Yield Reliability Modeling For Integrated Circuits
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Yield Reliability Modeling For Integrated Circuits
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Author : Thomas S. Barnett
language : en
Publisher:
Release Date : 2002
Yield Reliability Modeling For Integrated Circuits written by Thomas S. Barnett and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Integrated circuits categories.
Reliability Yield Allocation For Semiconductor Integrated Circuits
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Author : Chunghun Ha
language : en
Publisher:
Release Date : 2005
Reliability Yield Allocation For Semiconductor Integrated Circuits written by Chunghun Ha and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with categories.
This research develops yield and reliability models for fault-tolerant semiconductor integrated circuits and develops optimization algorithms that can be directly applied to these models. Since defects cause failures in microelectronics systems, accurate yield and reliability models considering these defects as well as optimization techniques determining efficient defect-tolerant schemes are essential in semiconductor manufacturing and nanomanufacturing to ensure manufacturability and productivity. The defect-based yield model considers various types of failures, fault-tolerant schemes such as hierarchical redundancy and error correcting code, and burn-in effects, simultaneously. The reliability model counts on carry-over single-cell failures accompanied by the failure rate of the semiconductor integrated circuits under the assumption of an error correcting code policy. The redundancy allocation problem, which seeks to find an optimal allocation of redundancy that maximizes system reliability, is one of the representative problems in reliability optimization. The problem is typically formulated as a nonconvex integer nonlinear programming problem that is nonseparable and coherent. Two iterative heuristics, tree and scanning heuristics, and variants are studied to obtain local optima and a branch-and-bound algorithm is proposed to find the global optimum for redundancy allocation problems. The proposed algorithms engage a multiple-search paths strategy to accelerate efficiency. Experimental results of these algorithms indicate that they are superior to the existing algorithms in terms of computation time and solution quality. An example of memory semiconductor integrated circuits is presented to show the applicability of both the yield and reliability models and the optimization algorithms to fault-tolerant semiconductor integrated circuits.
Reliability Yield And Stress Burn In
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Author : Way Kuo
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Reliability Yield And Stress Burn In written by Way Kuo and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
Guidebook For Managing Silicon Chip Reliability
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2017-11-22
Guidebook For Managing Silicon Chip Reliability written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-11-22 with Technology & Engineering categories.
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Lifetime Reliability Aware Design Of Integrated Circuits
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Author : Mohsen Raji
language : en
Publisher: Springer Nature
Release Date : 2022-11-16
Lifetime Reliability Aware Design Of Integrated Circuits written by Mohsen Raji and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-16 with Technology & Engineering categories.
This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Modeling Of Integrated Circuit Interconnect Dielectric Reliability Based On The Physical Design Characteristics
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Author : Changsoo Hong
language : en
Publisher:
Release Date : 2006
Modeling Of Integrated Circuit Interconnect Dielectric Reliability Based On The Physical Design Characteristics written by Changsoo Hong and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.
These characteristics include such factors as layout geometry, pattern density, pattern orientation, and via placement. The physical breakdown mechanism for porous back-end dielectric films is also to be investigated using Monte Carlo simulation. It is shown that the electric field is enhanced by porosity in ultra-low-k dielectric films. The electric field enhancement caused by the porosity is shown to accelerate the charge transport.
Springer Handbook Of Engineering Statistics
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Author : Hoang Pham
language : en
Publisher: Springer Science & Business Media
Release Date : 2006
Springer Handbook Of Engineering Statistics written by Hoang Pham and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Business & Economics categories.
In today’s global and highly competitive environment, continuous improvement in the processes and products of any field of engineering is essential for survival. This book gathers together the full range of statistical techniques required by engineers from all fields. It will assist them to gain sensible statistical feedback on how their processes or products are functioning and to give them realistic predictions of how these could be improved. The handbook will be essential reading for all engineers and engineering-connected managers who are serious about keeping their methods and products at the cutting edge of quality and competitiveness.
El W T De Abt Mt Lp T Aks De Edt S Rj Jt De Ant J K Tr At Ub
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Author :
language : en
Publisher:
Release Date : 1982
El W T De Abt Mt Lp T Aks De Edt S Rj Jt De Ant J K Tr At Ub written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1982 with categories.
Yield Simulation For Integrated Circuits
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Author : D.M. Walker
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-04-17
Yield Simulation For Integrated Circuits written by D.M. Walker and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-04-17 with Computers categories.
In the summer of 1981 I was asked to consider the possibility of manufacturing a 600,000 transistor microprocessor in 1985. It was clear that the technology would only be capable of manufacturing 100,000-200,000 transistor chips with acceptable yields. The control store ROM occupied approximately half of the chip area, so I considered adding spare rows and columns to increase ROM yield. Laser-programmed polysilicon fuses would be used to switch between good and bad circuits. Since only half the chip area would have redundancy, I was concerned that the increase in yield would not outweigh the increased costs of testing and redundancy programming. The fabrication technology did not yet exist, so I was unable to experimentally verify the benefits of redundancy. When the technology did become available, it would be too late in the development schedule to spend time running test chips. The yield analysis had to be done analytically or by simulation. Analytic yield analysis techniques did not offer sufficient accuracy for dealing with complex structures. The simulation techniques then available were very labor-intensive and seemed more suitable for redundant memories and other very regular structures [Stapper 80J. I wanted a simulator that would allow me to evaluate the yield of arbitrary redundant layouts, hence I termed such a simulator a layout or yield simulator. Since I was unable to convince anyone to build such a simulator for me, I embarked on the research myself.
New Methodologies For Interconnect Reliability Assessments Of Integrated Circuits
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Author : Stefan Peter Hau-Riege
language : en
Publisher:
Release Date : 2000
New Methodologies For Interconnect Reliability Assessments Of Integrated Circuits written by Stefan Peter Hau-Riege and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with categories.