The Elfnet Book On Failure Mechanisms Testing Methods And Quality Issues Of Lead Free Solder Interconnects
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The Elfnet Book On Failure Mechanisms Testing Methods And Quality Issues Of Lead Free Solder Interconnects
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Author : Günter Grossmann
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-05-12
The Elfnet Book On Failure Mechanisms Testing Methods And Quality Issues Of Lead Free Solder Interconnects written by Günter Grossmann and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-12 with Technology & Engineering categories.
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
Humidity And Electronics
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Author : Rajan Ambat
language : en
Publisher: Woodhead Publishing
Release Date : 2021-11-30
Humidity And Electronics written by Rajan Ambat and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-11-30 with Technology & Engineering categories.
Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. - Provides basic and applied knowledge surrounding corrosion in electronics - Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms - Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level
Corrosion Science Modern Trends And Applications
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Author : N. Suresh Kumar
language : en
Publisher: Bentham Science Publishers
Release Date : 2021-05-24
Corrosion Science Modern Trends And Applications written by N. Suresh Kumar and has been published by Bentham Science Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-24 with Science categories.
The advent of Industry 4.0 has opened a data-rich avenue of predicting and controlling premature degradation of industrial materials. For any industrial construction or manufacturing projects, performing analysis on the structural integrity of materials is crucial for their sustainability. Corrosion Science: Modern Trends and Applications gives scholars a snapshot of recent contributions and development in the field of material corrosion. The book presents 12 chapters that cover topics such as corrosion testing methods, anti-corrosive coating mechanisms, corrosion in different types of products (electronics, polymers), industrial systems (power plants, concrete constructions, and hydraulic systems), and corrosion as a result of environmental characteristics (such as marine surroundings). The breadth of topics covered coupled with the reader-friendly presentation of the book make it highly beneficial for students, research scholars, faculty members, and R&D specialists working in the area of corrosion science, material science, solid-state science, chemical engineering, and nanotechnology. Readers will be equipped with the knowledge to understand and plan industrial processes that involve measuring the reliability and integrity of material structures which are impacted by corrosive factors.
Surface Mount Technology
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Author : Ray P. Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Surface Mount Technology written by Ray P. Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
Thermodynamics Diffusion And The Kirkendall Effect In Solids
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Author : Aloke Paul
language : en
Publisher: Springer
Release Date : 2014-07-16
Thermodynamics Diffusion And The Kirkendall Effect In Solids written by Aloke Paul and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-07-16 with Science categories.
In this book basic and some more advanced thermodynamics and phase as well as stability diagrams relevant for diffusion studies are introduced. Following, Fick’s laws of diffusion, atomic mechanisms, interdiffusion, intrinsic diffusion, tracer diffusion and the Kirkendall effect are discussed. Short circuit diffusion is explained in detail with an emphasis on grain boundary diffusion. Recent advances in the area of interdiffusion will be introduced. Interdiffusion in multi-component systems is also explained. Many practical examples will be given, such that researches working in this area can learn the practical evaluation of various diffusion parameters from experimental results. Large number of illustrations and experimental results are used to explain the subject. This book will be appealing for students, academicians, engineers and researchers in academic institutions, industry research and development laboratories.
Tms 2019 148th Annual Meeting Exhibition Supplemental Proceedings
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Author : & The Minerals, Metals Materials Society
language : en
Publisher: Springer
Release Date : 2019-02-26
Tms 2019 148th Annual Meeting Exhibition Supplemental Proceedings written by & The Minerals, Metals Materials Society and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-26 with Technology & Engineering categories.
This collection features papers presented at the 148th Annual Meeting & Exhibition of The Minerals, Metals & Materials Society.
Solder Joint Reliability
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
The Circuit Designer S Companion
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Author : Tim Williams
language : en
Publisher:
Release Date : 1993-01-01
The Circuit Designer S Companion written by Tim Williams and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993-01-01 with Technology & Engineering categories.
This is a compendium of practical wisdom concerning real world aspects of electronic circuit design gathered during years of experience in industry. The Companion enables circuit designers to produce more effective working circuits. Valued by linear and digital designers alike, this guide explains and outlines solutions that take into account the imperfect behaviour of real components, interconnections and circuits. Electronic circuit design can be divided into two areas: the first consists in designing a circuit that will fulfil its specified function; the second consists in designing the same circuit so that every production model of it will fulfil its specified function reliably over its lifetime. Designers who can appreciate the techniques and tools used in the latter area are becoming increasingly rare. The aim of this guide is to help such people. The subjects covered include grounding, printed circuit design and layout, the characteristics of practical active and passive components, cables, linear ICs, logic circuits and their interfaces, power supplies, electromagnetic compatibility, safety and thermal management. Throughout, the implications of manufacturability and cost are stressed. The style is direct and lucid, providing straightforward practical advice. This is the ideal guide to real world design for both students and practitioners.
Fundamentals Of Lead Free Solder Interconnect Technology
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Author : Tae-Kyu Lee
language : en
Publisher: Springer
Release Date : 2014-11-05
Fundamentals Of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-05 with Technology & Engineering categories.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Lead Free Solder Interconnect Reliability
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Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005
Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.