Vlsi Planarization
DOWNLOAD
Download Vlsi Planarization PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Vlsi Planarization book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Vlsi Planarization
DOWNLOAD
Author : V.Z. Feinberg
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Vlsi Planarization written by V.Z. Feinberg and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
At the beginning we would like to introduce a refinement. The term 'VLSI planarization' means planarization of a circuit of VLSI, Le. the embedding of a VLSI circuit in the plane by different criteria such as the minimum number of connectors, the minimum total length of connectors, the minimum number of over-the-element routes, etc. A connector is designed to connect the broken sections of a net. It can be implemented in different ways depending on the technology. Connectors for a bipolar VLSI are implemented by diffused tun nels, for instance. By over-the-element route we shall mean a connection which intersects the enclosing rectangle of an element (or a cell). The possibility of the construction such connections during circuit planarization is reflected in element models and can be ensured, for example, by the availability of areas within the rectangles where connections may be routed. VLSI planarization is one of the basic stages (others will be discussed below) of the so called topological (in the mathematical sense) approach to VLSI design. This approach does not lie in the direction of the classical approach to automation of VLSI layout design. In the classical approach to computer aided design the placement and routing problems are solved successively. The topological approach, in contrast, allows one to solve both problems at the same time. This is achieved by constructing a planar embedding of a circuit and obtaining the proper VLSI layout on the basis of it.
Chemical Mechanical Planarization Of Microelectronic Materials
DOWNLOAD
Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 1997
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.
The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Advanced Cmos Process Technology
DOWNLOAD
Author : J Pimbley
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Advanced Cmos Process Technology written by J Pimbley and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
Advanced CMOS Process Technology is part of the VLSI Electronics Microstructure Science series. The main topic of this book is complementary metal-oxide semiconductor or CMOS technology, which plays a significant part in the electronics systems. The topics covered in this book range from metallization, isolation techniques, reliability, and yield. The volume begins with an introductory chapter that discusses the microelectronics revolution of the 20th century. Then Chapter 2 puts focus on the CMOS devices and circuit background, discussing CMOS capacitors and field effect transistors. Metallization topics and concepts are covered in Chapter 3, while isolation techniques are tackled in Chapter 4. Long-term reliability of CMOS is the topic covered in Chapter 5. Finally, the ability of semiconductor technology to yield circuits is discussed in Chapter 6. The book is particularly addressed to engineers, scientists, and technical managers.
Microelectronic Materials And Processes
DOWNLOAD
Author : R.A. Levy
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronic Materials And Processes written by R.A. Levy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Vlsi Planarization
DOWNLOAD
Author : V.Z. Feinberg
language : en
Publisher: Springer
Release Date : 2012-10-13
Vlsi Planarization written by V.Z. Feinberg and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-10-13 with Technology & Engineering categories.
At the beginning we would like to introduce a refinement. The term 'VLSI planarization' means planarization of a circuit of VLSI, Le. the embedding of a VLSI circuit in the plane by different criteria such as the minimum number of connectors, the minimum total length of connectors, the minimum number of over-the-element routes, etc. A connector is designed to connect the broken sections of a net. It can be implemented in different ways depending on the technology. Connectors for a bipolar VLSI are implemented by diffused tun nels, for instance. By over-the-element route we shall mean a connection which intersects the enclosing rectangle of an element (or a cell). The possibility of the construction such connections during circuit planarization is reflected in element models and can be ensured, for example, by the availability of areas within the rectangles where connections may be routed. VLSI planarization is one of the basic stages (others will be discussed below) of the so called topological (in the mathematical sense) approach to VLSI design. This approach does not lie in the direction of the classical approach to automation of VLSI layout design. In the classical approach to computer aided design the placement and routing problems are solved successively. The topological approach, in contrast, allows one to solve both problems at the same time. This is achieved by constructing a planar embedding of a circuit and obtaining the proper VLSI layout on the basis of it.
Proceedings Of The Symposium On Electromigration Of Metals And First International Symposium On Multilevel Metallization And Packaging
DOWNLOAD
Author : James R. Lloyd
language : en
Publisher:
Release Date : 1985
Proceedings Of The Symposium On Electromigration Of Metals And First International Symposium On Multilevel Metallization And Packaging written by James R. Lloyd and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with Electrodiffusion categories.
