Quality Conformance And Qualification Of Microelectronic Packages And Interconnects
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Quality Conformance And Qualification Of Microelectronic Packages And Interconnects
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Author : Michael G. Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 1994-12-13
Quality Conformance And Qualification Of Microelectronic Packages And Interconnects written by Michael G. Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-12-13 with Technology & Engineering categories.
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Encapsulation Technologies For Electronic Applications
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Author : Haleh Ardebili
language : en
Publisher: William Andrew
Release Date : 2018-10-23
Encapsulation Technologies For Electronic Applications written by Haleh Ardebili and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-23 with Technology & Engineering categories.
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Rf And Microwave Applications And Systems
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Author : Mike Golio
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Rf And Microwave Applications And Systems written by Mike Golio and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
This volume, RF and Microwave Applications and Systems, includes a wide range of articles that discuss RF and microwave systems used for communication and radar and heating applications. Commercial, avionics, medical, and military applications are addressed. An overview of commercial communications systems is provided. Past, current, and emerging cellular systems, navigation systems, and satellite-based systems are discussed. Specific voice and data commercial systems are investigated more thoroughly in individual chapters that follow. Detailed discussions of military electronics, avionics, and radar (both military and automotive) are provided in separate chapters. A chapter focusing on FR/microwave energy used for therapeutic medicine is also provided. Systems considerations including thermal, mechanical, reliability, power management, and safety are discussed in separate chapters. Engineering processes are also explored in articles about corporate initiatives, cost modeling, and design reviews. The book closes with a discussion of the underlying physics of electromagnetic propagation and interference. In addition to new chapters on WiMAX and broadband cable, nearly every existing chapter features extensive updates and several were completely rewritten to reflect the massive changes areas such as radio navigation and electronic warfare.
Microoptics
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Author : Stefan Sinzinger
language : en
Publisher: John Wiley & Sons
Release Date : 2006-03-06
Microoptics written by Stefan Sinzinger and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-03-06 with Science categories.
Microoptics is an important enabling technology for many areas of application. In this updated second edition of their modern text and reference book, Stefan Sinzinger and Jürgen Jahns expertly and comprehensively present the basics and applications in microoptics, while incorporating the most important developments in recent years. An absolute must for physicists and electrical engineers, from advanced students right up to designers working in the field.
Product Integrity And Reliability In Design
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Author : John W. Evans
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
Product Integrity And Reliability In Design written by John W. Evans and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Product Integrity and Reliability in Design is intended to serve either as a text for graduate students or as a reference for practicing engineers. The book develops the root-cause approach to reliability - often referred to as "physics of failure" in the reliability engineering field. It approaches the subject from the point of view of a process and integrates the necessary methods to support that process. The book can be used to teach first- or second-year postgraduate students in mechanical, electrical, manufacturing and materials engineering about addressing issues of reliability during product development. It will also serve practicing engineers involved in the design and development of electrical and mechanical components and systems, as a reference. The book takes an interdisciplinary approach appropriate to system engineering, stressing concepts that can be integrated into design and placing less emphasis on traditional assumptions about reliability and analysis as a separate development activity. Several case studies emphasize the understanding of failure mechanisms and failure prevention and show how reliability methods, including simulation and testing can be integrated into design and development.
Handbook Of Systems Engineering And Management
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Author : Andrew P. Sage
language : en
Publisher: John Wiley & Sons
Release Date : 2014-12-31
Handbook Of Systems Engineering And Management written by Andrew P. Sage and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-12-31 with Technology & Engineering categories.
The trusted handbook—now in a new edition This newly revised handbook presents a multifaceted view of systems engineering from process and systems management perspectives. It begins with a comprehensive introduction to the subject and provides a brief overview of the thirty-four chapters that follow. This introductory chapter is intended to serve as a "field guide" that indicates why, when, and how to use the material that follows in the handbook. Topical coverage includes: systems engineering life cycles and management; risk management; discovering system requirements; configuration management; cost management; total quality management; reliability, maintainability, and availability; concurrent engineering; standards in systems engineering; system architectures; systems design; systems integration; systematic measurements; human supervisory control; managing organizational and individual decision-making; systems reengineering; project planning; human systems integration; information technology and knowledge management; and more. The handbook is written and edited for systems engineers in industry and government, and to serve as a university reference handbook in systems engineering and management courses. By focusing on systems engineering processes and systems management, the editors have produced a long-lasting handbook that will make a difference in the design of systems of all types that are large in scale and/or scope.
Environmentally Conscious Manufacturing
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Author : Myer Kutz
language : en
Publisher: John Wiley & Sons
Release Date : 2007-03-16
Environmentally Conscious Manufacturing written by Myer Kutz and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-03-16 with Technology & Engineering categories.
The second volume of the Wiley series, Environmentally Conscious Manufacturing focuses on environmentally preferable approaches to manufacturing. Contributors present and discuss the technologies engineers need to specify and employ to make manufacturing operations environmentally friendly and conform to environmental regulations. Chapters cover Hazardous Waste Minimization and Management; Cost-Effective Manufacturing; Real-time Process Monitoring and Control; Ethics in ECM; Governmental Regulations and Policies, and Total Quality Management. In each chapter case studies are provided to guide readers in areas outside their expertise.
Adhesives Technology For Electronic Applications
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Author : James J. Licari
language : en
Publisher: Elsevier
Release Date : 2005-08-30
Adhesives Technology For Electronic Applications written by James J. Licari and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-08-30 with Technology & Engineering categories.
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.
Long Term Non Operating Reliability Of Electronic Products
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Author : Judy Pecht
language : en
Publisher: CRC Press
Release Date : 2019-07-23
Long Term Non Operating Reliability Of Electronic Products written by Judy Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-07-23 with Mathematics categories.
In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation, shock, and vibration. Non-operating reliability is especially critical for life-saving electronic products such as fire alarm systems, standby power sources, and burglar alarms. Air bags in automobiles, earthquake alarm systems, and radiation warning systems in nuclear power plants are also covered. This physics-of-failure approach is also important to maintaining defense hardware such as missiles and munitions systems which often lie dormant for years before being deployed on very short notice
Avionics
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Author : Cary R. Spitzer
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Avionics written by Cary R. Spitzer and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Renamed to reflect the increased role of digital electronics in modern flight control systems, Cary Spitzer's industry-standard Digital Avionics Handbook, Second Edition is available in two comprehensive volumes designed to provide focused coverage for specialists working in different areas of avionics development. The second installment, Avionics: Development and Implementation explores the practical side of avionics. The book examines such topics as modeling and simulation, electronic hardware reliability, certification, fault tolerance, and several examples of real-world applications. New chapters discuss RTCA DO-297/EUROCAE ED-124 integrated modular avionics development and the Genesis platform.