Wafer Scale Integration 3
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Wafer Scale Integration
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Author : Earl E. Swartzlander Jr.
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Wafer Scale Integration written by Earl E. Swartzlander Jr. and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Wafer Level Integrated Systems
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Author : Stuart K. Tewksbury
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Wafer Level Integrated Systems written by Stuart K. Tewksbury and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
Wafer Level 3 D Ics Process Technology
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Author : Chuan Seng Tan
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-06-29
Wafer Level 3 D Ics Process Technology written by Chuan Seng Tan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-06-29 with Technology & Engineering categories.
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Third Caltech Conference On Very Large Scale Integration
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Author : R. Bryant
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Third Caltech Conference On Very Large Scale Integration written by R. Bryant and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The papers in this book were presented at the Third Caltech Conference on Very Large Scale Integration, held March 21-23, 1983 in Pasadena, California. The conference was organized by the Computer Science Depart ment, California Institute of Technology, and was partly supported by the Caltech Silicon Structures Project. This conference focused on the role of systematic methodologies, theoretical models, and algorithms in all phases of the design, verification, and testing of very large scale integrated circuits. The need for such disciplines has arisen as a result of the rapid progress of integrated circuit technology over the past 10 years. This progress has been driven largely by the fabrica tion technology, providing the capability to manufacture very complex elec tronic systems reliably and at low cost. At this point the capability to manufac ture very large scale integrated circuits has exceeded our capability to develop new product designs quickly, reliably, and at a reasonable cost. As a result new designs are undertaken only if the production volume will be large enough to amortize high design costs, products first appear on the market well past their announced delivery date, and reference manuals must be amended to document design flaws. Recent research in universities and in private industry has created an emerg ing science of very large scale integration.
Seventh Annual Ieee International Conference On Wafer Scale Integration San Francisco California Usa
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Author : Glenn Chapman
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 1995
Seventh Annual Ieee International Conference On Wafer Scale Integration San Francisco California Usa written by Glenn Chapman and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Technology & Engineering categories.
Wafer Level Chip Scale Packaging
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Author : Shichun Qu
language : en
Publisher: Springer
Release Date : 2014-09-10
Wafer Level Chip Scale Packaging written by Shichun Qu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-09-10 with Technology & Engineering categories.
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Soft Configurable Wafer Scale Integration
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Author : M. G. Blatt
language : en
Publisher:
Release Date : 1990
Soft Configurable Wafer Scale Integration written by M. G. Blatt and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Fault-tolerant computing categories.
The redundancy models constrain wafer yield by system requirements such as the minimum number of working circuit units, and whether these working units are distributed evenly around the wafer. Choice of redundancy model significantly affects the resulting wafer yield."
Wafer Scale Integration 3
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Author :
language : en
Publisher:
Release Date : 1989
Wafer Scale Integration 3 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with categories.
Wafer Scale Integration Ii
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Author : R. M. Lea
language : en
Publisher: North Holland
Release Date : 1988
Wafer Scale Integration Ii written by R. M. Lea and has been published by North Holland this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Computers categories.
Innc 90 Paris
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Author : The International Neural Society(INNS), The IEEE Neural
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-12-18
Innc 90 Paris written by The International Neural Society(INNS), The IEEE Neural and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-18 with Computers categories.
Neural Networks have been the theater of a dramatic increase of activities in the last five years. The interest of mixing results from fields as different as neurobiology, physics (spin glass theory), mathematics (linear algebra, statistics ... ), computer science (software engineering, hardware architectures ... ) or psychology has attracted a large number of researchers to the field. The perspective of dramatic improvements in many applications has lead important companies to launch new neural network programs and start-ups have mushroomed to address this new market. Throughout the world large programs are being set-up: in Japan the government has committed more than $18 million per year to its 20 year Human Frontier Science program; the DARPA and the US Navy have alloted more than $10 million per year each and other US government agencies are contributing to important but less ambitious programs. Neural networks are also a major research are in the supercomputing initiative. Europe has from the beginning taken an active part in funding major projects in the new field with BRAIN, BRA, ANNIE and PYGMALION (Esprit). Approximately $20 million has been invested to date since 1988 and new programs of nearly $30 million are being funded for the next 3 years. National projects in certain countries may globally double these amounts. Neural network conferences are attracting larger audiences than ever before. Prior to 1987 attendance never surpassed 300. The June 1989 IJCNN conference in Washington had over 2200 participants.