Wafer Scale Integration Ii
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Wafer Scale Integration Ii
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Author : R. M. Lea
language : en
Publisher: North Holland
Release Date : 1988
Wafer Scale Integration Ii written by R. M. Lea and has been published by North Holland this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Computers categories.
Wafer Scale Integration 2
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Author :
language : en
Publisher:
Release Date : 1987
Wafer Scale Integration 2 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with categories.
Wafer Level 3 D Ics Process Technology
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Author : Chuan Seng Tan
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-06-29
Wafer Level 3 D Ics Process Technology written by Chuan Seng Tan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-06-29 with Technology & Engineering categories.
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Wafer Scale Integration
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Author : Earl E. Swartzlander Jr.
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Wafer Scale Integration written by Earl E. Swartzlander Jr. and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Wafer Level Chip Scale Packaging
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Author : Shichun Qu
language : en
Publisher: Springer
Release Date : 2014-09-10
Wafer Level Chip Scale Packaging written by Shichun Qu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-09-10 with Technology & Engineering categories.
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Computer Arithmetic
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Author : Earl E Swartzlander
language : en
Publisher: World Scientific
Release Date : 2015-03-17
Computer Arithmetic written by Earl E Swartzlander and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-03-17 with Mathematics categories.
This is the new edition of the classic book Computer Arithmetic in three volumes published originally in 1990 by IEEE Computer Society Press. As in the original, the book contains many classic papers treating advanced concepts in computer arithmetic, which is very suitable as stand-alone textbooks or complementary materials to textbooks on computer arithmetic for graduate students and research professionals interested in the field. Told in the words of the initial developers, this book conveys the excitement of the creators, and the implementations provide insight into the details necessary to realize real chips. This second volume presents topics on error tolerant arithmetic, digit on-line arithmetic, number systems, and now in this new edition, a topic on implementations of arithmetic operations, all wrapped with an updated overview and a new introduction for each chapter. This volume is part of a 3 volume set: Computer Arithmetic Volume I Computer Arithmetic Volume II Computer Arithmetic Volume III The full set is available for sale in a print-only version. Contents:Error Tolerant ArithmeticOn-Line ArithmeticVLSI Adder ImplementationsVLSI Multiplier ImplementationsFloating-Point VLSI ChipsNumber RepresentationImplementations Readership: Graduate students and research professionals interested in computer arithmetic. Key Features:It reprints the classic papersIt covers advanced arithmetic operationsIt does this in the words of the original creatorsKeywords:Computer Arithmetic;Fault Tolerant;Arithmetic;On-Line Arithmetic;Adder Implementations;Multiplier Implementations;Floating Point Chips;Number Representation;Implementations
Wafer Scale Integration
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Author : C. R. Jesshope
language : en
Publisher: CRC Press
Release Date : 1986
Wafer Scale Integration written by C. R. Jesshope and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1986 with Art categories.
This book, the first to deal wholly with the topic of wafer scale integration, is the edited proceedings of a workshop held at the University of Southampton in July 1985. As the first international meeting held on this subject it attracted many participants from Europe and the United States. The meeting was particularly timely as there has recently been a renewed interest in research and commercial exploitation of wafer scale integration. The papers presented in the book cover the whole range of topics important in wafer scale integration, beginning with a critical review of fault-tolerant chips and wafer scale integration. Sections on general problems and interconnection strategies follow. There are then six papaers on architectures and four on restructurable very large scale integration. The book concludes with three reviews of different aspects of testability.
Wafer Level Integrated Systems
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Author : Stuart K. Tewksbury
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Wafer Level Integrated Systems written by Stuart K. Tewksbury and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
Parallel Computers 2
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Author : R.W Hockney
language : en
Publisher: CRC Press
Release Date : 2019-08-16
Parallel Computers 2 written by R.W Hockney and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-16 with Mathematics categories.
Since the publication of the first edition, parallel computing technology has gained considerable momentum. A large proportion of this has come from the improvement in VLSI techniques, offering one to two orders of magnitude more devices than previously possible. A second contributing factor in the fast development of the subject is commercialization. The supercomputer is no longer restricted to a few well-established research institutions and large companies. A new computer breed combining the architectural advantages of the supercomputer with the advance of VLSI technology is now available at very attractive prices. A pioneering device in this development is the transputer, a VLSI processor specifically designed to operate in large concurrent systems. Parallel Computers 2: Architecture, Programming and Algorithms reflects the shift in emphasis of parallel computing and tracks the development of supercomputers in the years since the first edition was published. It looks at large-scale parallelism as found in transputer ensembles. This extensively rewritten second edition includes major new sections on the transputer and the OCCAM language. The book contains specific information on the various types of machines available, details of computer architecture and technologies, and descriptions of programming languages and algorithms. Aimed at an advanced undergraduate and postgraduate level, this handbook is also useful for research workers, machine designers, and programmers concerned with parallel computers. In addition, it will serve as a guide for potential parallel computer users, especially in disciplines where large amounts of computer time are regularly used.
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.