Testing Of Interposer Based 2 5d Integrated Circuits
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Testing Of Interposer Based 2 5d Integrated Circuits
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Author : Ran Wang
language : en
Publisher: Springer
Release Date : 2018-05-09
Testing Of Interposer Based 2 5d Integrated Circuits written by Ran Wang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-09 with Technology & Engineering categories.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-05-06
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-06 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Electronic Design Automation For Ic Implementation Circuit Design And Process Technology
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Author : Luciano Lavagno
language : en
Publisher: CRC Press
Release Date : 2017-02-03
Electronic Design Automation For Ic Implementation Circuit Design And Process Technology written by Luciano Lavagno and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-03 with Technology & Engineering categories.
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
2024 Ieee International Conference On Design Test And Technology Of Integrated Systems Dttis
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2024-10-14
2024 Ieee International Conference On Design Test And Technology Of Integrated Systems Dttis written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-14 with Technology & Engineering categories.
The aim of the conference is to cope with the rapidly progressing technology which, today, reaches the nanometer scale The areas of interest include design, test and technology of electronic products, ranging from integrated circuit modules, chiplets and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products DTTIS will show innovations in system and platform design, which extend beyond a single integrated circuit These platforms may include 2 5D 3D chiplet based system in package, system on interposer, and multi die integrations It will be an pportunity for researchers to present and discuss their latest work DTTIS is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design technology boundary by bringing design, test, technology, and process experts together
Test And Design For Testability In Mixed Signal Integrated Circuits
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Author : Jose Luis Huertas Díaz
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-02-23
Test And Design For Testability In Mixed Signal Integrated Circuits written by Jose Luis Huertas Díaz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-02-23 with Technology & Engineering categories.
Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.
Automatic Testing And Evaluation Of Digital Integrated Circuits
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Author : James T. Healy
language : en
Publisher:
Release Date : 1981
Automatic Testing And Evaluation Of Digital Integrated Circuits written by James T. Healy and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1981 with Technology & Engineering categories.
Wafer Level Testing And Test During Burn In For Integrated Circuits
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Author : Sudarshan Bahukudumbi
language : en
Publisher: Artech House
Release Date : 2010
Wafer Level Testing And Test During Burn In For Integrated Circuits written by Sudarshan Bahukudumbi and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Technology & Engineering categories.
Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.
Semiconductor Measurement Technology
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Author : Harry A. Schafft
language : en
Publisher:
Release Date : 1974
Semiconductor Measurement Technology written by Harry A. Schafft and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1974 with categories.
Integrated Circuit Test Engineering
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Author : Ian A. Grout
language : en
Publisher: Springer Science & Business Media
Release Date : 2005-12-08
Integrated Circuit Test Engineering written by Ian A. Grout and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-12-08 with Technology & Engineering categories.
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively