System On Package Miniaturization Of The Entire System
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System On Package
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Author : Rao Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2007-07-22
System On Package written by Rao Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-07-22 with Technology & Engineering categories.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Introduction To System On Package Sop
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Author :
language : en
Publisher:
Release Date : 2008
Introduction To System On Package Sop written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Microelectronic packaging categories.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems8221; used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat gener.
System On Package Miniaturization Of The Entire System
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Author : Rao Tummala
language : en
Publisher: Mcgraw-hill
Release Date : 2008-04-15
System On Package Miniaturization Of The Entire System written by Rao Tummala and has been published by Mcgraw-hill this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-04-15 with Technology categories.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Wafer Level Chip Scale Packaging
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Author : Shichun Qu
language : en
Publisher: Springer
Release Date : 2014-09-10
Wafer Level Chip Scale Packaging written by Shichun Qu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-09-10 with Technology & Engineering categories.
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Future Trends In Microelectronics
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Author : Serge Luryi
language : en
Publisher: John Wiley & Sons
Release Date : 2016-09-12
Future Trends In Microelectronics written by Serge Luryi and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-09-12 with Technology & Engineering categories.
Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology.
Biomedical Microsystems
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Author : Ellis Meng
language : en
Publisher: CRC Press
Release Date : 2010-09-29
Biomedical Microsystems written by Ellis Meng and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-09-29 with Medical categories.
Poised to dramatically impact human health, biomedical microsystems (bioMEMS) technologies incorporate various aspects from materials science, biology, chemistry, physics, medicine, and engineering. Reflecting the highly interdisciplinary nature of this area, Biomedical Microsystems covers the fundamentals of miniaturization, biomaterials, microfab
Micro And Nanotechnology Enabled Applications For Portable Miniaturized Analytical Systems
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Author : Sabu Thomas
language : en
Publisher: Elsevier
Release Date : 2021-10-12
Micro And Nanotechnology Enabled Applications For Portable Miniaturized Analytical Systems written by Sabu Thomas and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-10-12 with Technology & Engineering categories.
Micro- and Nanotechnology Enabled Applications for Portable Miniaturized Analytical Systems outlines the basic principles of miniaturized analytical devices, such as spectrometric, separation, imaging and electrochemical miniaturized instruments. Concepts such as smartphone-enabled miniaturized detection systems and micro/nanomachines are also reviewed. Subsequent chapters explore the emerging application of these mobile devices for miniaturized analysis in various fields, including medicine and biomedicine, environmental chemistry, food chemistry, and forensic chemistry. This is an important reference source for materials scientists and engineers wanting to understand how miniaturization techniques are being used to create a range of efficient, sustainable electronic and optical devices. Miniaturization describes the concept of manufacturing increasingly smaller mechanical, optical, and electronic products and devices. These smaller instruments can be used to produce micro- and nanoscale components required for analytical procedures. A variety of micro/nanoscale materials have been synthesized and used in analytical procedures, such as sensing materials, sorbents, adsorbents, catalysts, and reactors. The miniaturization of analytical instruments can be applied to the different steps of analytical procedures, such as sample preparation, analytical separation, and detection, reducing the total cost of manufacturing the instruments and the needed reagents and organic solvents. Outlines how miniaturization techniques can be used to create new optical and electronic micro- and nanodevices Explores major application areas, including biomedicine, environmental science and security Assesses the major challenges of using miniaturization techniques
Material Integrated Intelligent Systems
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Author : Stefan Bosse
language : en
Publisher: John Wiley & Sons
Release Date : 2017-11-23
Material Integrated Intelligent Systems written by Stefan Bosse and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-11-23 with Technology & Engineering categories.
Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems. The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three-tiered approach such that readers can gain basic, intermediate, and advanced topical knowledge. The technology section of the book is divided into chapters covering the basics of sensor integration in materials, the challenges associated with this approach, data processing, evaluation, and validation, as well as methods for achieving an autonomous energy supply. The applications part then goes on to showcase typical scenarios where material-integrated intelligent systems are already in use, such as for structural health monitoring and smart textiles.
Microfluidic Technologies For Miniaturized Analysis Systems
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Author : Steffen Hardt
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-09-29
Microfluidic Technologies For Miniaturized Analysis Systems written by Steffen Hardt and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-09-29 with Technology & Engineering categories.
This book addresses Lab-on-a-Chip devices. It focuses on microfluidic technologies that have emerged in the past decade. Coverage presents a comprehensive listing of the most promising microfluidic technologies in the Lab-on-a-Chip field. It also details technologies that can be viewed as toolboxes needed to set up complex Lab-on-a-Chip systems.