Spectral Logic And Its Applications For The Design Of Digital Devices
DOWNLOAD
Author : Mark G. Karpovsky
language : en
Publisher: John Wiley & Sons
Release Date : 2008-07-14
Spectral Logic And Its Applications For The Design Of Digital Devices written by Mark G. Karpovsky and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-07-14 with Computers categories.
Spectral techniques facilitate the design and testing of today's increasingly complex digital devices There is heightened interest in spectral techniques for the design of digital devices dictated by ever increasing demands on technology that often cannot be met by classical approaches. Spectral methods provide a uniform and consistent theoretic environment for recent achievements in this area, which appear divergent in many other approaches. Spectral Logic and Its Applications for the Design of Digital Devices gives readers a foundation for further exploration of abstract harmonic analysis over finite groups in the analysis, design, and testing of digital devices. After an introduction, this book provides the essential mathematical background for discussing spectral methods. It then delves into spectral logic and its applications, covering: * Walsh, Haar, arithmetic transform, Reed-Muller transform for binary-valued functions and Vilenkin-Chrestenson transform, generalized Haar, and other related transforms for multiple-valued functions * Polynomial expressions and decision diagram representations for switching and multiple-value functions * Spectral analysis of Boolean functions * Spectral synthesis and optimization of combinational and sequential devices * Spectral methods in analysis and synthesis of reliable devices * Spectral techniques for testing computer hardware This is the authoritative reference for computer science and engineering professionals and researchers with an interest in spectral methods of representing discrete functions and related applications in the design and testing of digital devices. It is also an excellent text for graduate students in courses covering spectral logic and its applications.
Advances In Chemical Mechanical Planarization Cmp
DOWNLOAD
Author : Babu Suryadevara
language : en
Publisher: Woodhead Publishing
Release Date : 2021-09-10
Advances In Chemical Mechanical Planarization Cmp written by Babu Suryadevara and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-10 with Technology & Engineering categories.
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
High Performance Polymer
DOWNLOAD
Author : Guy Rabilloud
language : en
Publisher: Editions OPHRYS
Release Date :
High Performance Polymer written by Guy Rabilloud and has been published by Editions OPHRYS this book supported file pdf, txt, epub, kindle and other format this book has been release on with Medical categories.
&Quot;This is a general reference book for materials scientists, polymer chemists, manufacturers of electronic and optoelectronic devices, and process engineers. It is also a textbook for libraries of major chemical and semiconductor companies, research institutions, government laboratories and universities."--BOOK JACKET.
Regularization Of Ill Posed Problems By Iteration Methods
DOWNLOAD
Author : S.F. Gilyazov
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-04-17
Regularization Of Ill Posed Problems By Iteration Methods written by S.F. Gilyazov and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-04-17 with Mathematics categories.
Iteration regularization, i.e., utilization of iteration methods of any form for the stable approximate solution of ill-posed problems, is one of the most important but still insufficiently developed topics of the new theory of ill-posed problems. In this monograph, a general approach to the justification of iteration regulari zation algorithms is developed, which allows us to consider linear and nonlinear methods from unified positions. Regularization algorithms are the 'classical' iterative methods (steepest descent methods, conjugate direction methods, gradient projection methods, etc.) complemented by the stopping rule depending on level of errors in input data. They are investigated for solving linear and nonlinear operator equations in Hilbert spaces. Great attention is given to the choice of iteration index as the regularization parameter and to estimates of errors of approximate solutions. Stabilizing properties such as smoothness and shape constraints imposed on the solution are used. On the basis of these investigations, we propose and establish efficient regularization algorithms for stable numerical solution of a wide class of ill-posed problems. In particular, descriptive regularization algorithms, utilizing a priori information about the qualitative behavior of the sought solution and ensuring a substantial saving in computational costs, are considered for model and applied problems in nonlinear thermophysics. The results of calculations for important applications in various technical fields (a continuous casting, the treatment of materials and perfection of heat-protective systems using laser and composite technologies) are given.