Reliability And Yield Problems Of Wire Bonding In Microelectronics
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Reliability And Yield Problems Of Wire Bonding In Microelectronics
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Author : George G. Harman
language : en
Publisher: International Society of Hybrid
Release Date : 1989-01-01
Reliability And Yield Problems Of Wire Bonding In Microelectronics written by George G. Harman and has been published by International Society of Hybrid this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-01-01 with Technology & Engineering categories.
Wire Bonding In Microelectronics
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Author : George Harman
language : en
Publisher: McGraw Hill Professional
Release Date : 2009-06-05
Wire Bonding In Microelectronics written by George Harman and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-06-05 with Technology & Engineering categories.
The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book's full-color figures plus animations
Ire Bonding In Microelectronics
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Author : George G. Harman
language : en
Publisher: McGraw Hill Professional
Release Date : 1997
Ire Bonding In Microelectronics written by George G. Harman and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch
Wire Bonding In Microelectronics 3 E
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Author : George Harman
language : en
Publisher: McGraw-Hill Education
Release Date : 2010-02-10
Wire Bonding In Microelectronics 3 E written by George Harman and has been published by McGraw-Hill Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-02-10 with Technology & Engineering categories.
The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all of the book's full-color figures plus animations.
Copper Wire Bonding
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Author : Preeti S Chauhan
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-09-20
Copper Wire Bonding written by Preeti S Chauhan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-09-20 with Technology & Engineering categories.
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Thermal Stress And Strain In Microelectronics Packaging
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Author : John Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Thermal Stress And Strain In Microelectronics Packaging written by John Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Integrated Circuit Hybrid And Multichip Module Package Design Guidelines
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Author : Michael Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 1994-03-31
Integrated Circuit Hybrid And Multichip Module Package Design Guidelines written by Michael Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-03-31 with Technology & Engineering categories.
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
Influence Of Temperature On Microelectronics And System Reliability
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Author : Pradeep Lall
language : en
Publisher: CRC Press
Release Date : 2020-07-09
Influence Of Temperature On Microelectronics And System Reliability written by Pradeep Lall and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-09 with Technology & Engineering categories.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Quality Conformance And Qualification Of Microelectronic Packages And Interconnects
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Author : Michael Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 1994-12-13
Quality Conformance And Qualification Of Microelectronic Packages And Interconnects written by Michael Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-12-13 with Technology & Engineering categories.
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.