Testing Of Interposer Based 2 5d Integrated Circuits
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Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-05-06
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-06 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Testing Of Interposer Based 2 5d Integrated Circuits
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Author : Ran Wang
language : en
Publisher: Springer
Release Date : 2018-05-09
Testing Of Interposer Based 2 5d Integrated Circuits written by Ran Wang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-09 with Technology & Engineering categories.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
Electronic Design Automation For Ic Implementation Circuit Design And Process Technology
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Author : Luciano Lavagno
language : en
Publisher: CRC Press
Release Date : 2017-02-03
Electronic Design Automation For Ic Implementation Circuit Design And Process Technology written by Luciano Lavagno and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-03 with Technology & Engineering categories.
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Design And Modeling For 3d Ics And Interposers
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Author : Madhavan Swaminathan
language : en
Publisher: World Scientific Publishing Company Incorporated
Release Date : 2013
Design And Modeling For 3d Ics And Interposers written by Madhavan Swaminathan and has been published by World Scientific Publishing Company Incorporated this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with Technology & Engineering categories.
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Surface Mount Technology
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Author : Ray P. Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Surface Mount Technology written by Ray P. Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
Architects Data
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Author : Ernst Neufert
language : en
Publisher: Wiley-Blackwell
Release Date : 1991-01-15
Architects Data written by Ernst Neufert and has been published by Wiley-Blackwell this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-01-15 with Architecture categories.
This is an essential aid in the initial design and planning of a project. The relevant building type is located by a comprehensive index and cross reference system, a condensed commentary covers user requireements, planning criteria, basic dimensions and other considerations of function, siting aspect etc. A system of references based on an extensive bibliography supports the text. In every section plans, sections, site layouts, design details and graphs illustrated key aspects of a building type's design. Most illustrations are dimensioned or scaled - the metric system of measurement is used throughout, and the equivalent in feet/inches can easily be read either off a graphic scale on the page or from the built-in conversion table. The illustrations are international in origin and include both well know and less famous designers. Architects Data is primarily a handbook of building types rather than of construction techniques and details. However its treatment of components (such as doors and windows) and of spaces for building services is extremely thorough, since consideration of this data is an essential element of the planning process. The opening pages of basic data on man and his buildings cover critical subjects such as scale, drawing practice, noise, light and space for the same reason. Particular attention has also been paid to the implications of energy conservation, means of escape from fire and the needs of the elderly and the disabled.
Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics
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Author : Philip Y. Paik
language : en
Publisher: Artech House Publishers
Release Date : 2007
Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics written by Philip Y. Paik and has been published by Artech House Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Science categories.
Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.
2024 Ieee International Conference On Design Test And Technology Of Integrated Systems Dttis
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2024-10-14
2024 Ieee International Conference On Design Test And Technology Of Integrated Systems Dttis written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-14 with Technology & Engineering categories.
The aim of the conference is to cope with the rapidly progressing technology which, today, reaches the nanometer scale The areas of interest include design, test and technology of electronic products, ranging from integrated circuit modules, chiplets and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products DTTIS will show innovations in system and platform design, which extend beyond a single integrated circuit These platforms may include 2 5D 3D chiplet based system in package, system on interposer, and multi die integrations It will be an pportunity for researchers to present and discuss their latest work DTTIS is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design technology boundary by bringing design, test, technology, and process experts together
Test And Design For Testability In Mixed Signal Integrated Circuits
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Author : Jose Luis Huertas Díaz
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-02-23
Test And Design For Testability In Mixed Signal Integrated Circuits written by Jose Luis Huertas Díaz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-02-23 with Technology & Engineering categories.
Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.