Advanced Metallization For Ulsi Applications In 1993
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Handbook Of Semiconductor Manufacturing Technology
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Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Advanced Metallization For Ulsi Applications In 1993
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Author : David P. Favreau
language : en
Publisher: Materials Research Society
Release Date : 1994-02-01
Advanced Metallization For Ulsi Applications In 1993 written by David P. Favreau and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-02-01 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Proceedings Of The Symposium On Interconnect And Contact Metallization
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Author : Harzara S. Rathore
language : en
Publisher: The Electrochemical Society
Release Date : 1998
Proceedings Of The Symposium On Interconnect And Contact Metallization written by Harzara S. Rathore and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Computers categories.
Advanced Metallization For Devices And Circuits Science Technology And Manufacturability
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Author : S. P. Murarka
language : en
Publisher:
Release Date : 1994
Advanced Metallization For Devices And Circuits Science Technology And Manufacturability written by S. P. Murarka and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Technology & Engineering categories.
Handbook Of Semiconductor Interconnection Technology
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Author : Geraldine Cogin Shwartz
language : en
Publisher: CRC Press
Release Date : 2006-02-22
Handbook Of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-22 with Technology & Engineering categories.
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Handbook Of Advanced Plasma Processing Techniques
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Author : R.J. Shul
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
Handbook Of Advanced Plasma Processing Techniques written by R.J. Shul and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Metallurgical Coatings And Thin Films 1993
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Author :
language : en
Publisher:
Release Date : 1993
Metallurgical Coatings And Thin Films 1993 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Corrosion and anti-corrosives categories.
Proceedings Of The Tenth Symposium On Plasma Processing
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Author : Electrochemical Society. Dielectric Science and Technology Division
language : en
Publisher: The Electrochemical Society
Release Date : 1994
Proceedings Of The Tenth Symposium On Plasma Processing written by Electrochemical Society. Dielectric Science and Technology Division and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Science categories.
Proceedings Of The Symposium Om Process Control Diagnostics And Modeling In Semiconductor Manufacturing
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Author : M. Meyyappan
language : en
Publisher: The Electrochemical Society
Release Date : 1995
Proceedings Of The Symposium Om Process Control Diagnostics And Modeling In Semiconductor Manufacturing written by M. Meyyappan and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Technology & Engineering categories.
Chemical Mechanical Planarization Of Microelectronic Materials
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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 2008-09-26
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-09-26 with Science categories.
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.