1990-12-31
Handbook Of Polymer Coatings For Electronics written by James J. Licari and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-12-31 with Science categories.
This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.
Dielectric Films For Advanced Microelectronics
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2007-04-04
Dielectric Films For Advanced Microelectronics written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-04 with Technology & Engineering categories.
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Moisture Sensitivity Of Plastic Packages Of Ic Devices
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Author : X.J. Fan
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-07-23
Moisture Sensitivity Of Plastic Packages Of Ic Devices written by X.J. Fan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-07-23 with Technology & Engineering categories.
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.