Special Issue Advanced Metallization For Ulsi Applications
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Special Issue Advanced Metallization For Ulsi Applications
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Author : Osamu Nakatsuka
language : en
Publisher:
Release Date : 2019
Special Issue Advanced Metallization For Ulsi Applications written by Osamu Nakatsuka and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with categories.
Advanced Metallization For Ulsi Applications
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Author : Osamu Nakatsuka
language : en
Publisher:
Release Date : 2016
Advanced Metallization For Ulsi Applications written by Osamu Nakatsuka and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with categories.
Advanced Metallization For Ulsi Applications
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Author : Osamu Nakatsuka
language : en
Publisher:
Release Date : 2020
Advanced Metallization For Ulsi Applications written by Osamu Nakatsuka and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020 with categories.
Handbook Of Advanced Plasma Processing Techniques
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Author : R.J. Shul
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
Handbook Of Advanced Plasma Processing Techniques written by R.J. Shul and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Advanced Metallization For Future Ulsi Volume 427
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 1996-11-08
Advanced Metallization For Future Ulsi Volume 427 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-11-08 with Computers categories.
The feature sizes of microelectronic devices have entered the deep submicron regime. The process integration and structure-properties control of the multilevel metal circuitry demand an interdisciplinary interaction and understanding between manufacturing and research. To realize the vision presented in the national technology road map, material and technological challenges will need to be overcome. For example Cu conductor and its barrier metals and low-dielectric constant insulators are at issue. For materials processing, chemical-mechanical planarization and low-temperature filling of high-aspect ratio vias are challenges. For materials examination, the metrology of submicron structures is nontrivial and for materials reliability, the interplay among multiple driving forces and the response in small-dimension microstructures are intriguing. These issues are the focus of this book from MRS. Topics include: road map, technology and metrology of submicron device structures; reliability issues for Cu metallization; Al interconnects and vias; barrier metal; interlevel low-K dielectrics and contact to Si and compound semiconductors.
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Mechanics Of Solid Interfaces
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Author : Muriel Braccini
language : en
Publisher: John Wiley & Sons
Release Date : 2013-05-21
Mechanics Of Solid Interfaces written by Muriel Braccini and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-05-21 with Science categories.
The growing occurrence of heterogeneous materials such as composites or coated substrates in structural parts makes it necessary for designers and scientists to deal with the specific features of the mechanical behavior of solid interfaces. This book introduces basic concepts on mechanical problems related to the presence of solid/solid interfaces and their practical applications. The various topics discussed here are the mechanical characterization of interfaces, the initiation and growth of cracks along interfaces, the origin and control of interface adhesion, focusing in particular on thin films on substrate systems. It is designed and structured to provide a solid background in the mechanics of heterogeneous materials to help students in materials science, as well as scientists and engineers.
Dielectric Films For Advanced Microelectronics
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2007-04-04
Dielectric Films For Advanced Microelectronics written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-04 with Technology & Engineering categories.
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Advanced Metallization Conference 1999 Amc 1999 Volume 15
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Author : Mihal E. Gross
language : en
Publisher:
Release Date : 2000
Advanced Metallization Conference 1999 Amc 1999 Volume 15 written by Mihal E. Gross and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Microelectronic Packaging
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Author : M. Datta
language : en
Publisher: CRC Press
Release Date : 2004-12-20
Microelectronic Packaging written by M. Datta and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-12-20 with Technology & Engineering categories.
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.