Algorithms And Methodologies For Interconnect Reliability Analysis Of Integrated Circuits
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Algorithms And Methodologies For Interconnect Reliability Analysis Of Integrated Circuits
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Author : Palkesh Jain
language : ca
Publisher:
Release Date : 2017
Algorithms And Methodologies For Interconnect Reliability Analysis Of Integrated Circuits written by Palkesh Jain and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with categories.
The phenomenal progress of computing devices has been largely made possible by the sustained efforts of semiconductor industry in innovating techniques for extremely large-scale integration. Indeed, gigantically integrated circuits today contain multi-billion interconnects which enable the transistors to talk to each other -all in a space of few mm2. Such aggressively downscaled components (transistors and interconnects) silently suffer from increasing electric fields and impurities/defects during manufacturing. Compounded by the Gigahertz switching, the challenges of reliability and design integrity remains very much alive for chip designers, with Electro migration (EM) being the foremost interconnect reliability challenge. Traditionally, EM containment revolves around EM guidelines, generated at single-component level, whose non-compliance means that the component fails. Failure usually refers to deformation due to EM -manifested in form of resistance increase, which is unacceptable from circuit performance point of view. Subsequent aspects deal with correct-by-construct design of the chip followed by the signoff-verification of EM reliability. Interestingly, chip designs today have reached a dilemma point of reduced margin between the actual and reliably allowed current densities, versus, comparatively scarce system-failures. Consequently, this research is focused on improved algorithms and methodologies for interconnect reliability analysis enabling accurate and design-specific interpretation of EM events. In the first part, we present a new methodology for logic-IP (cell) internal EM verification: an inadequately attended area in the literature. Our SPICE-correlated model helps in evaluating the cell lifetime under any arbitrary reliability speciation, without generating additional data - unlike the traditional approaches. The model is apt for today's fab less eco-system, where there is a) increasing reuse of standard cells optimized for one market condition to another (e.g., wireless to automotive), as well as b) increasing 3rd party content on the chip requiring a rigorous sign-off. We present results from a 28nm production setup, demonstrating significant violations relaxation and flexibility to allow runtime level reliability retargeting. Subsequently, we focus on an important aspect of connecting the individual component-level failures to that of the system failure. We note that existing EM methodologies are based on serial reliability assumption, which deems the entire system to fail as soon as the first component in the system fails. With a highly redundant circuit topology, that of a clock grid, in perspective, we present algorithms for EM assessment, which allow us to incorporate and quantify the benefit from system redundancies. With the skew metric of clock-grid as a failure criterion, we demonstrate that unless such incorporations are done, chip lifetimes are underestimated by over 2x. This component-to-system reliability bridge is further extended through an extreme order statistics based approach, wherein, we demonstrate that system failures can be approximated by an asymptotic kth-component failure model, otherwise requiring costly Monte Carlo simulations. Using such approach, we can efficiently predict a system-criterion based time to failure within existing EDA frameworks. The last part of the research is related to incorporating the impact of global/local process variation on current densities as well as fundamental physical factors on EM. Through Hermite polynomial chaos based approach, we arrive at novel variations-aware current density models, which demonstrate significant margins (> 30 %) in EM lifetime when compared with the traditional worst case approach. The above research problems have been motivated by the decade-long work experience of the author dealing with reliability issues in industrial SoCs, first at Texas Instruments and later at Qualcomm.
Design Tool And Methodologies For Interconnect Reliability Analysis In Integrated Circuits
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Author : Syed Mohiul Alam
language : en
Publisher:
Release Date : 2004
Design Tool And Methodologies For Interconnect Reliability Analysis In Integrated Circuits written by Syed Mohiul Alam and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Total on-chip interconnect length has been increasing exponentially with technology scaling. Consequently, interconnect-driven design is an emerging trend in state-of-the- art integrated circuits. Cu-based interconnect technology is expected to meet some of the challenges of technology scaling. However, Cu interconnects still pose a reliability concern due to electromigration-induced failure over time. The major contribution of this thesis is a new reliability CAD tool, SysRel, for thermal-aware reliability analysis with either Al or Cu metallization technology in conventional and three-dimensional integrated circuits. An interconnect tree is the fundamental reliability unit for circuit-level reliability assessments for metallization schemes with fully-blocking boundaries at the vias. When vias do not block electromigration as indicated in some Cu experimental studies, multiple trees linked by a non-blocking via are merged to create a single fundamental reliability unit. SysRel utilizes a tree-based hierarchical analysis that sufficiently captures the differences between electromigration behavior in Al and Cu metallizations. The hierarchical flow first identifies electromigration-critical nets or "mortal" trees, applies a default model to estimate the lifetimes of individual trees, and then produces a set of full-chip reliability metrics based on stochastic analysis using the desired lifetime of the circuit. We have exercised SysRel to compare layout-specific reliability with Cu and Al metallizations in various circuits and circuit elements. Significantly improved test-level reliability in Cu is required to achieve equivalent circuit-level reliability. The required improvement will increase as low-k dielectric materials are introduced and liner thicknesses are reduced in future.
New Methodologies For Interconnect Reliability Assessments Of Integrated Circuits
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Author : Stefan Peter Hau-Riege
language : en
Publisher:
Release Date : 2000
New Methodologies For Interconnect Reliability Assessments Of Integrated Circuits written by Stefan Peter Hau-Riege and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with categories.
Interconnect Analysis And Synthesis
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Author : Chung-Kuan Cheng
language : en
Publisher: Wiley-Interscience
Release Date : 2000
Interconnect Analysis And Synthesis written by Chung-Kuan Cheng and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Computers categories.
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Interconnect Technologies For Integrated Circuits And Flexible Electronics
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Author : Yash Agrawal
language : en
Publisher: Springer Nature
Release Date : 2023-10-17
Interconnect Technologies For Integrated Circuits And Flexible Electronics written by Yash Agrawal and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-10-17 with Technology & Engineering categories.
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
New Methodologies For Interconnect Reliability Assessments Of Integrated Circuits
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Author :
language : en
Publisher:
Release Date : 2000
New Methodologies For Interconnect Reliability Assessments Of Integrated Circuits written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with categories.
By Stefan P. Hau-Riege.
Failure Analysis Of Integrated Circuits
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Author : Lawrence C. Wagner
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Failure Analysis Of Integrated Circuits written by Lawrence C. Wagner and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Design For High Performance Low Power And Reliable 3d Integrated Circuits
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Author : Sung Kyu Lim
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-11-27
Design For High Performance Low Power And Reliable 3d Integrated Circuits written by Sung Kyu Lim and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-11-27 with Technology & Engineering categories.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Integrated Circuit Quality And Reliability
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Author : Eugene R. Hnatek
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Integrated Circuit Quality And Reliability written by Eugene R. Hnatek and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Multi Net Optimization Of Vlsi Interconnect
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Author : Konstantin Moiseev
language : en
Publisher: Springer
Release Date : 2014-11-07
Multi Net Optimization Of Vlsi Interconnect written by Konstantin Moiseev and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-07 with Technology & Engineering categories.
This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.