Advanced Metallization Conference 2002 Amc 2002
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Advanced Metallization Conference In
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Author :
language : en
Publisher:
Release Date : 2007
Advanced Metallization Conference In written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Integrated circuits categories.
Advanced Metallization Conference 2002 Amc 2002
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Author :
language : en
Publisher:
Release Date : 2003
Advanced Metallization Conference 2002 Amc 2002 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Integrated circuits categories.
Advanced Metallization Conference 2004 Amc 2004
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Author : Darrell Erb
language : en
Publisher:
Release Date : 2005
Advanced Metallization Conference 2004 Amc 2004 written by Darrell Erb and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
Semiconductor Wafer Bonding Vii Science Technology And Applications
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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Semiconductor Wafer Bonding Vii Science Technology And Applications written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Advanced Metallization Conference 2002 Amc 2002
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Author : Bradley M. Melnick
language : en
Publisher: Materials Research Society
Release Date : 2003-01-01
Advanced Metallization Conference 2002 Amc 2002 written by Bradley M. Melnick and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-01-01 with Technology & Engineering categories.
Leading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.
Atomic Layer Deposition For Semiconductors
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Author : Cheol Seong Hwang
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-18
Atomic Layer Deposition For Semiconductors written by Cheol Seong Hwang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-18 with Science categories.
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Dielectrics For Nanosystems
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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2004
Dielectrics For Nanosystems written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Dielectrics categories.
Design Of 3d Integrated Circuits And Systems
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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03
Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Thin Film Materials Processes And Reliability
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Author : G. S. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Thin Film Materials Processes And Reliability written by G. S. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Electromigration In Metals
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Author : Paul S. Ho
language : en
Publisher: Cambridge University Press
Release Date : 2022-05-12
Electromigration In Metals written by Paul S. Ho and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-12 with Technology & Engineering categories.
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.