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Advanced Materials For Ulsi


Advanced Materials For Ulsi
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Advanced Materials For Ulsi


Advanced Materials For Ulsi
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Author : Martin P. Scott
language : en
Publisher:
Release Date : 1988

Advanced Materials For Ulsi written by Martin P. Scott and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with categories.




Advanced Materials For Ulsi


Advanced Materials For Ulsi
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Author : Martin Scott
language : en
Publisher:
Release Date : 1988

Advanced Materials For Ulsi written by Martin Scott and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with categories.




Advanced Materials For Ulsi


Advanced Materials For Ulsi
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Author : Electrochemical Society. Electronics, Dielectrics and Insulation, and High Temperature Materials Divisions
language : en
Publisher:
Release Date : 1988

Advanced Materials For Ulsi written by Electrochemical Society. Electronics, Dielectrics and Insulation, and High Temperature Materials Divisions and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with categories.




Advanced Interconnects For Ulsi Technology


Advanced Interconnects For Ulsi Technology
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-17

Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-17 with Technology & Engineering categories.


Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.



Proceedings Of The First International Symposium On Advanced Materials For Ulsi


Proceedings Of The First International Symposium On Advanced Materials For Ulsi
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Author : Martin P. Scott
language : en
Publisher:
Release Date : 1988

Proceedings Of The First International Symposium On Advanced Materials For Ulsi written by Martin P. Scott and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Integrated circuits categories.




Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications


Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19

Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.


In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.



Ulsi Semiconductor Technology Atlas


Ulsi Semiconductor Technology Atlas
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Author : Chih-Hang Tung
language : en
Publisher: John Wiley & Sons
Release Date : 2003-10-06

Ulsi Semiconductor Technology Atlas written by Chih-Hang Tung and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-10-06 with Technology & Engineering categories.


More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs



Advanced Metallization For Future Ulsi Volume 427


Advanced Metallization For Future Ulsi Volume 427
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 1996-11-08

Advanced Metallization For Future Ulsi Volume 427 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-11-08 with Computers categories.


The feature sizes of microelectronic devices have entered the deep submicron regime. The process integration and structure-properties control of the multilevel metal circuitry demand an interdisciplinary interaction and understanding between manufacturing and research. To realize the vision presented in the national technology road map, material and technological challenges will need to be overcome. For example Cu conductor and its barrier metals and low-dielectric constant insulators are at issue. For materials processing, chemical-mechanical planarization and low-temperature filling of high-aspect ratio vias are challenges. For materials examination, the metrology of submicron structures is nontrivial and for materials reliability, the interplay among multiple driving forces and the response in small-dimension microstructures are intriguing. These issues are the focus of this book from MRS. Topics include: road map, technology and metrology of submicron device structures; reliability issues for Cu metallization; Al interconnects and vias; barrier metal; interlevel low-K dielectrics and contact to Si and compound semiconductors.



Advanced X Ray Characterization Of Ulsi Materials


Advanced X Ray Characterization Of Ulsi Materials
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Author : Anival Ayala
language : en
Publisher:
Release Date : 2000

Advanced X Ray Characterization Of Ulsi Materials written by Anival Ayala and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Integrated circuits categories.




Advanced Metallization For Ulsi Applications


Advanced Metallization For Ulsi Applications
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Author :
language : en
Publisher:
Release Date : 1992

Advanced Metallization For Ulsi Applications written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Electrochemical metallizing categories.