Ulsi Front End Technology
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Ulsi Front End Technology Covering From The First Semiconductor Paper To Cmos Finfet Technology
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Author : Wai Shing Lau
language : en
Publisher: World Scientific
Release Date : 2017-08-23
Ulsi Front End Technology Covering From The First Semiconductor Paper To Cmos Finfet Technology written by Wai Shing Lau and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-08-23 with Technology & Engineering categories.
The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.
Ulsi Front End Technology
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Author : Lau Wai Shing
language : en
Publisher:
Release Date : 2017
Ulsi Front End Technology written by Lau Wai Shing and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with Integrated circuits categories.
"The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book."--Publisher's website.
Ulsi Front End Technology Covering From The First Scientific Paper On Semiconductor To State Of The Art Cmos Finfet Technology
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Author : Wai Shing Lau
language : en
Publisher: World Scientific Publishing Company
Release Date : 2017-06-29
Ulsi Front End Technology Covering From The First Scientific Paper On Semiconductor To State Of The Art Cmos Finfet Technology written by Wai Shing Lau and has been published by World Scientific Publishing Company this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-06-29 with Technology & Engineering categories.
This collection of essays documents and investigates the conflicts in the European, Russia and China that sparked populist revolts against the established globalist order in the European Union. It shows that the populist surge was not an anomaly. It was a
Ulsi Semiconductor Technology Atlas
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Author : Chih-Hang Tung
language : en
Publisher: John Wiley & Sons
Release Date : 2003-10-06
Ulsi Semiconductor Technology Atlas written by Chih-Hang Tung and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-10-06 with Technology & Engineering categories.
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
Green Energy
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Author : Suman Lata Tripathi
language : en
Publisher: John Wiley & Sons
Release Date : 2021-02-17
Green Energy written by Suman Lata Tripathi and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-02-17 with Science categories.
Like most industries around the world, the energy industry has also made, and continues to make, a long march toward “green” energy. The science has come a long way since the 1970s, and renewable energy and other green technologies are becoming more and more common, replacing fossil fuels. It is, however, still a struggle, both in terms of energy sources keeping up with demand, and the development of useful technologies in this area. To maintain the supply for electrical energy, researchers, engineers and other professionals in industry are continuously exploring new eco-friendly energy technologies and power electronics, such as solar, wind, tidal, wave, bioenergy, and fuel cells. These technologies have changed the concepts of thermal, hydro and nuclear energy resources by the adaption of power electronics advancement and revolutionary development in lower manufacturing cost for semiconductors with long time reliability. The latest developments in renewable resources have proved their potential to boost the economy of any country. Green energy technology has not only proved the concept of clean energy but also reduces the dependencies on fossil fuel for electricity generation through smart power electronics integration. Also, endless resources have more potential to cope with the requirements of smart building and smart city concepts. A valuable reference for engineers, scientists, chemists, and students, this volume is applicable to many different fields, across many different industries, at all levels. It is a must-have for any library.
Scientific Wet Process Technology For Innovative Lsi Fpd Manufacturing
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Author : Tadahiro Ohmi
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Scientific Wet Process Technology For Innovative Lsi Fpd Manufacturing written by Tadahiro Ohmi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Science categories.
As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.
Ulsi Process Integration Ii
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Author : Cor L. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Ulsi Process Integration Ii written by Cor L. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
Silicide Technology For Integrated Circuits
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Author : Institution of Electrical Engineers
language : en
Publisher: IET
Release Date : 2004-12-21
Silicide Technology For Integrated Circuits written by Institution of Electrical Engineers and has been published by IET this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-12-21 with Social Science categories.
This is the first book to provide guidance on the development and application of metal silicide technology as it emerges from the scientific to the prototype and manufacturing stages. Other key topics covered are fundamentals, present and future silicide technology for Si-based devices, and characterisation methods. Suitable for engineers and students in microelectronics.
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Ulsi Process Integration 6
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Author : C. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2009-09
Ulsi Process Integration 6 written by C. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09 with Science categories.
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).