3d Integration For Noc Based Soc Architectures
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3d Integration For Noc Based Soc Architectures
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Author : Abbas Sheibanyrad
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-11-08
3d Integration For Noc Based Soc Architectures written by Abbas Sheibanyrad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-08 with Technology & Engineering categories.
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Designing 2d And 3d Network On Chip Architectures
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Author : Konstantinos Tatas
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-08
Designing 2d And 3d Network On Chip Architectures written by Konstantinos Tatas and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-08 with Technology & Engineering categories.
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
3d Interconnect Architectures For Heterogeneous Technologies
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Author : Lennart Bamberg
language : en
Publisher: Springer Nature
Release Date : 2022-06-27
3d Interconnect Architectures For Heterogeneous Technologies written by Lennart Bamberg and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-06-27 with Technology & Engineering categories.
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Network On Chip
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Author : Santanu Kundu
language : en
Publisher: CRC Press
Release Date : 2018-09-03
Network On Chip written by Santanu Kundu and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.
Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-05-06
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-06 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Design And Test Strategies For 2d 3d Integration For Noc Based Multicore Architectures
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Author : Kanchan Manna
language : en
Publisher: Springer Nature
Release Date : 2019-12-20
Design And Test Strategies For 2d 3d Integration For Noc Based Multicore Architectures written by Kanchan Manna and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-20 with Technology & Engineering categories.
This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications. Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems; Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems; Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-25
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-25 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Architecture And Physical Design For Advanced Networks On Chip
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Author : Woo Young Jang
language : en
Publisher:
Release Date : 2011
Architecture And Physical Design For Advanced Networks On Chip written by Woo Young Jang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
The aggressive scaling of the semiconductor technology following the Moore's Law has delivered true system-on-chip (SoC) integration. Network-on-chip (NoC) has been recently introduced as an effective solution for scalable on-chip communication since dedicated point-to-point (P2P) interconnection and shared bus architecture become performance and power bottlenecks in the SoCs. This dissertation studies three critical NoC challenges such as latency, power, and compatibility with emerging technologies in aspect of an architecture and physical design level. Latency is a key issue in NoC since the performance of applications considerably depends on resource sharing policies employed in an on-chip network. NoCs have been mainly developed to improve network-level performance that captures the inherent performance characteristics of a network itself, but the network-level optimizations are not directly related to application- or system-level performance. In addition, memory latency on NoC critically affects the performance of applications or systems. We propose a synchronous dynamic random access memory (SDRAM) aware NoC design to optimize memory throughput, latency, and design complexity. Furthermore, it is extended to an application-aware NoC design to provide the quality-of-service (QoS) of memory for various applications. NoC provides great on-chip communication. However, it brings no true relief to power budget when the on-chip network scales in terms of complexity/size and signal bandwidth. The combination of NoC and other techniques has the potential to reduce power. We study two power saving research topics for NoC: (a) we propose a voltage-frequency island (VFI) aware NoC optimization framework with a better tradeoff between power efficiency and design complexity to minimize both computation and on-chip communication power. (b) We formulate an application mapping problem to mixed integer quadratic programming (MIQP) with the purpose of reducing power consumption in various hard networks and develop highly efficient algorithms for the MIQP. Regarding NoC compatible with new technologies, we focus on three dimensional (3D) die integration based on through-silicon vias (TSVs). Since an on-chip network design has been subject to not only application constraints but also design/manufacturing constraints, a 3D NoC design is required for innovation in interconnection networks. We propose a chemical-mechanical polishing (CMP) aware application-specific 3D NoC design that minimizes TSV height variation, thus reduces bonding failure, and meanwhile optimizes conventional NoC design objectives such as hop count, wirelength, power, and area.
Wireless Interface Technologies For 3d Ic And Module Integration
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Author : Tadahiro Kuroda
language : en
Publisher: Cambridge University Press
Release Date : 2021-09-30
Wireless Interface Technologies For 3d Ic And Module Integration written by Tadahiro Kuroda and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-30 with Technology & Engineering categories.
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Networks On Chips
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Author : Fayez Gebali
language : en
Publisher: CRC Press
Release Date : 2011-06-03
Networks On Chips written by Fayez Gebali and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-03 with Technology & Engineering categories.
The implementation of networks-on-chip (NoC) technology in VLSI integration presents a variety of unique challenges. To deal with specific design solutions and research hurdles related to intra-chip data exchange, engineers are challenged to invoke a wide range of disciplines and specializations while maintaining a focused approach. Leading Researchers Present Cutting-Edge Designs Tools Networks-on-Chips: Theory and Practice facilitates this process, detailing the NoC paradigm and its benefits in separating IP design and functionality from chip communication requirements and interfacing. It starts with an analysis of 3-D NoC architectures and progresses to a discussion of NoC resource allocation, processor traffic modeling, and formal verification, with an examination of protocols at different layers of abstraction. An exploration of design methodologies, CAD tool development, and system testing, as well as communication protocol, the text highlights important emerging research issues, such as Resource Allocation for Quality of Service (QoS) on-chip communication Testing, verification, and network design methodologies Architectures for interconnection, real-time monitoring, and security requirements Networks-on-Chip Protocols Presents a flexible MPSoC platform to easily implement multimedia applications and evaluate future video encoding standards This useful guide tackles power and energy issues in NoC-based designs, addressing the power constraints that currently limit the embedding of more processing elements on a single chip. It covers traffic modeling and discusses the details of traffic generators. Using unique case studies and examples, it covers theoretical and practical issues, guiding readers through every phase of system design.
